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公开(公告)号：US20070181249A1
公开(公告)日：2007-08-09
申请号：US11677859
申请日：2007-02-22
IPC分类号： B32B37/00
CPC分类号： C03C27/10 , B01J19/0093 , B01J2219/00783 , B01J2219/00828 , B01J2219/00831 , B01J2219/00835 , B01J2219/00867 , B01J2219/00873 , B01L3/5027 , C01B3/323 , C01B2203/0233 , C01B2203/044 , C01B2203/047 , C01B2203/066 , C01B2203/1288 , C03C17/225 , C03C17/3435
摘要： A junction substrate includes a first substrate, a buffer film formed on one surface of the first substrate, a metal containing film formed on the buffer film and having a lower resistance than the buffer film, and a second substrate bonded to the other surface of the first substrate.
摘要翻译： 接合衬底包括第一衬底，形成在第一衬底的一个表面上的缓冲膜，形成在缓冲膜上并且具有比缓冲膜低的电阻的金属含有膜，以及粘合到第二衬底的另一个表面的第二衬底 第一底物。
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公开(公告)号：US20050069737A1
公开(公告)日：2005-03-31
申请号：US10951334
申请日：2004-09-27
CPC分类号： B01J19/0093 , B01J2219/00783 , B01J2219/00835 , B01J2219/00873 , B01J2219/00961 , F28F13/18 , H01M8/04007 , H01M8/0612
摘要： A thermal treatment apparatus provided on a substrate includes a heat generating section the section includes a heat generating layer, a diffusion preventing layer which contacts one surface of the heat generating layer to prevent heat diffusion due to heat generation of the heat generating layer, and a cohering layer disposed between the substrate and the diffusion preventing layer.
摘要翻译： 设置在基板上的热处理装置包括发热部，该发热部包括发热层，与发热层的一个表面接触的防扩散层，以防止由于发热层的发热引起的热扩散， 配置在基板和扩散防止层之间的助焊层。
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3.发明授权公开(公告)号：US07410515B2
公开(公告)日：2008-08-12
申请号：US10648857
申请日：2003-08-25
申请人： Keishi Takeyama , Osamu Nakamura
发明人： Keishi Takeyama , Osamu Nakamura
CPC分类号： C01B3/384 , B01J19/0093 , B01J2219/00783 , B01J2219/00835 , B01J2219/00873 , C01B3/323 , C01B3/48 , C01B3/583 , C01B2203/00 , C01B2203/0233 , C01B2203/0283 , C01B2203/044 , C01B2203/047 , C01B2203/066 , C01B2203/0811 , C01B2203/085 , C01B2203/0866 , C01B2203/1076 , C01B2203/1082 , C01B2203/1223 , C01B2203/1288 , C01B2203/1619 , C01B2203/169 , C01B2203/1695 , C01B2203/82 , H01M8/0612 , Y02P70/56
摘要： A reformer is provided which includes a micro reactor having a flow path for a fluid. A container accommodates the micro reactor and keeps an atmosphere on a periphery of the micro reactor at a pressure of not more than 1 Pa.
摘要翻译： 提供了一种重整器，其包括具有流体流动路径的微反应器。 容器容纳微反应器并且在不超过1Pa的压力下保持微反应器的周围的气氛。
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公开(公告)号：US20080145970A1
公开(公告)日：2008-06-19
申请号：US12031517
申请日：2008-02-14
IPC分类号： H01L21/50
CPC分类号： B81C1/00119 , B81B2201/058 , B81C2201/019 , B81C2203/031
摘要： A stack structure is formed by stacking and bonding a plurality of substrates. The stack structure includes bonding films each of which is interposed in a bonding region between, adjacent glass substrates, and bonded to oxygen atoms in the glass of the substrate by anodic bonding.
摘要翻译： 通过堆叠和结合多个基板形成堆叠结构。 堆叠结构包括各自被接合在相邻玻璃基板之间的接合区域中的接合膜，并通过阳极接合与基板的玻璃中的氧原子结合。
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公开(公告)号：US07169367B2
公开(公告)日：2007-01-30
申请号：US10405840
申请日：2003-04-02
CPC分类号： H01M8/0668 , B01J19/0093 , B01J2219/00783 , B01J2219/00835 , B01J2219/00873 , B01J2219/00961 , C01B3/38 , C01B2203/0233 , C01B2203/044 , C01B2203/047 , C01B2203/085 , C01B2203/1294 , H01M8/0612 , H01M2008/1293
摘要： A chemical reaction apparatus includes at least one reaction region formed on a solid body and having a continuously formed reaction flow path to which a fluid material is supplied, and a temperature adjusting layer which is provided on the body to correspond to a region including the reaction flow path and portions between adjacent portions of the reaction flow path. The temperature adjusting layer supplies a predetermined heat quantity to the reaction flow path.
