Plasma treating method and apparatus therefor
    1.
    发明授权
    Plasma treating method and apparatus therefor 失效
    等离子体处理方法及其设备

    公开(公告)号:US4795529A

    公开(公告)日:1989-01-03

    申请号:US109318

    申请日:1987-10-19

    摘要: This invention relates to a plasma treating method and apparatus therefor. The plasma treating method comprises rendering a gas having a critical potential plasmic under a reduced pressure and changing an acceleration voltage for accelerating ions in the plasma towards a sample interposing the critical potential. The plasma treating apparatus comprises means for rendering a gas having a critical potential plasmic under a reduced pressure and means for changing an acceleration voltage for accelerating ions in the plasma towards a sample interposing the critical potential. According to the present invention, the etching step and the film formation step can be carried out alternately and the plasma treating time can be shortened.

    摘要翻译: 本发明涉及等离子体处理方法及其装置。 等离子体处理方法包括在减压下制备具有临界电位等离子体的气体,并且改变用于将等离子体中的离子加速到插入临界电位的样品的加速电压。 等离子体处理装置包括用于在减压下形成具有临界电位等离子体的气体的装置,以及用于改变用于将等离子体中的离子加速到插入临界电位的样品的加速电压的装置。 根据本发明,蚀刻步骤和成膜步骤可以交替进行,并且可以缩短等离子体处理时间。