公开(公告)号：US5356754A

公开(公告)日：1994-10-18

申请号：US950500

申请日：1992-09-25

申请人： Kenji Kushi ,  Ken-ichi Inukai ,  Takayuki Iseki ,  Seiya Koyanagi

发明人： Kenji Kushi ,  Ken-ichi Inukai ,  Takayuki Iseki ,  Seiya Koyanagi

IPC分类号： C08G65/332 ,  G03F7/027 ,  G03F7/033 ,  G03C1/73

CPC分类号： C08G65/3322 ,  G03F7/027 ,  G03F7/033 ,  C08G2650/16 ,  C08G2650/20 ,  C08L2312/00

摘要： A photopolymerizable or radiation polymerizable alkaline developing crosslinking curable resin composition possessing superior antiplating properties and a short stripping period, in which the stripped plate is not easily dissolved in the stripping fluid, and which is comprising:(a) 5-30 parts by weight of at least one compound possessing in one molecule on the average 1.5 or more (meth)acryloyloxy groups, which is obtained by reacting (meth)acrylic acid with a reaction product formed by adding, to a polyatomic alcohol possessing 3 or more OH groups in one molecule, an alkylene oxide containing propylene oxide in an amount of 67% molar or greater in an amount of 5-12 moles per mole of OH group in the aforementioned polyatomic alcohol,(b) 5-30 parts by weight of at least one crosslinkable monomer other than that stated above in (a) , possessing in one molecule 2 or more ethylenically unsaturated groups,(c) 45-75 parts by weight of a thermoplastic polymer for use as a binder, the thermoplastic polymer in turn being formed of 15-35 wt % of at least one .alpha., .beta.-unsaturated carboxyl group containing a monomer having 3-15 carbon atoms, and 65-85 wt % of another copolymerizable monomer, and(d) 0-10 parts by weight of a photopolymerization initiator.

摘要翻译： 一种可光聚合或可辐照聚合的碱性显影交联可固化树脂组合物，其具有优异的抗剥落性能和短的剥离时间，其中剥离板不容易溶解在剥离液中，并且其包含：（a）5-30重量份 至少一种在一个分子中具有平均1.5个或更多个（甲基）丙烯酰氧基的化合物，其通过使（甲基）丙烯酸与通过在一个具有3个或更多个OH基团的多原子醇中加入形成的反应产物 分子，在上述多原醇中每摩尔OH基团为5-12摩尔量的67摩尔％以上的环氧丙烷的环氧烷烃，（b）5-30重量份的至少一种可交联的 具有上述（a）中所述的单体，在一个分子中具有2个或更多个烯属不饱和基团，（c）45-75重量份用作粘合剂的热塑性聚合物，其它 另外，塑性聚合物又由15-35重量％的至少一种含有3-15个碳原子的单体的α，β-不饱和羧基和65-85重量％的另一个可共聚单体形成，和（d）0- 10重量份的光聚合引发剂。

公开(公告)号：US5149776A

公开(公告)日：1992-09-22

申请号：US614123

申请日：1990-11-16

申请人： Kenji Kushi ,  Ken-ichi Inukai ,  Takayuki Iseki ,  Seiya Koyanagi ,  Yasuyuki Fujimoto

发明人： Kenji Kushi ,  Ken-ichi Inukai ,  Takayuki Iseki ,  Seiya Koyanagi ,  Yasuyuki Fujimoto

IPC分类号： C08F2/44 ,  C08F2/48 ,  C09D4/00 ,  C09D133/04 ,  C09D133/08 ,  G03F7/033

CPC分类号： G03F7/033

摘要： A photopolymerizing cross-linking hardenable resin composition is disclosed which is comprised of a binder resin, cross-linking monomer and photopolymerization initiator. The composition of each of the above mentioned components is such that dry film resist incorporating the resin composition of the present invention and used in processes for selective etching and plating of printed circuit boards can be developed in weak aqueous alkaline solution after selective exposure to light. In this way, the efficient and economical manufacture of high definition printed circuit boards is made possible. Additionally, dry film resist incorporating the photopolymerizing cross-linking hardenable resin composition of the present invention lends to easy handling and storage characteristics.

