Abstract:
An optimized bump and offset along the spring section of a load beam of a head-gimbal assembly ("HGA") in the loaded state redistributes the mass and stiffness distributions of the load beam from a truly flat state, so that the mode shape of the first torsional resonance mode is changed such that the coupling between a drive actuator head arm and the head slider is essentially eliminated. A fabrication method to produce the desired bump and offset, and a characterization method to ascertain that optimized bump and offset parameters have been achieved are also disclosed. By optimizing bump and offset, the slider remains independent from any load beam first torsional vibration even at resonance and/or sway mode resonant frequency of the HGA may be increased.
Abstract:
A method for achieving uniform expansion of a dielectric plate made by injection molding includes the steps of forming core pins having a rhombic cross section at predetermined positions inside a mold for injection-molding the plate, injecting a plasticized dielectric material into the mold wherein the core pins guide the plasticized material flow for properly orienting molecules of the dielectric material, and curing and forming the dielectric plate in which rhombic holes corresponding to the core pins are formed. The properly oriented molecules of the dielectric material and the rhombic holes reduce the difference between thermal expansion coefficients in longitudinal and lateral directions of the plate thereby achieving uniform expansion thereof.
Abstract:
An optimized bump and offset along the spring section of a load beam of a head-gimbal assembly ("HGA") in the loaded state redistributes the mass and stiffness distributions of the load beam from a truly flat state, so that the mode shape of the first torsional resonance mode is changed such that the coupling between a drive actuator head arm and the head slider is essentially eliminated. A fabrication method to produce the desired bump and offset, and a characterization method to ascertain that optimized bump and offset parameters have been achieved are also disclosed. By optimizing bump and offset, the slider remains independent from any load beam first torsional vibration even at resonance and/or sway mode resonant frequency of the HGA may be increased.
Abstract:
A ZIF socket connector includes a base defining a plurality of pin receiving holes and a cover slidably positioned on the base and defining a plurality of through holes corresponding to the pin receiving holes. Conductive pins of a chip to be mounted on the connector extend through the through holes of the cover and into the pin receiving holes of the base. Each pin receiving hole has a conductive terminal fixed therein. Each terminal has a resilient arm imparting a transverse engaging force on the corresponding pin upon engaging therewith. Some of the terminals are fixed to a first inside face of the pin receiving holes, while the remaining terminals are located at an opposite second inside face of the pin receiving holes whereby the transverse engaging forces acting on the two groups of pin receiving holes are opposite to and thus cancelled by each other.
Abstract:
Methods and apparatus for reducing overall seeking acoustics in a head-disk apparatus are disclosed. In accordance with one aspect of the present invention, a method for reducing overall seeking acoustics in a disk drive includes sending at least one current command sample to a power amplifier, prior to sending a full scale current command to the power amplifier. A seek current wave form with a smooth, non-linear rise is generated using the power amplifier such that the current command sample. In one embodiment, the full scale current command is arranged to cause the power amplifier to saturate. In another embodiment, the initial rise is a smooth, substantially bi-exponential initial rise.
Abstract:
A socket for providing electrical connection between an IC and a mother board comprises an insulative housing defining a number of terminal passageways and a number of terminals received in the passageways. Each terminal includes a contact portion, a securing portion, an adjustment portion and a soldering portion. The contact portion is adapted to engage a pin of the IC. The securing portion is interferentially fit in the passageway for retaining the terminal therein. The feature of the invention lies in the resilient adjustment portion which can be easily and resiliently deformed.
Abstract:
Methods and apparatus for reducing overall seeking acoustics in a head-disk apparatus are disclosed. In accordance with one aspect of the present invention, a method for reducing overall seeking acoustics in a disk drive apparatus, which includes an actuator, involves calculating an error that is a measure of a difference between a desired trajectory for the actuator and an actual trajectory for the actuator, and calculating a preliminary gain. The method also includes determining when the preliminary gain exceeds a minimum acceptable gain limit, and updating a current command using the preliminary gain and the velocity error when the preliminary gain exceeds the minimum acceptable gain limit. The preliminary gain is generally arranged to enable the updated current command to reduce the overall seeking acoustics. The updated current command is sent to a power amplifier which then generates a seek current signal using the power amplifier and the updated current command. The updated current command allows the actual trajectory to substantially follow the desired trajectory.
Abstract:
A contact comprises a central torsion beam, two side plates integrally connected to two ends of the central torsion beam and each side plate is perpendicular to the torsion beam. Two curved spring arms extend oppositely from a center portion of the torsion beam so that when the side plates are fixed in position and the curved spring arms are exerted opposite forces by two contact pads sandwiching the contact, the torsion beam will be twisted for a predetermined angle to transmit reactive forces to the curved spring arms to abut against the contact pads.