公开(公告)号：US06882048B2

公开(公告)日：2005-04-19

申请号：US10103664

申请日：2002-03-21

申请人： Chikao Ikenaga ,  Kouji Tomita

发明人： Chikao Ikenaga ,  Kouji Tomita

IPC分类号： H01L23/28 ,  C25D7/00 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/6835 ,  H01L23/3107 ,  H01L23/49544 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/564 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48639 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： A lead frame used for the production of a semiconductor package, wherein each of terminals of the lead frame to be wire-bonded to electrodes provided on the top surface of the semiconductor device has one or two groove(s) for limiting a plating area of noble metal. Since grooves are provided in each terminal, the accuracy of the plating area can be easily checked visually. Further, the grooves absorb stress applied to the terminal when the molded semiconductor packages are individually separated from each other by punching or dicing, and the situation where molding compound comes off of the terminal is prevented. In addition, since the grooves absorb vibrational stress applied to the terminal after mounting a semiconductor on the printed circuit board, the reliability of assembly is improved.

摘要翻译： 一种用于生产半导体封装的引线框架，其中待引线框架的引线框架的每个端子设置在半导体器件的顶表面上的电极具有一个或两个用于限制电镀区域的电镀区域的凹槽 贵金属。 由于在每个端子中设置槽，因此可以容易地检查电镀区域的精度。 此外，当模制的半导体封装通过冲压或切割分开彼此分离时，凹槽吸收施加到端子的应力，并且防止了模制化合物从端子脱落的情况。 此外，由于凹槽在将半导体安装在印刷电路板上之后吸收施加到端子的振动应力，因此提高了组装的可靠性。

公开(公告)号：US5856568A

公开(公告)日：1999-01-05

申请号：US849072

申请日：1997-05-30

申请人： Kenji Okamoto ,  Takashi Nakagawa ,  Kouji Tomita

发明人： Kenji Okamoto ,  Takashi Nakagawa ,  Kouji Tomita

IPC分类号： C07B63/04 ,  C07C51/44 ,  C07C51/50 ,  C07C57/07 ,  C07C57/075 ,  C07C67/62 ,  C07C243/04 ,  C07C57/02 ,  C07C57/04

CPC分类号： C07C243/04 ,  C07B63/04 ,  C07C51/44 ,  C07C51/50 ,  C07C67/62

摘要： A process for inhibiting polymerization of a vinyl compound comprising using (A) one or both of N-nitrosophenylhydroxylamine and a salt thereof in combination with (B) a salt of copper or in combination with (B') a metal salt of a dialkyldithiocarbamic acid and (C) at least one selected from the group consisting of inorganic acids, salts of inorganic acids, and water.In accordance with the above process, stable continuous operation of a process for producing a vinyl compound, particularly acrylic acid or methacrylic acid, such as a distillation process of the vinyl compound, for a long time is enabled by effectively suppressing polymerization of the vinyl compound in the process or by effectively suppressing polymerization of the vinyl compound in the process while corrosion of the apparatus for the production is prevented.

摘要翻译： PCT No.PCT / JP96 / 02708 Sec。 371日期1997年5月30日 102（e）日期1997年5月30日PCT提交1996年9月20日PCT公布。 公开号WO97 / 12851 日本1997年4月10日一种抑制乙烯基化合物聚合的方法，包括使用（A）N-亚硝基苯基羟胺和其盐之一或两者与（B）铜盐或（B'）金属组合 二烷基二硫代氨基甲酸的盐和（C）选自无机酸，无机酸的盐和水的至少一种。 根据上述方法，通过有效地抑制乙烯基化合物的聚合，可以长时间稳定地连续操作乙烯基化合物，特别是丙烯酸或甲基丙烯酸的制备方法，例如乙烯基化合物的蒸馏方法 在该过程中或通过有效地抑制乙烯基化合物在该过程中的聚合，同时防止用于生产的装置的腐蚀。

