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公开(公告)号：US20100022034A1
公开(公告)日：2010-01-28
申请号：US12220182
申请日：2008-07-22
IPC分类号： H01L21/50
CPC分类号： H05K3/3452 , H05K3/3457 , H05K2201/099 , H05K2203/0271 , H05K2203/162
摘要： Typical testing of solder joints, (e.g. joints at printed circuit board pads) has not proven totally predictive of the ultimate performance of such joints. It has been found that this lack of reliability is, at least in part, due to the tendency during testing for these pads to lose adhesion to, or delaminate from, the underlying substrate. In contrast, such occurrence is not typical of phenomena induced during typical device usage. To remove this source of unreliability, a test structure is made together with the manufacturing device lot. The same pad processing is used and the pad size is substantially enlarged in the test structure. The test structure is employed to predict performance of devices in the lot and then the lot is processed accordingly.
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公开(公告)号：US07727781B2
公开(公告)日：2010-06-01
申请号：US12220182
申请日：2008-07-22
CPC分类号： H05K3/3452 , H05K3/3457 , H05K2201/099 , H05K2203/0271 , H05K2203/162
摘要： Typical testing of solder joints, (e.g. joints at printed circuit board pads) has not proven totally predictive of the ultimate performance of such joints. It has been found that this lack of reliability is, at least in part, due to the tendency during testing for these pads to lose adhesion to, or delaminate from, the underlying substrate. In contrast, such occurrence is not typical of phenomena induced during typical device usage. To remove this source of unreliability, a test structure is made together with the manufacturing device lot. The same pad processing is used and the pad size is substantially enlarged in the test structure. The test structure is employed to predict performance of devices in the lot and then the lot is processed accordingly.
摘要翻译： 焊接接头（例如印刷电路板焊盘处的接头）的典型测试尚未被证明完全可以预测这种接头的最终性能。 已经发现，这种缺乏可靠性至少部分地是由于这些焊盘在测试期间失去与下面的衬底的粘附或分层的倾向。 相比之下，这种情况并不是典型的设备使用期间引起的现象。 为了消除这种不可靠性的原因，测试结构与制造设备批次一起进行。 使用相同的焊盘处理，并且焊盘尺寸在测试结构中大大扩大。 测试结构用于预测批次中的设备的性能，然后相应地处理批次。
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公开(公告)号：US20090098687A1
公开(公告)日：2009-04-16
申请号：US11973859
申请日：2007-10-10
IPC分类号： H01L21/603
CPC分类号： H01L24/85 , H01L24/05 , H01L24/28 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/83 , H01L2224/02166 , H01L2224/04042 , H01L2224/05009 , H01L2224/05073 , H01L2224/05556 , H01L2224/05558 , H01L2224/05624 , H01L2224/2919 , H01L2224/45015 , H01L2224/45144 , H01L2224/4807 , H01L2224/48091 , H01L2224/48227 , H01L2224/48451 , H01L2224/48463 , H01L2224/48482 , H01L2224/48624 , H01L2224/73265 , H01L2224/78301 , H01L2224/83 , H01L2224/85051 , H01L2224/85201 , H01L2224/85205 , H01L2224/85375 , H01L2224/859 , H01L2224/8592 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/0106 , H01L2924/01079 , H01L2924/01082 , H01L2924/01202 , H01L2924/01327 , H01L2924/014 , H01L2924/05042 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/20751 , H01L2924/20752 , H01L2924/00014 , H01L2224/48465 , H01L2924/0665 , H01L2924/00
摘要： It has been found that integrated packages having dies with at least 10 bonding pads separated by a pitch of 65 μm or less are susceptible to corrosion upon wire bonding to these pads and subsequent encapsulation in a passivating material. In particular, crevices are potentially formed between the bonding wire and bonding pad that are not passivated and that promote corrosion. Avoidance of crevice formation through, for example, appropriately choosing the bonding pad and wire configuration substantially avoids such corrosion.
摘要翻译： 已经发现，具有至少10个键合垫的间隔为65μm或更小的模具的集成封装在引线接合到这些焊盘并随后封装在钝化材料中时易于腐蚀。 特别地，在不被钝化并促进腐蚀的接合线和接合焊盘之间潜在地形成缝隙。 例如通过适当地选择接合焊盘和电线配置来避免缝隙形成基本上避免了这种腐蚀。
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公开(公告)号：US07888257B2
公开(公告)日：2011-02-15
申请号：US11973859
申请日：2007-10-10
IPC分类号： H01L21/44
CPC分类号： H01L24/85 , H01L24/05 , H01L24/28 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/83 , H01L2224/02166 , H01L2224/04042 , H01L2224/05009 , H01L2224/05073 , H01L2224/05556 , H01L2224/05558 , H01L2224/05624 , H01L2224/2919 , H01L2224/45015 , H01L2224/45144 , H01L2224/4807 , H01L2224/48091 , H01L2224/48227 , H01L2224/48451 , H01L2224/48463 , H01L2224/48482 , H01L2224/48624 , H01L2224/73265 , H01L2224/78301 , H01L2224/83 , H01L2224/85051 , H01L2224/85201 , H01L2224/85205 , H01L2224/85375 , H01L2224/859 , H01L2224/8592 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/0106 , H01L2924/01079 , H01L2924/01082 , H01L2924/01202 , H01L2924/01327 , H01L2924/014 , H01L2924/05042 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/20751 , H01L2924/20752 , H01L2924/00014 , H01L2224/48465 , H01L2924/0665 , H01L2924/00
摘要： It has been found that integrated packages having dies with at least 10 bonding pads separated by a pitch of 65 μm or less are susceptible to corrosion upon wire bonding to these pads and subsequent encapsulation in a passivating material. In particular, crevices are potentially formed between the bonding wire and bonding pad that are not passivated and that promote corrosion. Avoidance of crevice formation through, for example, appropriately choosing the bonding pad and wire configuration substantially avoids such corrosion.
摘要翻译： 已经发现，具有至少10个接合焊盘分离的间距为65μm或更小的管芯的集成封装在引线接合到这些焊盘并随后在钝化材料中封装时易于腐蚀。 特别地，在不被钝化并促进腐蚀的接合线和接合焊盘之间潜在地形成缝隙。 例如通过适当地选择接合焊盘和电线配置来避免缝隙形成基本上避免了这种腐蚀。
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