公开(公告)号：US6132222A

公开(公告)日：2000-10-17

申请号：US306515

申请日：1999-05-06

申请人： Jwo-Min Wang ,  Shih-Wei Hsiao ,  Ming-Lun Szu

发明人： Jwo-Min Wang ,  Shih-Wei Hsiao ,  Ming-Lun Szu

IPC分类号： H01R12/57 ,  H01R13/02 ,  H05K3/34 ,  H01R1/00

CPC分类号： H01R13/02 ,  H05K3/3426 ,  H01R12/707 ,  H01R12/716 ,  Y02P70/613

摘要： A socket for providing electrical connection between an IC and a mother board comprises an insulative housing defining a number of terminal passageways and a number of terminals received in the passageways. Each terminal includes a contact portion, a securing portion, an adjustment portion and a soldering portion. The contact portion is adapted to engage a pin of the IC. The securing portion is interferentially fit in the passageway for retaining the terminal therein. The feature of the invention lies in the resilient adjustment portion which can be easily and resiliently deformed.

摘要翻译： 用于在IC和母板之间提供电连接的插座包括限定多个端子通道的绝缘壳体和在通路中接收的多个端子。 每个端子包括接触部分，固定部分，调节部分和焊接部分。 接触部分适于接合IC的引脚。 固定部分沿周向配合在通道中，用于将端子保持在其中。 本发明的特征在于弹性调整部容易弹性变形。

公开(公告)号：US06210196B1

公开(公告)日：2001-04-03

申请号：US09330393

申请日：1999-06-11

申请人： Jwo-Min Wang ,  Ming-Lun Szu

发明人： Jwo-Min Wang ,  Ming-Lun Szu

IPC分类号： H01R13625

CPC分类号： H05K7/1007

摘要： A ZIF socket connector includes a base defining a plurality of pin receiving holes and a cover slidably positioned on the base and defining a plurality of through holes corresponding to the pin receiving holes. Conductive pins of a chip to be mounted on the connector extend through the through holes of the cover and into the pin receiving holes of the base. Each pin receiving hole has a conductive terminal fixed therein. Each terminal has a resilient arm imparting a transverse engaging force on the corresponding pin upon engaging therewith. Some of the terminals are fixed to a first inside face of the pin receiving holes, while the remaining terminals are located at an opposite second inside face of the pin receiving holes whereby the transverse engaging forces acting on the two groups of pin receiving holes are opposite to and thus cancelled by each other.

摘要翻译： ZIF插座连接器包括限定多个销接收孔的基座和可滑动地定位在基座上并且限定对应于销接收孔的多个通孔的盖。 要安装在连接器上的芯片的导电引脚延伸穿过盖的通孔并进入基座的插脚接收孔。 每个销接收孔具有固定在其中的导电端子。 每个端子具有弹性臂，在与其接合时在相应的销上赋予横向接合力。 一些端子被固定到销接收孔的第一内表面，而其余端子位于销接收孔的相对的第二内侧面，由此作用在两组销接收孔上的横向接合力相反 并因此被彼此取消。

公开(公告)号：US6146152A

公开(公告)日：2000-11-14

申请号：US408416

申请日：1999-09-29

申请人： Robert G. McHugh ,  Nick Lin ,  Jwo-Min Wang ,  Shih-Wei Hsiao

发明人： Robert G. McHugh ,  Nick Lin ,  Jwo-Min Wang ,  Shih-Wei Hsiao

IPC分类号： H01R12/71 ,  H01R13/24 ,  H01R12/22

CPC分类号： H01R13/2435 ,  H01R12/714

摘要： A contact comprises a central torsion beam, two side plates integrally connected to two ends of the central torsion beam and each side plate is perpendicular to the torsion beam. Two curved spring arms extend oppositely from a center portion of the torsion beam so that when the side plates are fixed in position and the curved spring arms are exerted opposite forces by two contact pads sandwiching the contact, the torsion beam will be twisted for a predetermined angle to transmit reactive forces to the curved spring arms to abut against the contact pads.

摘要翻译： 接触件包括中心扭转梁，两个侧板整体地连接到中心扭转梁的两端，每个侧板垂直于扭转梁。 两个弯曲的弹簧臂与扭转梁的中心部分相反地延伸，使得当侧板被固定就位时，弯曲的弹簧臂通过夹住接触件的两个接触垫施加相反的力，扭转梁将被扭转预定的 以将反作用力传递到弯曲弹簧臂以抵靠接触垫。

