公开(公告)号：US20070193682A1

公开(公告)日：2007-08-23

申请号：US10599638

申请日：2005-04-06

申请人： Tatsuo Sasaoka ,  Satoshi Horie ,  Isamu Aokura ,  Yoshihiko Yagi ,  Kazuki Fukada

发明人： Tatsuo Sasaoka ,  Satoshi Horie ,  Isamu Aokura ,  Yoshihiko Yagi ,  Kazuki Fukada

IPC分类号： B32B38/16 ,  B32B38/10 ,  B32B38/00 ,  B31F1/07

CPC分类号： B23K1/203 ,  B23K2101/40 ,  H01L21/4864 ,  H01L21/6835 ,  H01L23/3142 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/1181 ,  H01L2224/1184 ,  H01L2224/13019 ,  H01L2224/13144 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/75753 ,  H01L2224/81009 ,  H01L2224/81011 ,  H01L2224/81012 ,  H01L2224/81013 ,  H01L2224/81191 ,  H01L2224/81395 ,  H01L2224/81801 ,  H01L2224/8182 ,  H01L2224/81894 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H05K3/328 ,  H05K3/3489 ,  H05K3/383 ,  H05K2201/0373 ,  H05K2201/10674 ,  H05K2203/0307 ,  Y10S438/974 ,  Y10T156/1023 ,  Y10T156/14 ,  H01L2224/05599

摘要： A bonding method and an apparatus that enable metal bonding under the atmospheric pressure and at room temperature, wherein the surfaces of objects (1b, 2a) to be bonded together are cleaned in an initial cleaning step (S1) to remove bonding inhibitor substances (G) such as oxides and adhered substances; one (1b) of the bonding surfaces is provided with an uneven profile with a predetermined roughness in a surface roughness control step (S3); a surface treatment step (S5) is performed to remove the substances (F) that have been removed but adhered to the bonding surfaces (1b, 2a) again; and the uneven bonding surface (1b) is pressed against the other bonding surface (2a) to bond them together.

摘要翻译： 在大气压和室温下能够进行金属接合的接合方法和装置，其中在初始清洁步骤（S1）中清洁要结合在一起的物体（1b，2a）的表面以除去结合抑制剂 物质（G），如氧化物和附着物质; 一个（1b）的粘合表面在表面粗糙度控制步骤（S 3）中设置有具有预定粗糙度的凹凸轮廓; 执行表面处理步骤（S 5）以除去已经去除但又粘附到接合表面（1b，2a）上的物质（F） 并且不平坦的接合表面（1b）被压靠在另一个接合表面（2a）上以将它们结合在一起。

公开(公告)号：US07659148B2

公开(公告)日：2010-02-09

申请号：US10599638

申请日：2005-04-06

申请人： Tatsuo Sasaoka ,  Satoshi Horie ,  Isamu Aokura ,  Yoshihiko Yagi ,  Kazuki Fukada

发明人： Tatsuo Sasaoka ,  Satoshi Horie ,  Isamu Aokura ,  Yoshihiko Yagi ,  Kazuki Fukada

IPC分类号： H01L21/60 ,  H01L21/603 ,  H05K3/32 ,  H01L21/58

CPC分类号： B23K1/203 ,  B23K2101/40 ,  H01L21/4864 ,  H01L21/6835 ,  H01L23/3142 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/1181 ,  H01L2224/1184 ,  H01L2224/13019 ,  H01L2224/13144 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/75753 ,  H01L2224/81009 ,  H01L2224/81011 ,  H01L2224/81012 ,  H01L2224/81013 ,  H01L2224/81191 ,  H01L2224/81395 ,  H01L2224/81801 ,  H01L2224/8182 ,  H01L2224/81894 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H05K3/328 ,  H05K3/3489 ,  H05K3/383 ,  H05K2201/0373 ,  H05K2201/10674 ,  H05K2203/0307 ,  Y10S438/974 ,  Y10T156/1023 ,  Y10T156/14 ,  H01L2224/05599

摘要： A bonding method and an apparatus that enable metal bonding under the atmospheric pressure and at room temperature, wherein the surfaces of objects (1b, 2a) to be bonded together are cleaned in an initial cleaning step (S1) to remove bonding inhibitor substances (G) such as oxides and adhered substances; one (1b) of the bonding surfaces is provided with an uneven profile with a predetermined roughness in a surface roughness control step (S3); a surface treatment step (S5) is performed to remove the substances (F) that have been removed but adhered to the bonding surfaces (1b, 2a) again; and the uneven bonding surface (1b) is pressed against the other bonding surface (2a) to bond them together.

