公开(公告)号：US20120223461A1

公开(公告)日：2012-09-06

申请号：US13471573

申请日：2012-05-15

申请人： Yoshiaki Takaya ,  Yuji Hashima ,  Yoshihisa Hayashida ,  Hirosuke Kawaguchi ,  Satoru Tanaka ,  Akihiko Kanai ,  Kazuaki Uehara

发明人： Yoshiaki Takaya ,  Yuji Hashima ,  Yoshihisa Hayashida ,  Hirosuke Kawaguchi ,  Satoru Tanaka ,  Akihiko Kanai ,  Kazuaki Uehara

IPC分类号： B29C59/02 ,  B29C35/08

CPC分类号： B29C59/022 ,  B29C33/42 ,  B29C2035/0822 ,  B29C2059/023 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

摘要： The present invention provides an imprinting device and an imprinting method which can uniformly apply pressure between a mold and a molding object and which can increase and decrease a temperature at a fast speed. An imprinting device is for transferring a pattern on a mold to a film molding object, and comprises a stage for holding the mold, a pressurizing-chamber casing which configures a pressurizing-chamber together with the molding object, sealing means which airtightly seals a space between the pressurizing-chamber casing and the molding object, opening and closing means which opens and closes the space between the pressurizing-chamber casing and the molding object, pressurizing means which adjusts atmospheric pressure in the pressurizing-chamber, heating means which heats either one of or both of the mold and the molding object, and degassing means which eliminates any gas present between the mold and the molding object.

摘要翻译： 本发明提供能够均匀地在模具和成型体之间施加压力并且可以以快速的速度增加和降低温度的压印装置和压印方法。 压印装置用于将模具上的图案转印到薄膜成型体上，并且包括用于保持模具的台，与成型对象一起构成加压室的加压室壳体，气密地密封空间的密封装置 在加压室壳体和成型体之间，开闭装置，其对加压室壳体与成型体之间的空间进行打开和关闭;加压装置，其对加压室内的大气压进行调节;加热单元， 模具和模制对象中的一个或两个，以及消除在模具和模制对象之间存在的任何气体的脱气装置。

公开(公告)号：US20110024948A1

公开(公告)日：2011-02-03

申请号：US12810557

申请日：2008-12-25

申请人： Yoshiaki Takaya ,  Yuji Hashima ,  Yoshihisa Hayashida ,  Hirosuke Kawaguchi ,  Satoru Tanaka ,  Akihiko Kanai ,  Kazuaki Uehara

发明人： Yoshiaki Takaya ,  Yuji Hashima ,  Yoshihisa Hayashida ,  Hirosuke Kawaguchi ,  Satoru Tanaka ,  Akihiko Kanai ,  Kazuaki Uehara

IPC分类号： B28B11/08

CPC分类号： B29C59/022 ,  B29C33/42 ,  B29C2035/0822 ,  B29C2059/023 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

摘要： The present invention provides an imprinting device and an imprinting method which can uniformly apply pressure between a mold and a molding object and which can increase and decrease a temperature at a fast speed. An imprinting device is for transferring a pattern on a mold to a film molding object, and comprises a stage for holding the mold, a pressurizing-chamber casing which configures a pressurizing-chamber together with the molding object, sealing means which airtightly seals a space between the pressurizing-chamber casing and the molding object, opening and closing means which opens and closes the space between the pressurizing-chamber casing and the molding object, pressurizing means which adjusts atmospheric pressure in the pressurizing-chamber, heating means which heats either one of or both of the mold and the molding object, and degassing means which eliminates any gas present between the mold and the molding object.

摘要翻译： 本发明提供能够均匀地在模具和成型体之间施加压力并且可以以快速的速度增加和降低温度的压印装置和压印方法。 压印装置用于将模具上的图案转印到薄膜成型体上，并且包括用于保持模具的台，与成型对象一起构成加压室的加压室壳体，气密地密封空间的密封装置 在加压室壳体和成型体之间，开闭装置，其对加压室壳体与成型体之间的空间进行打开和关闭;加压装置，其对加压室内的大气压进行调节;加热单元， 模具和模制对象中的一个或两个，以及消除在模具和模制对象之间存在的任何气体的脱气装置。