公开(公告)号：US06897549B2

公开(公告)日：2005-05-24

申请号：US10340943

申请日：2003-01-13

申请人： Chikao Ikenaga ,  Kouji Tomita

发明人： Chikao Ikenaga ,  Kouji Tomita

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A frame for a semiconductor package has die-pads supported with suspending leads of individual lead frames. Semiconductor devices are arranged on the die-pads. These semiconductor devices are collectively molded with molding compound, and then the collectively molded semiconductor packages are cut into individual packages by means of a dicing saw. In the frame, suspending leads are formed into fish tails, wherein at least one of a longitudinal grid-lead and a transverse grid-lead is eliminated within areas enclosed with fish tails of the suspending leads. Accordingly, whether an R-shape generated by producing the frame by etching is large or small, the existence of metal pieces at the edges of the semiconductor packages is substantially prevented.

摘要翻译： 用于半导体封装的框架具有由单个引线框的悬挂引线支撑的管芯焊盘。 半导体器件布置在管芯焊盘上。 这些半导体器件通过模制化合物共同模制，然后通过切割锯将集体模制的半导体封装切成单独的封装。 在框架中，悬挂引线形成鱼尾，其中在由悬挂引线的鱼尾围成的区域内消除了纵向网格引线和横向网格引线中的至少一个。 因此，通过蚀刻制造框架产生的R形状是否大或小，基本上防止了半导体封装的边缘处的金属片的存在。

公开(公告)号：US20050106777A1

公开(公告)日：2005-05-19

申请号：US11017896

申请日：2004-12-21

申请人： Chikao Ikenaga ,  Kouji Tomita

发明人： Chikao Ikenaga ,  Kouji Tomita

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L21/44

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A frame for a semiconductor package has die-pads supported with suspending leads of individual lead frames. Semiconductor devices are arranged on the die-pads. These semiconductor devices are collectively molded with molding compound, and then the collectively molded semiconductor packages are cut into individual packages by means of a dicing saw. In the frame, suspending leads are formed into fish tails, wherein at least one of a longitudinal grid-lead and a transverse grid-lead is eliminated within areas enclosed with fish tails of the suspending leads. Accordingly, whether an R-shape generated by producing the frame by etching is large or small, the existence of metal pieces at the edges of the semiconductor packages is substantially prevented.

公开(公告)号：US07247515B2

公开(公告)日：2007-07-24

申请号：US11017896

申请日：2004-12-21

申请人： Chikao Ikenaga ,  Kouji Tomita

发明人： Chikao Ikenaga ,  Kouji Tomita

IPC分类号： H01L21/00

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A frame for a semiconductor package has die-pads supported with suspending leads of individual lead frames. Semiconductor devices are arranged on the die-pads. These semiconductor devices are collectively molded with molding compound, and then the collectively molded semiconductor packages are cut into individual packages by means of a dicing saw. In the frame, suspending leads are formed into fish tails, wherein at least one of a longitudinal grid-lead and a transverse grid-lead is eliminated within areas enclosed with fish tails of the suspending leads. Accordingly, whether an R-shape generated by producing the frame by etching is large or small, the existence of metal pieces at the edges of the semiconductor packages is substantially prevented.

摘要翻译： 用于半导体封装的框架具有由单个引线框的悬挂引线支撑的管芯焊盘。 半导体器件布置在管芯焊盘上。 这些半导体器件通过模制化合物共同模制，然后通过切割锯将集体模制的半导体封装切成单独的封装。 在框架中，悬挂引线形成鱼尾，其中在由悬挂引线的鱼尾围成的区域内消除了纵向网格引线和横向网格引线中的至少一个。 因此，通过蚀刻制造框架产生的R形状是否大或小，基本上防止了半导体封装的边缘处的金属片的存在。

公开(公告)号：US06744118B2

公开(公告)日：2004-06-01

申请号：US09850212

申请日：2001-05-07

申请人： Chikao Ikenaga ,  Kouji Tomita

发明人： Chikao Ikenaga ,  Kouji Tomita

IPC分类号： H01L23495

CPC分类号： H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A frame for a semiconductor package includes plural lead frames arranged through grid-leads in a matrix. Semiconductor devices are mounted on individual lead frames of the frame, and are molded with molding compound. Thereafter, the molded semiconductor devices are cut at grid-leads by means of a dicing saw so that individual semiconductor packages are obtained. The frame further has groove portions which are formed by etching the frame from the front or back at areas corresponding to grid-leads, so that the grid-leads are made thin which reduces burrs and the generation of metal powders and dust.