摘要翻译： 在大气压和室温下能够进行金属接合的接合方法和装置，其中在初始清洁步骤（S1）中清洁要结合在一起的物体（1b，2a）的表面以除去粘合抑制剂物质（G ）如氧化物和附着物质; 一个（1b）的接合表面在表面粗糙度控制步骤（S3）中设置有具有预定粗糙度的不平坦轮廓; 执行表面处理步骤（S5）以除去已经去除但再次粘合到接合表面（1b，2a）上的物质（F）; 并且不平坦的接合表面（1b）被压靠在另一个接合表面（2a）上以将它们结合在一起。

公开(公告)号：US08575751B2

公开(公告)日：2013-11-05

申请号：US12522239

申请日：2008-03-04

申请人： Daisuke Sakurai ,  Yoshihiko Yagi

发明人： Daisuke Sakurai ,  Yoshihiko Yagi

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L24/12 ,  B33Y80/00 ,  G03F7/0037 ,  G03F7/0047 ,  H01L24/11 ,  H01L24/16 ,  H01L24/742 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11552 ,  H01L2224/11554 ,  H01L2224/11901 ,  H01L2224/13012 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/13171 ,  H01L2224/13184 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  Y10T29/49213 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2224/13099 ,  H01L2924/00

摘要： A conductive bump formed on an electrode surface of an electronic component. This conductive bump is composed of a plurality of photosensitive resin layers having different conductive filler contents. Consequently, this conductive bump is able to realize conflicting functions, namely, improvement in adhesion strength with the electrode and reduction of contact resistance.

摘要翻译： 形成在电子部件的电极表面上的导电凸块。 该导电凸块由具有不同导电填料含量的多个感光性树脂层构成。 因此，该导电凸块能够实现冲突的功能，即提高与电极的粘合强度和降低接触电阻。

公开(公告)号：US20120125676A1

公开(公告)日：2012-05-24

申请号：US13362970

申请日：2012-01-31

申请人： Daisuke Sakurai ,  Yoshihiko Yagi

发明人： Daisuke Sakurai ,  Yoshihiko Yagi

IPC分类号： H05K1/16 ,  H05K1/11

CPC分类号： H05K1/03 ,  H01L2224/16227 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/0082 ,  H05K3/207 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4664 ,  H05K2201/0347 ,  H05K2203/0514 ,  H05K2203/056 ,  H05K2203/107 ,  Y10T29/49124

摘要： A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape.

摘要翻译： 三维电路板通过包括板，设置在板上方的多个台阶上的第一布线电极组和至少在高度方向连接到第一布线电极组的第二布线电极形成， 其中第一布线电极组和第二布线电极之间的至少一个连接部分被整合为连续相同的形状。

公开(公告)号：US08018731B2

公开(公告)日：2011-09-13

申请号：US12302429

申请日：2007-06-19

申请人： Daisuke Sakurai ,  Masato Mori ,  Yoshihiko Yagi

发明人： Daisuke Sakurai ,  Masato Mori ,  Yoshihiko Yagi

IPC分类号： H05K7/10 ,  H05K7/12

CPC分类号： H05K1/141 ,  H01L23/13 ,  H01L23/5385 ,  H01L23/552 ,  H01L25/162 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K1/144 ,  H05K1/181 ,  H05K3/305 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/042 ,  H05K2201/09145 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/2018 ,  H05K2203/1572

摘要： Interconnect substrate (1) that connects at least the first circuit board and the second circuit board. Interconnect substrate (1) includes housing (1) and connecting terminal electrodes for connecting the top and bottom faces of housing (10). Housing (10) has protrusion (11) on its outer periphery and opening (13) in its inner periphery.

摘要翻译： 至少连接第一电路板和第二电路板的互连基板（1）。 互连基板（1）包括用于连接壳体（10）的顶面和底面的壳体（1）和连接端子电极。 壳体10在其外周上具有突起（11），在其内周具有开口（13）。

公开(公告)号：US20090009979A1

公开(公告)日：2009-01-08

申请号：US12280434

申请日：2007-04-23

申请人： Masato Mori ,  Daido Komyoji ,  Koichi Nagai ,  Yoshihiko Yagi

发明人： Masato Mori ,  Daido Komyoji ,  Koichi Nagai ,  Yoshihiko Yagi

IPC分类号： H05K1/14 ,  H01R12/00

CPC分类号： H05K1/144 ,  B23K1/0016 ,  B23K2101/42 ,  H05K3/368 ,  H05K2201/10378 ,  H05K2201/10977 ,  H05K2201/2018 ,  H05K2203/1572

摘要： Three-dimensional structure (40) of the present invention includes first module board (28), second module board (37), and substrate joining member (10) that unifies board (28) and board (37) into one body, thereby electrically connecting these two elements together. The unification is done by molding the outer wall of housing (12) of substrate joining member (10) with resin (29). Substrate joining member (10) used in the three-dimensional structure (40) includes multiple lead terminals (14) made of conductive material, and a frame-shaped and insulating housing (12) to which frame the lead terminals (14) are fixed vertically in a predetermined array. Housing (12) includes projections (18) on at least two outer wall faces of its frame shape.

