摘要:
A semiconductor device includes a wiring board; a stack of semiconductor chips disposed over the wiring board, each of the semiconductor chip comprising via electrodes, the semiconductor chips being electrically coupled through the via electrodes to each other, the semiconductor chips being electrically coupled through the via electrodes to the wiring board; a first seal that seals the stack of semiconductor chips; and a second seal that covers the first seal. The first seal is smaller in elastic modulus than the second seal.
摘要:
There is provided a communication device including a secure communication unit configured to perform secure communication with an external reader/writer device, the secure communication being secure close-proximity communication, a first communication unit configured to perform high-speed communication with the reader/writer device, the high-speed communication being close-proximity communication that is faster than the secure communication, a second communication unit configured to, when communication via the high-speed communication is disconnected, communicate with the reader/writer device with a communication mode that is different from a communication mode of the high-speed communication, a power transmission unit configured to receive power transmitted from the reader-writer device by power transmission, and a secondary battery configured to store the power received by the power transmission unit. The second communication unit may be configured to, when communication via the high-speed communication is disconnected, operate with the power stored in the secondary battery.
摘要:
An instant photo film pack includes a pack case for containing a stack of ten self-processing photo film units. An outlet slit is formed in the pack case, for exiting an exposed one of the photo film units therethrough. A light-shielding flap has a substantially quadrilateral shape, for closing the outlet slit in a light-tight manner. The light-shielding flap has first, second and third predetermined adhering regions, at least which are coated with adhesive agent and attached to the pack case. The light-shielding flap has first and second longer side lines and first and second shorter side lines. The first adhering region has a linear shape and extends along the first longer side line. The second and third adhering regions have a dot shape, and are disposed respectively at the first and second shorter side lines. The outlet slit is disposed between the second and third adhering regions.
摘要:
A sheet photo film pack includes a pack housing for containing a stack of eight sheet photo film units. The counter device is used with the sheet photo film pack. A counter chamber is formed in the pack housing. A counter disk is contained in the counter chamber rotatably, and has first and second faces. A train of counter numerals are arranged on the first face in an arc-shaped manner at a predetermined pitch. Plural stepping claws are disposed on the first face to project in a thickness direction of the counter disk, arranged in an arc-shaped manner at the predetermined pitch, and rotationally shifted by an external mechanical shift signal. The shift signal is associated with each one of the sheet photo film units to be counted, and adapted to setting the counter numerals in a counter indicator window.
摘要:
A semiconductor device includes a wiring board; a stack of semiconductor chips disposed over the wiring board, each of the semiconductor chip comprising via electrodes, the semiconductor chips being electrically coupled through the via electrodes to each other, the semiconductor chips being electrically coupled through the via electrodes to the wiring board; a first seal that seals the stack of semiconductor chips; and a second seal that covers the first seal. The first seal is smaller in elastic modulus than the second seal.
摘要:
A semiconductor device includes a substrate, a stack of semiconductor chips, and a first sealing material. The substrate may include, but is not limited to, a chip mounting area and a higher-level portion. The higher level portion surrounds the chip mounting area. The higher-level portion is higher in level than the chip mounting area. The stack of semiconductor chips is disposed over the chip mounting area. A first sealing material seals the stack of semiconductor chips. The first sealing material is confined by the higher-level portion.
摘要:
There is provided a communication device including a secure communication unit configured to perform secure communication, the secure communication being secure close-proximity communication, a high-speed communication unit configured to perform high-speed communication, the high-speed communication being close-proximity communication that is faster than the secure communication, and a power transmission unit configured to perform power transmission. Communication via the secure communication and the power transmission of the power transmission unit may be performed at timings that do not temporally overlap with each other.
摘要:
There is provided a communication device including a secure communication unit configured to perform secure communication, the secure communication being secure close-proximity communication, a high-speed communication unit configured to perform high-speed communication, the high-speed communication being close-proximity communication that is faster than the secure communication, and a power transmission unit configured to perform power transmission. Communication via the secure communication and the power transmission of the power transmission unit may be performed at timings that do not temporally overlap with each other.
摘要:
An online distribution system by which the time required for a downloading procedure in a shop can be performed in a short time by a download terminal connected to a search server through a data distribution server which is connectable to a personal terminal. The search server stores a plurality of titles of distribution information, searches the titles for a title designated for subscription from the personal terminal, and stores the searched out title and identification information transmitted from the personal terminal. The download terminal acquires identification information inputted from the outside, reads out, based on the acquired identification information, the title which corresponds to the identification information from the search server, reads out the distribution information corresponding to the read out title from the data distribution server, and records the read out distribution information onto a recording medium.
摘要:
An ingot of a copper-base alloy containing a total of 0.01-30 wt % of at least one element selected from among Sn, Ni, P, Zn, Si, Fe, Co, Mg, Ti, Cr, Zr and Al, with the balance being Cu and incidental impurities, is homogenized by annealing, subjected to repeated cycles of cold rolling and annealing, then cold rolled at a reduction ratio Z which satisfies the following relation: Z≧100−10X−Y (1) [where Z is the percent reduction by cold rolling; X is the content in wt % of Sn; Y is the total content in wt % of any elements other than Sn], and thereafter subjected to cold annealing at a temperature below the recrystallization temperature to produce a copper-base alloy having a surface X-ray diffraction intensity ratio SND of at least 10 [SND=I{220}/I{200}; I{220} is the X-ray diffraction intensity of {220} and I{200} is the X-ray diffraction intensity of {200}] while exhibiting improved punching properties on press due to the balance between electrical conductivity, strength, spring property, hardness and bending properties.
摘要翻译:含有0.01-30重量%的选自Sn,Ni,P,Zn,Si,Fe,Co,Mg,Ti,Cr,Zr和Al中的至少一种元素的铜基合金锭, 余量为Cu和杂质,通过退火均质化,经过冷轧和退火的重复循环,然后以满足以下关系式的折算率Z进行冷轧; [Z为冷轧减少率; X为Sn的重量%含量; Y是除Sn以外的任何元素的重量%的总含量,然后在低于再结晶温度的温度下进行冷退火,得到表面X射线衍射强度比SND为至少10的铜基合金 [SND = I {220} / I {200}; I {220}是{220}的X射线衍射强度,I {200}是{200}的X射线衍射强度,同时由于导电性,强度,弹簧之间的平衡,在冲压时表现出改善的冲压性能 性能,硬度和弯曲性能。