摘要翻译： 用于半导体封装的框架包括以矩阵形式布置成格栅引线的多个引线框架。 半导体器件安装在框架的单个引线框架上，并用模制复合材料模制。 此后，通过切割锯将模制的半导体器件切割成格栅引线，从而获得单独的半导体封装。 框架还具有通过在与栅格引线相对应的区域从前面或后面蚀刻框架形成的凹槽部分，使得网格引线变薄，这减少了毛刺和金属粉末和灰尘的产生。

公开(公告)号：US06703696B2

公开(公告)日：2004-03-09

申请号：US09945210

申请日：2001-08-31

申请人： Chikao Ikenaga ,  Kouji Tomita ,  Tsuyoshi Tsunoda

发明人： Chikao Ikenaga ,  Kouji Tomita ,  Tsuyoshi Tsunoda

IPC分类号： H01L2144

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/48839 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/85439 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01033

摘要： A semiconductor package is comprised of a semiconductor device 4 mounted on a die-pad 3, a wire 6 for electrically connecting some electrodes of the semiconductor device 4 and terminals 5 of lead frame, wires 8 for bonding the other electrodes of semiconductor device to the surface of die-pad for grounding, and molding compound 7 for encapsulating the outer area of semiconductor device 4 under a state where the back face of die-pad 3. The lower face and side face of terminals 5 are exposed, wherein portions plated with silver for connecting of wires on the surface of the die-pad are formed at points positioned between a peripheral edge of the die-pad and an outer edge of the semiconductor device while leaving spaces from both the edges. The adhesion of die-pad 3 to bonding compound 7 is improved to avoid the occurrence of wires coming-off even if heat is applied to the contact points of die-pad 3 to wires 8 when mounting semiconductor package on a printed circuit board.

摘要翻译： 半导体封装由安装在芯片焊盘3上的半导体器件4，用于电连接半导体器件4的一些电极和引线框架的端子5的导线6，用于将半导体器件的其它电极接合到 用于接地的焊盘的表面，以及用于将半导体器件4的外部区域封装在模具垫3的背面的状态的模制化合物7.端子5的下表面和侧面被暴露，其中镀有 在芯片的表面上连接线的银形成在位于芯片的周边边缘和半导体器件的外边缘之间的位置处，同时从两个边缘留出空间。 即使在将半导体封装安装在印刷电路板上时，即使在芯片焊盘3的接触点向布线8施加热量，也可以提高模焊盘3与粘合剂7的密合性。

公开(公告)号：US06703694B2

公开(公告)日：2004-03-09

申请号：US09850213

申请日：2001-05-07

申请人： Chikao Ikenaga ,  Kouji Tomita

发明人： Chikao Ikenaga ,  Kouji Tomita

IPC分类号： H01L23495

CPC分类号： H01L23/49548 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A frame for semiconductor packages has die-pads supported with suspending leads of individual lead frames. Semiconductor devices are mounted on the respective die-pads. These semiconductor devices are collectively molded with molding compound, and then the collectively molded semiconductor packages are cut into individual packages by means of a dicing saw. In the frame, thin parts are formed in areas corresponding to the roots of individual terminals, the thin parts being formed by half-etching metal of the areas from the front or back thereof. Alternatively, hollows are formed in areas corresponding to the roots of individual terminals.

