摘要:
Provided are a semiconductor device including a fuse focus detector, a fabrication method thereof and a laser repair method. In a chip region, fuses may be formed at a first level. A fuse focus detector including first and second conductive layers may be formed in a scribe line region. The first conductive layer may be formed at the first level, while the second conductive layer may be formed at a different level. For a laser repair method, a target region may be divided into sub-regions. In one selected sub-region, the fuse focus detector may be laser scanned in a direction for a reflection light measurement providing information on a thickness of the fuse focus detector. Using the thickness information, a focus offset value of a fuse in the selected sub-region may be calculated. When the focus offset value is within an allowable range, fuse cutting may be performed.
摘要:
A method and system for testing a semiconductor device is disclosed. The method provides an integrated test program defined by a plurality of test items, and a test program defined by a sub-set of the test items. Test data is derived by batch sample testing of the semiconductor device, and an error rate for a test item is computed and then compared to a reference data value. On the basis of the comparison between the error rate and the reference data value, the test program may be modified in real-time.
摘要:
Provided are a semiconductor device including a fuse focus detector, a fabrication method thereof and a laser repair method. In a chip region, fuses may be formed at a first level. A fuse focus detector including first and second conductive layers may be formed in a scribe line region. The first conductive layer may be formed at the first level, while the second conductive layer may be formed at a different level. For a laser repair method, a target region may be divided into sub-regions. In one selected sub-region, the fuse focus detector may be laser scanned in a direction for a reflection light measurement providing information on a thickness of the fuse focus detector. Using the thickness information, a focus offset value of a fuse in the selected sub-region may be calculated. When the focus offset value is within an allowable range, fuse cutting may be performed.
摘要:
Example embodiments may provide a method of testing semiconductor devices by identifying units of lots and a test tray such that a plurality of lots having semiconductor devices may be continuously tested by a handler. Example embodiments may also provide a handler used to test the semiconductor devices.
摘要:
A test apparatus includes one handler connected to a tester and one test board divided into two or more sites or two or more test boards. Since only the sites on the test board (or test boards) need be duplicated, rather than the loading lanes or sorters of the handler, the test apparatus can be conveniently compact. Further, while testing semiconductor devices on one site or one test board, semiconductor devices in another site or on another test board can be sorted according to the test result. This enables the reduction or elimination of tester idle time to optimize the efficiency of the test apparatus.
摘要:
Example embodiments may provide a method of testing semiconductor devices by identifying units of lots and a test tray such that a plurality of lots having semiconductor devices may be continuously tested by a handler. Example embodiments may also provide a handler used to test the semiconductor devices.
摘要:
A fuse box including make-links and a redundancy address decoder including the fuse box are provided. It is preferable that the fuse box includes a plurality of make-links for programming an address of a defective normal memory cell with an address of a corresponding redundant memory cell, and the address is a row address or a column address. The redundant address decoder includes a fuse box having a plurality of make-links for decoding an address of a defect cell and a redundant word line selection circuit for selecting a word line of a redundant cell corresponding to the address of the defect cell in response to a signal output from the fuse box.
摘要:
A method and system for testing a semiconductor device is disclosed. The method provides an integrated test program defined by a plurality of test items, and a test program defined by a sub-set of the test items. Test data is derived by batch sample testing of the semiconductor device, and an error rate for a test item is computed and then compared to a reference data value. On the basis of the comparison between the error rate and the reference data value, the test program may be modified in real-time.
摘要:
A device and method of manufacturing a fuse region are disclosed. The fuse region may include an interlayer insulating layer formed on a substrate, a plurality of fuses disposed on the interlayer insulating layer, and fuse isolation walls located between the fuses, wherein each of the fuse isolation walls may include lower and upper fuse isolation patterns.
摘要:
A test system of a semiconductor device for a handler remote control is provided. The system includes: a tester for testing the semiconductor device; a handler connected to the tester through a GPIB (General Purpose Instruction Bus) communication cable; a tester server connected to the tester to download a test program, handler remote control program and a handler state check program to the tester; and communication data transmitted and received through the GPIB communication cable between the tester and the handler, wherein the communication data has basic communication data for an electrical test of the semiconductor device, communication data for the handler remote control, and communication data for a handler state check.