公开(公告)号：US4789620A

公开(公告)日：1988-12-06

申请号：US880738

申请日：1986-07-01

申请人： Isao Sasaki ,  Kenji Kushi ,  Ken-ichi Inukai

发明人： Isao Sasaki ,  Kenji Kushi ,  Ken-ichi Inukai

IPC分类号： G03F7/027 ,  G03F7/032 ,  H05K3/28 ,  G03C1/68

CPC分类号： G03F7/032 ,  G03F7/027 ,  H05K3/287 ,  H05K2203/0793

摘要： Disclosed is a liquid photosensitive resin composition comprising(a) an at least partially carboxyl-modified multifunctional epoxy acrylate and/or multifunctional epoxy methacrylate having an average acid value of 4 to 150 and a number average molecular weight of not greater than 5,000,(b) an acrylic and/or methacrylic cross-linking monomer and/or oligomer other than the epoxy acrylate and/or epoxy methacrylate,(c) an acrylic and/or methacrylic monoethylenically vinyl monomer,(d) an inorganic filler, and(e) a photo-initiator and/or photosensitizer.This liquid photosensitive resin composition has excellent alkali developability, yields a cured coating film having good adhesion and good electrical insulating properties under high-humidity conditions, and is suitable for use as a solder resist in the fabrication of printed circuit boards.

摘要翻译： 公开了一种液体感光性树脂组合物，其包含（a）至少部分羧基改性的多官能环氧丙烯酸酯和/或平均酸值为4〜150，数均分子量为5000以下的多官能环氧丙烯酸酯（b ）丙烯酸和/或甲基丙烯酸单烯属乙烯基单体以外的丙烯酸和/或甲基丙烯酸交联单体和/或低聚物，（d）无机填料，和（e）丙烯酸和/ 光引发剂和/或光敏剂。 该液体感光性树脂组合物具有优异的碱显影性，得到在高湿度条件下具有良好的粘合性和良好的电绝缘性的固化涂膜，适用于制造印刷电路板的阻焊剂。

公开(公告)号：US4734238A

公开(公告)日：1988-03-29

申请号：US841840

申请日：1986-03-20

申请人： Teruhiko Sugimori ,  Hideaki Habara ,  Ken-ichi Inukai ,  Akihisa Furuno

发明人： Teruhiko Sugimori ,  Hideaki Habara ,  Ken-ichi Inukai ,  Akihisa Furuno

IPC分类号： B29B9/04 ,  B29B9/06 ,  C08F2/00 ,  C08F2/02 ,  C08F2/10 ,  C08F220/00 ,  C08F220/02 ,  C08J3/12

CPC分类号： C08J3/12 ,  B29B9/04 ,  B29B9/06 ,  C08F2/10 ,  C08J2333/14

摘要： The invention relates to a process for producing a powder of a cationic polymer by spreading on a moveable carrier a layer of an aqueous solution of a vinyl monomer, carrying out continuous polymerization followed by peeling off hydrous polymer from the carrier in a hot state, and cutting said hydrous polymer in a hot state by a shearing stress.

摘要翻译： 本发明涉及一种阳离子聚合物粉末的制造方法，其通过在可动载体上铺展乙烯基单体的水溶液层，进行连续聚合，然后在热态下从载体上剥离含水聚合物，以及 通过剪切应力在热态切割含水聚合物。

公开(公告)号：US5284736A

公开(公告)日：1994-02-08

申请号：US801386

申请日：1991-12-02

申请人： Kenji Kushi ,  Ken-ichi Inukai

发明人： Kenji Kushi ,  Ken-ichi Inukai

IPC分类号： C08F2/50 ,  G03F7/004 ,  G03F7/027 ,  G03F7/029 ,  G03F7/031 ,  G03F7/033 ,  H01L21/027 ,  H05K3/28 ,  C08F265/06

CPC分类号： G03F7/004 ,  G03F7/027 ,  H05K3/287

摘要： A flame-resistant, photo-curing resin composition of the present invention consists of:(a) 35 to 65 parts by weight of an acrylic thermoplastic polymer, the acrylic thermoplastic polymer being 15 to 30% by weight copolymerized with at least one of monomer containing an alpha, beta-unsaturated carboxyl group,(b) 5 to 30 parts by weight of a bromine-substituted monomer represented by a general formula [I]: ##STR1## wherein R.sub.1 is H or CH.sub.3,A is ##STR2## wherein R.sub.2 is an alkylene group containing two or three carbon atoms,n is an integer between 1 and 4, andX.sub.1, X.sub.2, and X.sub.3 are Br or H, under a condition that at least two of the X.sub.1, X.sub.2, and X.sub.3 are Br,(c) 0 to 10 parts by weight of antimony trioxide particles with an average diameter of 0.1 .mu.m or smaller,(d) 20 to 50 parts by weight of a vinyl monomer, excluding component (b), and(e) 0.01 to 10 parts by weight of a photo-polymerizing initiator, wherein a total amount of the component (a), (b), (c), (d), and(e) is 100 parts by weight.