公开(公告)号：US08215944B2

公开(公告)日：2012-07-10

申请号：US12810557

申请日：2008-12-25

申请人： Yoshiaki Takaya ,  Yuji Hashima ,  Yoshihisa Hayashida ,  Hirosuke Kawaguchi ,  Satoru Tanaka ,  Akihiko Kanai ,  Kazuaki Uehara

发明人： Yoshiaki Takaya ,  Yuji Hashima ,  Yoshihisa Hayashida ,  Hirosuke Kawaguchi ,  Satoru Tanaka ,  Akihiko Kanai ,  Kazuaki Uehara

IPC分类号： A01J21/00 ,  A01J25/12 ,  B28B11/08 ,  B29C35/04

CPC分类号： B29C59/022 ,  B29C33/42 ,  B29C2035/0822 ,  B29C2059/023 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

摘要： The present invention provides an imprinting device and an imprinting method which can uniformly apply pressure between a mold and a molding object and which can increase and decrease a temperature at a fast speed. An imprinting device is for transferring a pattern on a mold to a film molding object and comprises a stage for holding the mold, a pressurizing-chamber casing which configures a pressurizing-chamber together with the molding object, sealing means which airtightly seals a space between the pressurizing-chamber casing and the molding object, opening and closing means which opens and closes the space between the pressurizing-chamber casing and the molding object, pressurizing means which adjusts atmospheric pressure in the pressurizing-chamber, heating means which heats either one of or both of the mold and the molding object, and degassing means which eliminates any gas present between the mold and the molding object.

摘要翻译： 本发明提供能够均匀地在模具和成型体之间施加压力并且可以以快速的速度增加和降低温度的压印装置和压印方法。 压印装置用于将模具上的图案转印到薄膜成型对象上，并且包括用于保持模具的台，与成型对象一起构成加压室的加压室壳体，密封装置将气密密封 所述加压室壳体和所述成型体，用于打开和关闭所述加压室壳体与所述成型体之间的空间的开闭装置，调节所述加压室内的大气压的加压单元， 或模具和模制对象两者以及脱气装置，其消除了存在于模具和模制对象之间的任何气体。

公开(公告)号：US06989587B2

公开(公告)日：2006-01-24

申请号：US10730119

申请日：2003-12-09

申请人： Mamoru Ito ,  Akira Muto ,  Tomio Yamada ,  Tsuneo Endoh ,  Satoru Konishi ,  Kazuaki Uehara ,  Tsutomu Ida ,  Koji Odaira ,  Hirokazu Nakajima

发明人： Mamoru Ito ,  Akira Muto ,  Tomio Yamada ,  Tsuneo Endoh ,  Satoru Konishi ,  Kazuaki Uehara ,  Tsutomu Ida ,  Koji Odaira ,  Hirokazu Nakajima

IPC分类号： H91L23/02

CPC分类号： H01L24/49 ,  H01L21/565 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K3/3426 ,  H05K2201/10166 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： There is provided a semiconductor device with enhanced reliability having a heat sink mounting a plurality of semiconductor chips, a plurality of inner leads connected electrically to the semiconductor chips, a molding body for resin molding the plurality of semiconductor chips and the plurality of inner leads, a plurality of wires for providing electrical connections between the respective electrodes of the semiconductor chips and the inner leads corresponding thereto, and wide outer leads connecting to the inner leads and exposed outside the molding body. A plurality of slits are formed in the respective portions of the outer leads located outside the molding body to extend lengthwise in directions in which the outer leads are extracted. This achieves a reduction in lead stress which is placed on the outer leads by thermal stress or the like after the mounting of a MOSFET and thereby enhances the reliability of the MOSFET.

摘要翻译： 提供了具有增强的可靠性的半导体器件，其具有安装多个半导体芯片的散热器，与半导体芯片电连接的多个内部引线，用于树脂模制多个半导体芯片和多个内部引线的成型体， 用于提供半导体芯片的各个电极和对应于其的内部引线之间的电连接的多根电线，以及连接到内部引线并暴露在模制体外部的宽的外部引线。 在位于模制体外部的外引线的各个部分中形成多个狭缝，以在外引线被抽取的方向上纵向延伸。 这实现了在安装MOSFET之后通过热应力等放置在外引线上的引线应力的降低，从而提高了MOSFET的可靠性。