公开(公告)号：US5177326A

公开(公告)日：1993-01-05

申请号：US779909

申请日：1991-10-21

Applicant: Kurt R. Goldhammer

Inventor： Kurt R. Goldhammer

IPC: H01L21/48 ,  H01L21/68 ,  H01L23/498 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L21/6835 ,  H01L21/4842 ,  H01L21/4853 ,  H01L23/49811 ,  H05K3/3426 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K2201/10727 ,  H05K2201/10757 ,  H05K2201/10924 ,  H05K2201/10946 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49147

Abstract: A lead wire array for a leadless chip carrier which functions to mount and electrically interconnect a leadless chip carrier to a printed wiring board. The array is formed from a length of bare wire which is appropriately folded and bent to provide interconnections between the contact pads on the leadless chip carrier and contact pads on the printed wiring board, which are then separated by removing portions of the lead wire array after its attachment to the leadless chip carrier.

Abstract translation: 一种用于无引线芯片载体的引线阵列，其用于将无引线芯片载体安装并电连接到印刷线路板。 阵列由裸线形成，其被适当地折叠和弯曲，以在无引线芯片载体上的接触焊盘和印刷线路板上的接触焊盘之间提供互连，然后通过去除引线阵列的部分之后被去除 其连接到无引线芯片载体。

公开(公告)号：USRE34291E

公开(公告)日：1993-06-22

申请号：US884696

申请日：1992-05-18

Applicant: Ralph Liguori ,  Kurt R. Goldhammer ,  Lothar Laermer

Inventor： Ralph Liguori ,  Kurt R. Goldhammer ,  Lothar Laermer

IPC: H01L21/66 ,  H01L23/055 ,  H01L23/057 ,  H01L23/10 ,  H01L23/538 ,  H05K5/00

CPC classification number: H01L22/00 ,  H01L23/055 ,  H01L23/057 ,  H01L23/10 ,  H01L23/5384 ,  H01L23/5385 ,  H05K5/0095 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/16152

Abstract: A Very Large Hybrid Module (VLHM) for packaging electronic components provides a hermetic enclosure formed by a hermetic substrate on which the components are mounted together with a hermetic lid surrounding groups of the components. A second substrate outside the hermetic enclosure is utilized for providing connections between the electronic components.

公开(公告)号：US4996630A

公开(公告)日：1991-02-26

申请号：US413432

申请日：1989-09-27

Applicant: Ralph Liguori ,  Kurt R. Goldhammer ,  Lothar Laermer

Inventor： Ralph Liguori ,  Kurt R. Goldhammer ,  Lothar Laermer

IPC: H01L25/18 ,  H01L23/055 ,  H01L23/057 ,  H01L23/10 ,  H01L23/538 ,  H01L25/04 ,  H01L25/16 ,  H05K5/00

CPC classification number: H01L23/5384 ,  H01L23/055 ,  H01L23/057 ,  H01L23/10 ,  H01L23/5385 ,  H01L25/16 ,  H05K5/0091 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/3025

Abstract: A Very Large Hybrid Module (VLHM) for packaging electronic components provides a hermetic enclosure formed by a hermetic substrate on which the components are mounted together with a hermetic lid surrounding groups of the components. A second substrate outside the hermetic enclosure is utilized for providing connections between the electronic components.

Abstract translation: 用于包装电子部件的非常大的混合模块（VLHM）提供了由密封基底形成的密封外壳，其上部件与围绕组件组的密封盖一起安装在其上。 密封外壳之外的第二基板用于提供电子部件之间的连接。