摘要:
A method of making an encapsulated plasma sensitive device. The method comprises: providing a plasma sensitive device adjacent to a substrate; depositing a plasma protective layer on the plasma sensitive device using a process selected from non-plasma based processes, or modified sputtering processes; and depositing at least one barrier stack adjacent to the plasma protective layer, the at least one barrier stack comprising at least one decoupling layer and at least one barrier layer, the plasma sensitive device being encapsulated between the substrate and the at least one barrier stack, wherein the decoupling layer, the barrier layer, or both are deposited using a plasma process, the encapsulated plasma sensitive device having a reduced amount of damage caused by the plasma compared to an encapsulated plasma sensitive device made without the plasma protective layer. An encapsulated plasma sensitive device is also described.
摘要:
A tool for depositing multilayer coatings onto a substrate. In one configuration, the tool includes a includes an in-line organic material deposition station operating under at least one of a pressure or temperature controlled environment. In another, it further is of a hybrid design that incorporates both in-line and cluster tool features. In this latter configuration, at least one of the deposition stations is configured to deposit an inorganic layer, while at least one other deposition station is configured to deposit an organic layer. The tool is particularly well-suited to depositing multilayer coatings onto discrete substrates, as well as to encapsulating environmentally-sensitive devices placed on the flexible substrate.
摘要:
A tool for depositing multilayer coatings onto a substrate. The tool includes a housing defining a vacuum chamber connected to a vacuum source, deposition stations each configured to deposit a layer of multilayer coating on the substrate, a curing station, and a contamination reduction device. At least one of the deposition stations is configured to deposit an inorganic layer, while at least one other deposition station is configured to deposit an organic layer. In one tool configuration, the substrate may travel back and forth through the tool as many times as needed to achieve the desired number of layers of multilayer coating. In another, the tool may include numerous housings adjacently spaced such that the substrate may make a single unidirectional pass. The contamination reduction device may be configured as one or more migration control chambers about at least one of the deposition stations, and further includes cooling devices, such as chillers, to reduce the presence of vaporous layer precursors. The tool is particularly well-suited to depositing multilayer coatings onto flexible substrates, as well as to encapsulating environmentally-sensitive devices placed on the flexible substrate.
摘要:
A tool for depositing multilayer coatings onto a substrate. In one configuration, the tool includes a includes an in-line organic material deposition station operating under at least one of a pressure or temperature controlled environment. In another, it further is of a hybrid design that incorporates both in-line and cluster tool features. In this latter configuration, at least one of the deposition stations is configured to deposit an inorganic layer, while at least one other deposition station is configured to deposit an organic layer. The tool is particularly well-suited to depositing multilayer coatings onto discrete substrates, as well as to encapsulating environmentally-sensitive devices placed on the flexible substrate.
摘要:
An improved barrier stack. The barrier stack is made by the process of depositing the polymeric decoupling layer on a substrate; depositing a first inorganic layer on the decoupling layer under a first set of conditions wherein an ion and neutral energy arriving at the substrate is less than about 20 eV so that the first inorganic layer is not a barrier layer, wherein a temperature of the substrate is less than about 150° C.; and depositing a second inorganic layer on the first inorganic layer under a second set of conditions wherein an ion and neutral energy arriving at the substrate is greater than about 50 eV so that the second inorganic layer is a barrier layer. Methods of reducing damage to a polymeric layer in a barrier stack are also described.
摘要:
A method of making an encapsulated plasma sensitive device. The method comprises: providing a plasma sensitive device adjacent to a substrate; depositing a plasma protective layer on the plasma sensitive device using a process selected from non-plasma based processes, or modified sputtering processes; and depositing at least one barrier stack adjacent to the plasma protective layer, the at least one barrier stack comprising at least one decoupling layer and at least one barrier layer, the plasma sensitive device being encapsulated between the substrate and the at least one barrier stack, wherein the decoupling layer, the barrier layer, or both are deposited using a plasma process, the encapsulated plasma sensitive device having a reduced amount of damage caused by the plasma compared to an encapsulated plasma sensitive device made without the plasma protective layer. An encapsulated plasma sensitive device is also described.
摘要:
An improved barrier stack. The barrier stack is made by the process of depositing the polymeric decoupling layer on a substrate; depositing a first inorganic layer on the decoupling layer under a first set of conditions wherein an ion and neutral energy arriving at the substrate is less than about 20 eV so that the first inorganic layer is not a barrier layer, wherein a temperature of the substrate is less than about 150° C.; and depositing a second inorganic layer on the first inorganic layer under a second set of conditions wherein an ion and neutral energy arriving at the substrate is greater than about 50 eV so that the second inorganic layer is a barrier layer. Methods of reducing damage to a polymeric layer in a barrier stack are also described.
摘要:
A barrier film composite includes a decoupling layer and a barrier layer. The barrier layer includes a first region and a second region that is thinner than the first region.
摘要:
A barrier film composite includes a film with an undulating surface; and at least one decoupling layer and at least one barrier layer disposed on the undulating surface of the film.
摘要:
In one embodiment, the present invention relates generally to a multi-stage system for performing melt coalescence and separation, the multi-stage system. In one embodiment, the multi-stage system includes a first container for mixing a powder with a salt, the first container having an opening, a heating means coupled to the first container for heating the first container and a second container coupled to the first container.