摘要翻译： 本发明的三维结构（40）包括将板（28）和板（37）一体化成一体的第一模块板（28），第二模块板（37）和基板接合构件（10），由此电 将这两个元素连接在一起。 通过用树脂（29）将衬底接合构件（10）的壳体（12）的外壁模制成一体。 在三维结构（40）中使用的基板接合构件（10）包括由导电材料制成的多个引线端子（14）和框架形绝缘壳体（12），引线端子（14）固定到框架形绝缘壳体 垂直于预定阵列。 壳体（12）在其框架形状的至少两个外壁面上包括突起（18）。

公开(公告)号：US06566165B1

公开(公告)日：2003-05-20

申请号：US09417307

申请日：1999-10-13

申请人： Hiroyuki Otani ,  Yoshihiko Yagi ,  Kenichi Yamamoto

发明人： Hiroyuki Otani ,  Yoshihiko Yagi ,  Kenichi Yamamoto

IPC分类号： H01L2144

CPC分类号： H01L24/16 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3511 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A strengthening land is formed on a semiconductor chip-mounting board corresponding to a non-operating electrode on a semiconductor chip. The strengthening land and the non-operating electrode are bonded with each other, thereby improving a bonding strength between the semiconductor chip and the semiconductor chip-mounting board.

摘要翻译： 对应于半导体芯片上的非操作电极，在半导体芯片安装板上形成加强焊盘。 加强层和非操作电极彼此接合，从而提高半导体芯片和半导体芯片安装板之间的接合强度。

公开(公告)号：US06207549B1

公开(公告)日：2001-03-27

申请号：US08940981

申请日：1997-09-30

申请人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

发明人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

IPC分类号： H01L2144

CPC分类号： H01L24/78 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/78303 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49179 ,  Y10T29/49181 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

摘要翻译： 在IC电极上形成突起电极的方法包括以下步骤：通过引线接合装置在IC电极上形成球接合，向上移动接合毛细管，向上移动接合毛细管然后向下移动接合毛细管，将Au线接合到 球接合部分，并切割Au线。 通过将接合毛细管的下降位置预设为高于形成球形接合位置的位置，可防止Au线与球接合部分以外的球接合部分周围接触。

公开(公告)号：US08809693B2

公开(公告)日：2014-08-19

申请号：US13362970

申请日：2012-01-31

申请人： Daisuke Sakurai ,  Yoshihiko Yagi

发明人： Daisuke Sakurai ,  Yoshihiko Yagi

IPC分类号： H05K1/16 ,  H05K3/40 ,  H05K3/46 ,  H05K3/20 ,  H05K3/00

CPC分类号： H05K1/03 ,  H01L2224/16227 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/0082 ,  H05K3/207 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4664 ,  H05K2201/0347 ,  H05K2203/0514 ,  H05K2203/056 ,  H05K2203/107 ,  Y10T29/49124

摘要： A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape.

摘要翻译： 三维电路板通过包括板，设置在板上方的多个台阶上的第一布线电极组和至少在高度方向连接到第一布线电极组的第二布线电极形成， 其中第一布线电极组和第二布线电极之间的至少一个连接部分被整合为连续相同的形状。

公开(公告)号：US08120188B2

公开(公告)日：2012-02-21

申请号：US12515425

申请日：2007-11-20

申请人： Daisuke Sakurai ,  Yoshihiko Yagi

发明人： Daisuke Sakurai ,  Yoshihiko Yagi

IPC分类号： H01L23/485

CPC分类号： H05K3/321 ,  B33Y80/00 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/31 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/1152 ,  H01L2224/11554 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1411 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electronic component mounting structure includes an electronic component provided with a plurality of electrode terminals, and a mounting substrate provided with connector terminals in positions corresponding to the electrode terminals. An electrode terminal is connected to a connector terminal via a protrusion electrode disposed on the electrode terminal or the connector terminal, and the protrusion electrode includes a conductive filler and a photosensitive resin. The photosensitive resin varies in resin component crosslink density in the height direction of the protrusion electrode.

摘要翻译： 电子部件安装结构包括设置有多个电极端子的电子部件和在与电极端子对应的位置设置有连接器端子的安装基板。 电极端子通过设置在电极端子或连接器端子上的突起电极连接到连接器端子，突起电极包括导电填料和感光树脂。 感光性树脂在突起电极的高度方向上的树脂成分交联密度变化。