公开(公告)号：US06135791A

公开(公告)日：2000-10-24

申请号：US317492

申请日：1999-05-24

申请人： Jwo-Min Wang ,  Shih-Wei Hsiao

发明人： Jwo-Min Wang ,  Shih-Wei Hsiao

IPC分类号： H01R12/04 ,  H05K1/02 ,  H05K3/34 ,  H05K7/10 ,  H01R12/00

CPC分类号： H05K7/1076 ,  H05K1/0271 ,  H05K3/3436

摘要： A method for achieving uniform expansion of a dielectric plate made by injection molding includes the steps of forming core pins having a rhombic cross section at predetermined positions inside a mold for injection-molding the plate, injecting a plasticized dielectric material into the mold wherein the core pins guide the plasticized material flow for properly orienting molecules of the dielectric material, and curing and forming the dielectric plate in which rhombic holes corresponding to the core pins are formed. The properly oriented molecules of the dielectric material and the rhombic holes reduce the difference between thermal expansion coefficients in longitudinal and lateral directions of the plate thereby achieving uniform expansion thereof.

摘要翻译： 用于实现通过注射成型制成的电介质板的均匀膨胀的方法包括以下步骤：在用于注射成型该板的模具内的预定位置处形成具有菱形横截面的芯销，将增塑的电介质材料注入到模具中，其中芯 引脚引导塑化材料流动，以使电介质材料的分子适当地定向，并且固化和形成其中形成与芯销对应的菱形孔的电介质板。 介电材料和菱形孔的正确定向分子减小了板的纵向和横向热膨胀系数之间的差异，从而实现了其均匀膨胀。

公开(公告)号：US5657187A

公开(公告)日：1997-08-12

申请号：US567622

申请日：1995-12-05

申请人： Michael R. Hatch ,  Stephen P. Williams ,  Jwo-Min Wang

发明人： Michael R. Hatch ,  Stephen P. Williams ,  Jwo-Min Wang

IPC分类号： G11B5/60 ,  G11B5/48 ,  G11B21/21

CPC分类号： G11B5/4833 ,  G11B5/4826 ,  Y10S72/702 ,  Y10T29/49025 ,  Y10T29/49036

摘要： An optimized bump and offset along the spring section of a load beam of a head-gimbal assembly ("HGA") in the loaded state redistributes the mass and stiffness distributions of the load beam from a truly flat state, so that the mode shape of the first torsional resonance mode is changed such that the coupling between a drive actuator head arm and the head slider is essentially eliminated. A fabrication method to produce the desired bump and offset, and a characterization method to ascertain that optimized bump and offset parameters have been achieved are also disclosed. By optimizing bump and offset, the slider remains independent from any load beam first torsional vibration even at resonance and/or sway mode resonant frequency of the HGA may be increased.

摘要翻译： 在负载状态下，头部万向节组件（“HGA”）的负载梁的弹簧部分的优化的凸起和偏移将负载梁的质量和刚度分布从真实平坦状态重新分布，使得模型形状 改变第一扭转共振模式，从而基本上消除了驱动致动器头部臂和头部滑块之间的联接。 还公开了产生所需凸块和偏移的制造方法以及用于确定已经实现优化的凸块和偏移参数的表征方法。 通过优化凸块和偏移，即使在谐振和/或摆动模式下，滑块仍然独立于任何负载梁的第一扭转振动，HGA的谐振频率可能会增加。

公开(公告)号：US5471734A

公开(公告)日：1995-12-05

申请号：US249525

申请日：1994-05-26

申请人： Michael R. Hatch ,  Stephen P. Williams ,  Jwo-Min Wang

发明人： Michael R. Hatch ,  Stephen P. Williams ,  Jwo-Min Wang

IPC分类号： G11B5/60 ,  G11B5/48 ,  G11B21/21

CPC分类号： G11B5/4833 ,  G11B5/4826 ,  Y10S72/702 ,  Y10T29/49025 ,  Y10T29/49036

摘要： An optimized bump and offset along the spring section of a load beam of a head-gimbal assembly ("HGA") in the loaded state redistributes the mass and stiffness distributions of the load beam from a truly flat state, so that the mode shape of the first torsional resonance mode is changed such that the coupling between a drive actuator head arm and the head slider is essentially eliminated. A fabrication method to produce the desired bump and offset, and a characterization method to ascertain that optimized bump and offset parameters have been achieved are also disclosed. By optimizing bump and offset, the slider remains independent from any load beam first torsional vibration even at resonance and/or sway mode resonant frequency of the HGA may be increased.

摘要翻译： 在负载状态下，头部万向节组件（“HGA”）的负载梁的弹簧部分的优化的凸起和偏移将负载梁的质量和刚度分布从真实平坦状态重新分布，使得模型形状 改变第一扭转共振模式，从而基本上消除了驱动致动器头部臂和头部滑块之间的联接。 还公开了产生所需凸块和偏移的制造方法以及用于确定已经实现优化的凸块和偏移参数的表征方法。 通过优化凸块和偏移，即使在谐振和/或摆动模式下，滑块仍然独立于任何负载梁的第一扭转振动，HGA的谐振频率可能会增加。