Epoxy group-containing resin compositions
    1.
    发明授权
    Epoxy group-containing resin compositions 失效
    含环氧基团的树脂组合物

    公开(公告)号:US5399604A

    公开(公告)日:1995-03-21

    申请号:US094436

    申请日:1993-07-21

    摘要: An epoxy group-containing thermosetting resin composition comprising (A) a copolymer obtained from (a) at least one member selected from an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, (b) an epoxy group-containing unsaturated compound, (c) a monoolefin unsaturated compound, and optionally (d) a conjugated diolefin unsaturated compound, and (B) an organic solvent for dissolving the above copolymer. There is also provided another epoxy-group containing thermosetting resin composition which contains the above component (A), (C) a polymerizable compound having at least one ethylenically unsaturated double bond, and (D) a photopolymerization initiator. These epoxy-group containing thermosetting resin compositions are excellent in storage stability.

    摘要翻译: 含有环氧基的热固性树脂组合物,其包含(A)由(a)选自不饱和羧酸和不饱和羧酸酐中的至少一种的成分得到的共聚物,(b)含环氧基的不饱和化合物,(c) 单烯烃不饱和化合物和任选的(d)共轭二烯不饱和化合物,和(B)用于溶解上述共聚物的有机溶剂。 还提供另一种含环氧基的热固性树脂组合物,其含有上述组分(A),(C)具有至少一个烯属不饱和双键的可聚合化合物和(D)光聚合引发剂。 这些含环氧基的热固性树脂组合物的保存稳定性优异。

    Negative photoresist stripping liquid composition
    2.
    发明授权
    Negative photoresist stripping liquid composition 失效
    负光致抗蚀剂剥离液组成

    公开(公告)号:US6040117A

    公开(公告)日:2000-03-21

    申请号:US28290

    申请日:1998-02-24

    IPC分类号: G03F7/42

    CPC分类号: G03F7/426

    摘要: A negative photoresist stripping liquid composition is provided which comprises from 30 to 75% by weight of dimethyl sulfoxide, from 20 to 65% by weight of 1,3-dimethyl-2-imidazolidinone, from 0.1 to 5% by weight of a tetraalkylammonium hydroxide and from 0.5 to 15% by weight of water. The composition has a superior stripping performance especially against photoresists that are alkali-developable and can form films of at least 20 .mu.m in thickness, and has no problem of freezing even when stored outdoors in the winter. The composition is useful for the stripping of negative photoresists for bump formation and for fabricating circuit substrates.

    摘要翻译: 提供了一种负性光致抗蚀剂剥离液体组合物,其包含30至75重量%的二甲基亚砜,20至65重量%的1,3-二甲基-2-咪唑啉酮,0.1至5重量%的四烷基氢氧化铵 和0.5至15重量%的水。 该组合物具有优异的剥离性能,特别是对于可碱显影的光致抗蚀剂,并且可以形成厚度至少为20μm的膜,并且即使在冬季储存在户外时也不存在冷冻问题。 该组合物可用于剥离阴极光致抗蚀剂用于凸块形成和用于制造电路基板。

    Radiation sensitive resin composition and material for forming bumps
containing the same
    3.
    发明授权
    Radiation sensitive resin composition and material for forming bumps containing the same 失效
    辐射敏感性树脂组合物和用于形成含有它的凸块的材料

    公开(公告)号:US5965328A

    公开(公告)日:1999-10-12

    申请号:US925427

    申请日:1997-09-08

    摘要: A radiation sensitive resin composition comprising:(A) an alkali-soluble copolymer comprising:(a) 10 to 50% by weight of a first unit consisting of a radical polymerizable compound having a carboxylic group,(b) 20 to 60% by weight of a second unit consisting of a radical polymerizable compound having a cycloalkyl group, the unit containing no carboxyl group, and(c) 5 to 40% by weight of a third unit consisting of a radical polymerizable compound other than the radical polymerizable compounds in (a) and (b) above;(B) a polymerizable compound having at least one ethylenically unsaturated double bond; and(C) a radiation sensitive radical initiator. Also is disclosed a material for forming bumps containing the radiation sensitive resin composition. The radiation sensitive resin composition has sufficient developability with an alkali developer and sufficient resolution when the composition is in the form of a 20 .mu.m or more thick film. The composition and material of the present invention have excellent resistance to plating liquids and good wettability to plating liquids, and improved adhesion to substrates upon development. Therefore, the composition and material of the present invention can form bumps having sufficient characteristics by plating and give rise to a cured product which has excellent peelability from the substrate on which it is formed.