摘要翻译： 一种化学反应装置包括形成在固体上并具有连续形成的反应流动路径的至少一个反应区域，流体材料供应到该反应流路;以及温度调节层，其设置在主体上以对应于包括反应的区域 流路和反应流路的相邻部分之间的部分。 温度调节层向反应流路供给规定的热量。
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公开(公告)号：US07867346B2
公开(公告)日：2011-01-11
申请号：US11677859
申请日：2007-02-22
IPC分类号： B32B37/00
CPC分类号： C03C27/10 , B01J19/0093 , B01J2219/00783 , B01J2219/00828 , B01J2219/00831 , B01J2219/00835 , B01J2219/00867 , B01J2219/00873 , B01L3/5027 , C01B3/323 , C01B2203/0233 , C01B2203/044 , C01B2203/047 , C01B2203/066 , C01B2203/1288 , C03C17/225 , C03C17/3435
摘要： A junction substrate includes a first substrate, a buffer film formed on one surface of the first substrate, a metal containing film formed on the buffer film and having a lower resistance than the buffer film, and a second substrate bonded to the other surface of the first substrate.
摘要翻译： 接合衬底包括第一衬底，形成在第一衬底的一个表面上的缓冲膜，形成在缓冲膜上并且具有比缓冲膜低的电阻的金属含膜，以及粘合到第二衬底的另一个表面的第二衬底 第一底物。
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公开(公告)号：US07531255B2
公开(公告)日：2009-05-12
申请号：US10951334
申请日：2004-09-27
CPC分类号： B01J19/0093 , B01J2219/00783 , B01J2219/00835 , B01J2219/00873 , B01J2219/00961 , F28F13/18 , H01M8/04007 , H01M8/0612
摘要： A thermal treatment apparatus provided on a substrate includes a heat generating section the section includes a heat generating layer, a diffusion preventing layer which contacts one surface of the heat generating layer to prevent heat diffusion due to heat generation of the heat generating layer, and a cohering layer disposed between the substrate and the diffusion preventing layer.
摘要翻译： 设置在基板上的热处理装置包括发热部，该发热部包括发热层，与发热层的一个表面接触的防扩散层，以防止由于发热层的发热引起的热扩散， 配置在基板和扩散防止层之间的助焊层。
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公开(公告)号：US07205625B2
公开(公告)日：2007-04-17
申请号：US10916203
申请日：2004-08-11
IPC分类号： H01L31/00
CPC分类号： C03C27/10 , B01J19/0093 , B01J2219/00783 , B01J2219/00828 , B01J2219/00831 , B01J2219/00835 , B01J2219/00867 , B01J2219/00873 , B01L3/5027 , C01B3/323 , C01B2203/0233 , C01B2203/044 , C01B2203/047 , C01B2203/066 , C01B2203/1288 , C03C17/225 , C03C17/3435
摘要： A junction substrate includes a first substrate, a buffer film formed on one surface of the first substrate, a metal containing film formed on the buffer film and having a lower resistance than the buffer film, and a second substrate bonded to the other surface of the first substrate.
摘要翻译： 接合衬底包括第一衬底，形成在第一衬底的一个表面上的缓冲膜，形成在缓冲膜上并且具有比缓冲膜低的电阻的金属含膜，以及粘合到第二衬底的另一个表面的第二衬底 第一底物。
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公开(公告)号：US08133338B2
公开(公告)日：2012-03-13
申请号：US12031517
申请日：2008-02-14
CPC分类号： B81C1/00119 , B81B2201/058 , B81C2201/019 , B81C2203/031
摘要： A stack structure is formed by stacking and bonding a plurality of substrates. The stack structure includes bonding films each of which is interposed in a bonding region between, adjacent glass substrates, and bonded to oxygen atoms in the glass of the substrate by anodic bonding.
摘要翻译： 通过堆叠和结合多个基板形成堆叠结构。 堆叠结构包括各自被接合在相邻玻璃基板之间的接合区域中的接合膜，并通过阳极接合与基板的玻璃中的氧原子结合。
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公开(公告)号：US07531016B2
公开(公告)日：2009-05-12
申请号：US10477576
申请日：2003-03-19
IPC分类号： B01J8/00
CPC分类号： F28F3/048 , B01J19/0093 , B01J19/249 , B01J2219/00828 , B01J2219/00835 , B01J2219/00873 , C01B3/323 , C01B3/384 , C01B3/48 , C01B2203/0233 , C01B2203/0283 , C01B2203/044 , C01B2203/047 , C01B2203/066 , C01B2203/0811 , C01B2203/0822 , C01B2203/085 , C01B2203/1223 , C01B2203/1288 , C01B2203/82 , F28F13/18 , H01M8/0618 , H01M8/0625 , H01M8/0668 , Y02P20/128
摘要： A chemical reaction apparatus includes a solid body which has an outer surface, and in which at least one flow path which allows a chemical medium to flow is formed. This body has a heating element which heats the chemical medium in the flow path to accelerate a chemical reaction of the chemical medium, and a heat radiation preventing film which covers at least a portion of the outer surface of the body, and prevents radiation of heat generated by the heating element from a portion of the outer surface.
摘要翻译： 化学反应装置包括具有外表面的固体，其中形成允许化学介质流动的至少一个流路。 本体具有加热元件，其加热流路中的化学介质以加速化学介质的化学反应，以及覆盖主体外表面的至少一部分并防止热辐射的防辐射膜 由加热元件从外表面的一部分产生。
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