公开(公告)号：US06147410A

公开(公告)日：2000-11-14

申请号：US33188

申请日：1998-03-02

申请人： Alexander J. Elliott ,  Timothy E. Meko ,  Gary R. Lorenzen ,  Kent Lamar Kime ,  Prosanto K. Mukerji ,  Keith W. Bailey ,  William L. Fragale ,  Pablo Rodriguez ,  George C. Chen

发明人： Alexander J. Elliott ,  Timothy E. Meko ,  Gary R. Lorenzen ,  Kent Lamar Kime ,  Prosanto K. Mukerji ,  Keith W. Bailey ,  William L. Fragale ,  Pablo Rodriguez ,  George C. Chen

IPC分类号： H01L23/495 ,  H01L23/48

CPC分类号： H01L24/06 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/05 ,  H01L24/40 ,  H01L24/41 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05551 ,  H01L2224/05563 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/37011 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/85399 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14

摘要： An electronic component includes a semiconductor substrate (101, 301, 401), an electrically conductive layer (102, 103, 302, 303, 402, 403) supported by the semiconductor substrate (101, 301, 401), and a lead (110, 120, 210, 310, 410, 420) having an electrical coupling portion (112, 122, 212, 312, 412, 422) coupled to and supported by the electrically conductive layer (102, 103, 302, 303, 402, 403) wherein the electrical coupling portion (112, 122, 212, 312, 412, 422) has at least one notch (115, 215, 315) adjacent to the electrically conductive layer (102, 103, 302, 303, 402, 403).

摘要翻译： 电子部件包括半导体衬底（101,301,401），由半导体衬底（101,301,401）支撑的导电层（102,103,302,303,402,403）和引线（110 ，具有耦合到所述导电层（102,103,302,303,402,403）的电耦合部分（112,122,212,312,412,422），所述电耦合部分 ），其中所述电耦合部分（112,122,212,312,412,422）具有与所述导电层（102,103,302,303,402,403）相邻的至少一个凹口（115,215,315） 。