摘要翻译： 本发明的阻燃光固化树脂组合物由以下组成：（a）35〜65重量份的丙烯酸系热塑性聚合物，所述丙烯酸系热塑性聚合物与单体中的至少一种共聚合15〜30重量％ 含有α，β-不饱和羧基，（b）5-30重量份由通式（I）表示的溴取代的单体：（*化学结构*）（I）其中R1是H或CH3， A是（*化学结构*）其中R2是含有两个或三个碳原子的亚烷基，n是1和4之间的整数，X 1，X 2和X 3是Br或H，条件是至少两个 X1，X2和X3是Br，（c）0至10重量份平均直径为0.1（my）m或更小的三氧化锑颗粒，（d）20至50重量份的乙烯基单体， 不包括组分（b）和（e）0.01至10重量份的光聚合引发剂，其中组分（a），（b），（c） ，（d）和（e）为100重量份。

公开(公告)号：US4970135A

公开(公告)日：1990-11-13

申请号：US411745

申请日：1989-09-25

申请人： Kenji Kushi ,  Ken-ichi Inukai

发明人： Kenji Kushi ,  Ken-ichi Inukai

IPC分类号： C08F120/10 ,  C08F220/10 ,  C08F290/00 ,  C08F299/02 ,  C08K3/18 ,  C08L67/00 ,  C09K21/08 ,  G03F7/027 ,  H05K3/28

CPC分类号： H05K3/287 ,  G03F7/027

摘要： Disclosed is a flame-retardant liquid photosensitive resin composition consisting essentially of(a) a (meth)acrylate obtained by the reaction of a compound having two or more epoxy groups in the molecule with (meth)acryalic acid and a dibasic acid or its anhydride, the (meth)acrylate having an average acid value of 4 to 150 and a number average molecular weight of 300 to 5,000;(b) a monomer having at least one (meth)acryloxyloxy group and containing not less than 20% by weight of bromine;(c) a monomer having two or more (meth)acryloxyloxy groups in the molecule;(d) a monomer having one (meth)acryloyloxy group in the molecule;(e) at least one inorganic filler; and(f) at least one photopolymerization catalyst selected from the group consisting of photo-initiators and photosensitizers,wherein the content of bromine in the total composition is in the range of 0.5 to 28% by weight.This flame-retardant liquid photosensitive resin composition has excellent homogeneity and alkali developability, yields a cured coating film having good adhesion, solvent resistance, thermal resistance, electrical insulating properties and flame retardancy, and is suitable for use as a solder resist in the fabrication of printed circuit boards.

公开(公告)号：US4985343A

公开(公告)日：1991-01-15

申请号：US473449

申请日：1990-02-01

申请人： Kenji Kushi ,  Ken-ichi Inukai ,  Takayuki Iseki ,  Yasuyuki Fujimoto

发明人： Kenji Kushi ,  Ken-ichi Inukai ,  Takayuki Iseki ,  Yasuyuki Fujimoto

IPC分类号： G03F7/027

CPC分类号： G03F7/027

摘要： A crosslinking-curable resin composition suitable for use in dry film resists, consisting essentially of(a) 40 to 70 parts by weight of a thermoplastic polymer binder obtained by copolymerizing four specific polymerizable substances in specific proportions;(b) 20 to 50 parts by weight of a crosslinkable monomer having one or more ethylenically unsaturated groups in the molecule and containing 51 to 100% by weight of a compound of the general formula ##STR1## where R.sub.2 is an alkylene group of 3 to 6 carbon atoms, R.sub.3 and R.sub.4 are hydrogen or methyl, and n is a positive whole number of 5 to 9; and(c) 0 to 10 parts by weight of a photopolymerization initiator;the combined amount of components (a) to (c) being 100 parts by weight.