摘要翻译： 用于半导体封装的框架具有由独立引线框架的引脚悬挂的裸片焊盘。 半导体器件安装在相应的芯片焊盘上。 这些半导体器件通过模制化合物共同模制，然后通过切割锯将集体模制的半导体封装切成单独的封装。 在框架中，薄部分形成在与各个端子的根相对应的区域中，薄部分由其前面或后面的区域的半刻蚀金属形成。 或者，在与各个端子的根相对应的区域中形成中空部。

公开(公告)号：US6051735A

公开(公告)日：2000-04-18

申请号：US210885

申请日：1998-12-15

申请人： Kenji Okamoto ,  Takashi Nakagawa ,  Hideaki Mimaki ,  Kouji Tomita

发明人： Kenji Okamoto ,  Takashi Nakagawa ,  Hideaki Mimaki ,  Kouji Tomita

IPC分类号： C07B63/04 ,  C07C51/50 ,  C07C57/075 ,  C07C57/04

CPC分类号： C07C51/50 ,  C07B63/04

摘要： There is disclosed a process for prevention the polymerization of a vinyl compound selected from acrylic acid and methacrylic acid which comprises allowing at least one corrosion inhibitive substance selected from an alcohol and inorganic acid or salt thereof, an aromatic carboxylic acid or salt thereof and a zinc-containing salt to coexist with a metallic salt of dithiocarbamic acid, in prevention the polymerization of the vinyl compound with the metallic salt of dithiocarbamic acid.

摘要翻译： 公开了一种防止选自丙烯酸和甲基丙烯酸的乙烯基化合物的聚合的方法，其包括使至少一种选自醇和无机酸或其盐的腐蚀抑制物质，芳族羧酸或其盐和锌 的含盐与二硫代氨基甲酸的金属盐共存，以防止乙烯基化合物与二硫代氨基甲酸的金属盐的聚合。

公开(公告)号：US5886220A

公开(公告)日：1999-03-23

申请号：US793600

申请日：1997-03-05

申请人： Kenji Okamoto ,  Takashi Nakagawa ,  Hideaki Mimaki ,  Kouji Tomita

发明人： Kenji Okamoto ,  Takashi Nakagawa ,  Hideaki Mimaki ,  Kouji Tomita

IPC分类号： C07B63/04 ,  C07C51/50 ,  C07C57/075 ,  C07C57/04 ,  C07C57/02

CPC分类号： C07C51/50 ,  C07B63/04

摘要： There is disclosed a process for preventing the polymerization of a vinyl compound which comprises allowing water in an amount of 0.05 to 5% by weight based on the vinyl compound or a corrosion inhibitive substance selected from an alcohol, an inorganic acid or its salt, an aromatic carboxylic acid or its salt and a zinc-containing salt in an amount of preferably 0.01 to 5% by weight based on the same, to coexist with a metallic salt of dithiocarbamic acid, in preventing the polymerization of the vinyl compound with the metallic salt of dithiocarbamic acid. The above process makes it possible to effectively inhibit the polymerization of acrylic acid, methacrylic acid, etc. in the distillation system, etc. of the production process for the above acids as well as the corrosion of the equipment and machinery to be used therein and also to assure long-term stable continuous operation of the equipment and machinery.

摘要翻译： PCT No.PCT / JP95 / 01705 Sec。 371日期1997年3月5日 102（e）1997年3月5日PCT PCT 1995年8月29日PCT公布。 出版物WO96 / 07631 日期：1996年3月14日公开了一种防止乙烯基化合物聚合的方法，该方法包括使乙烯基化合物或选自醇，无机酸的腐蚀抑制物质为0.05〜5重量％ 或其盐，芳族羧酸或其盐和含锌盐的含量相对于二硫代氨基甲酸的金属盐优选为0.01-5重量％，以防止乙烯基聚合反应 与二硫代氨基甲酸的金属盐化合物。 上述方法使得有可能有​​效地抑制上述酸的制备方法的蒸馏系统中的丙烯酸，甲基丙烯酸等的聚合以及其中使用的设备和机器的腐蚀， 也保证设备和机械的长期稳定连续运行。