    摘要翻译: 一种辐射敏感性树脂组合物,其包含:(A)碱溶性共聚物,其包含:(a)10至50重量%的由具有羧基的自由基聚合性化合物组成的第一单元,(b)20至60重量% 由具有环烷基的自由基聚合性化合物,不含羧基的单元构成的第二单元,和(c)5〜40重量%的第三单元,由( a)和(b) (B)具有至少一个烯键式不饱和双键的聚合性化合物; 和(C)辐射敏感的自由基引发剂。 还公开了用于形成包含辐射敏感性树脂组合物的凸块的材料。 当组合物为20μm或更厚的膜的形式时,辐射敏感性树脂组合物与碱性显影剂具有足够的显影性和足够的分辨率。 本发明的组合物和材料具有优异的耐电镀性和对电镀液的良好润湿性,并且在显影时具有改进的与基材的粘合性。 因此,本发明的组合物和材料可以通过电镀形成具有足够特性的凸块,并产生与其形成的基板具有优异的剥离性的固化产物。

    Positive photoresist composition
    4.
    发明授权
    Positive photoresist composition 失效
    正光致抗蚀剂组合物

    公开(公告)号:US5942369A

    公开(公告)日:1999-08-24

    申请号:US13908

    申请日:1998-01-27

    CPC分类号: C08G8/08 G03F7/0233

    摘要: A positive photoresist composition including (A) 100 parts by weight of an alkali-soluble novolak resin, and based thereon; (B) 5 to 50 parts by weight of an alkali-soluble acrylic resin containing, as s, 10 to 80% by weight of a unit of a radical-polymerizable compound having an alcoholic hydroxyl group and 3 to 50% by weight of at least one of a unit of a radical-polymerizable compound having a carboxyl group and a unit of a radical-polymerizable compound having a phenolic hydroxyl group; (C) 5 to 100 parts by weight of a quinonediazide group-containing compound; and (D) a solvent, is provided. This composition has a good adhesion to substrates at the time of development and a good plating solution resistance and moreover can be well wetted with plating solutions, can be well developed with alkali developing solutions and can be well stripped from substrates at the resist unexposed areas, and is suited for the formation of thick films suitable as bump forming materials.

    摘要翻译: 一种正型光致抗蚀剂组合物,其包含(A)100重量份的碱溶性酚醛清漆树脂,并基于此; (B)5〜50重量份的碱溶性丙烯酸树脂,其中,s为10〜80重量%的具有醇羟基的自由基聚合性化合物和3〜50重量% 具有羧基的自由基聚合性化合物和具有酚性羟基的自由基聚合性化合物的单元中的至少一种; (C)5〜100重量份含醌二叠氮化物基团的化合物; 和(D)溶剂。 该组合物在显影时具有与基材的良好粘合性和良好的耐电镀溶液性,并且还可以用电镀液充分润湿,可以用碱性显影液充分发展,并且可以在抗蚀剂未曝光的区域从基材中良好剥离, 并且适于形成适合作为凸块形成材料的厚膜。

    Epoxy group-containing copolymer and radiation sensitive resin
compositions thereof
    6.
    发明授权
    Epoxy group-containing copolymer and radiation sensitive resin compositions thereof 失效
    含环氧基团的共聚物及其辐射敏感树脂组合物

    公开(公告)号:US5530036A

    公开(公告)日:1996-06-25

    申请号:US356544

    申请日:1994-12-15

    摘要: An epoxy group-containing thermosetting resin composition comprising (A) a copolymer obtained From (a) at least one member selected from an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, (b) an epoxy group-containing unsaturated compound, (c) a monoolefin unsaturated compound, and optionally (d) a conjugated diolefin unsaturated compound, and (B) an organic solvent for dissolving the above copolymer. There is also provided another epoxy-group containing thermosetting resin composition which contains the above component (A), (C) a polymerizable compound having at least one ethylenically unsaturated double bond, and (D) a photopolymerization initiator. These epoxy-group containing thermosetting resin compositions are excellent in storage stability.

    摘要翻译: 含有环氧基的热固性树脂组合物,其包含(A)从(a)至少一种选自不饱和羧酸和不饱和羧酸酐的成分得到的共聚物,(b)含环氧基的不饱和化合物,(c) 单烯烃不饱和化合物和任选的(d)共轭二烯不饱和化合物,和(B)用于溶解上述共聚物的有机溶剂。 还提供另一种含环氧基的热固性树脂组合物,其含有上述组分(A),(C)具有至少一个烯属不饱和双键的可聚合化合物和(D)光聚合引发剂。 这些含环氧基的热固性树脂组合物的保存稳定性优异。