公开(公告)号：US09365768B2

公开(公告)日：2016-06-14

申请号：US14704899

申请日：2015-05-05

申请人： Guan-Jie Luo ,  Kai Hsiung Tsai

发明人： Guan-Jie Luo ,  Kai Hsiung Tsai

IPC分类号： H01L33/00 ,  C09K11/77 ,  H01L33/50 ,  H01L33/64 ,  C08K13/02 ,  C08L63/00 ,  C08L83/00 ,  C09K5/14 ,  H01L23/00 ,  H01L33/56

CPC分类号： C09K11/7706 ,  C08K3/013 ,  C08K9/06 ,  C08K13/02 ,  C08L63/00 ,  C08L83/00 ,  C08L2203/202 ,  C09K5/14 ,  C09K11/7774 ,  H01L24/97 ,  H01L33/501 ,  H01L33/56 ,  H01L33/641 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2933/0075 ,  Y02B20/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A white light emitting diode comprising a substrate layer, two conductive frames, a light emitting unit, two conductive wires, and a packaging element is provided. The substrate layer is made from a curing reaction of first mixture, and the first mixture includes a curable resin, a curing agent, a phosphor material, and a modified thermal conductive nano-material, wherein the modified thermal conductive nano-material is made from a thermal conductive nano-material and a silane compound. The packaging element is made from a curing reaction of second mixture, and the second mixture includes a curable resin, a curing agent, a phosphor material, and a modified thermal conductive nano-material, wherein the modified thermal conductive nano-material is made from a thermal conductive nano-material and a silane compound. The chip-type white light emitting diode has a good heat-dissipating effect and a good luminous efficiency without additional heat dissipation fins. In addition, the manufacturing method of the chip-type white light emitting diode is a relatively simple process for mass production.

摘要翻译： 提供了包括基底层，两个导电框架，发光单元，两个导电线和封装元件的白色发光二极管。 基材层由第一混合物的固化反应制成，第一混合物包括固化树脂，固化剂，荧光体材料和改性导热纳米材料，其中改性导热纳米材料由 导热纳米材料和硅烷化合物。 包装元件由第二混合物的固化反应制成，第二混合物包括固化树脂，固化剂，荧光体材料和改性导热纳米材料，其中改性导热纳米材料由 导热纳米材料和硅烷化合物。 芯片型白光发光二极管具有良好的散热效果和良好的发光效率，无需额外的散热片。 此外，芯片型白色发光二极管的制造方法是用于批量生产的相对简单的方法。

公开(公告)号：US20160005934A1

公开(公告)日：2016-01-07

申请号：US14704899

申请日：2015-05-05

申请人： GUAN-JIE LUO ,  KAI HSIUNG TSAI

发明人： GUAN-JIE LUO ,  KAI HSIUNG TSAI

IPC分类号： H01L33/50 ,  H01L33/00 ,  H01L33/64 ,  C09K11/77 ,  C08L63/00 ,  C08L83/00 ,  C09K5/14 ,  H01L33/62 ,  C08K13/02

CPC分类号： C09K11/7706 ,  C08K3/013 ,  C08K9/06 ,  C08K13/02 ,  C08L63/00 ,  C08L83/00 ,  C08L2203/202 ,  C09K5/14 ,  C09K11/7774 ,  H01L24/97 ,  H01L33/501 ,  H01L33/56 ,  H01L33/641 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2933/0075 ,  Y02B20/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A white light emitting diode comprising a substrate layer, two conductive frames, a light emitting unit, two conductive wires, and a packaging element is provided. The substrate layer is made from a curing reaction of first mixture, and the first mixture includes a curable resin, a curing agent, a phosphor material, and a modified thermal conductive nano-material, wherein the modified thermal conductive nano-material is made from a thermal conductive nano-material and a silane compound. The packaging element is made from a curing reaction of second mixture, and the second mixture includes a curable resin, a curing agent, a phosphor material, and a modified thermal conductive nano-material, wherein the modified thermal conductive nano-material is made from a thermal conductive nano-material and a silane compound. The chip-type white light emitting diode has a good heat-dissipating effect and a good luminous efficiency without additional heat dissipation fins. In addition, the manufacturing method of the chip-type white light emitting diode is a relatively simple process for mass production.

摘要翻译： 提供了包括基底层，两个导电框架，发光单元，两个导电线和封装元件的白色发光二极管。 基材层由第一混合物的固化反应制成，第一混合物包括固化树脂，固化剂，荧光体材料和改性导热纳米材料，其中改性导热纳米材料由 导热纳米材料和硅烷化合物。 包装元件由第二混合物的固化反应制成，第二混合物包括固化树脂，固化剂，荧光体材料和改性导热纳米材料，其中改性导热纳米材料由 导热纳米材料和硅烷化合物。 芯片型白光发光二极管具有良好的散热效果和良好的发光效率，无需额外的散热片。 此外，芯片型白色发光二极管的制造方法是用于批量生产的相对简单的方法。