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1.INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER SUPPORT STRUCTURE MECHANISM AND METHOD OF MANUFACTURE THEREOF 有权
标题翻译: 具有插入式支撑结构机构的集成电路包装系统及其制造方法公开(公告)号:US20160190054A1
公开(公告)日:2016-06-30
申请号:US14792447
申请日:2015-07-06
申请人: SooSan Park , KyuSang Kim , YeoChan Ko , KeoChang Lee , HeeJo Chi , HeeSoo Lee
发明人: SooSan Park , KyuSang Kim , YeoChan Ko , KeoChang Lee , HeeJo Chi , HeeSoo Lee
IPC分类号: H01L23/498 , H01L21/56 , H01L23/31 , H01L23/00 , H01L23/538
CPC分类号: H01L23/49833 , H01L21/4853 , H01L21/486 , H01L21/56 , H01L23/3121 , H01L23/3128 , H01L23/3142 , H01L23/4828 , H01L23/49816 , H01L23/49827 , H01L23/49894 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/131 , H01L2224/16227 , H01L2224/2919 , H01L2224/2929 , H01L2224/29387 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/83104 , H01L2224/92 , H01L2224/92125 , H01L2924/00014 , H01L2924/14 , H01L2924/15331 , H01L2924/15747 , H01L2924/181 , H01L2924/3511 , H01L2924/3512 , H01L2924/014 , H01L2924/0665 , H01L2924/05442 , H01L2224/81 , H01L2224/83 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A system and method of manufacture of an integrated circuit packaging system includes: a base substrate, the base substrate includes a base terminal; an integrated circuit device on the base substrate; a bottom conductive joint on the base terminal; a conductive ball on the bottom conductive joint, the conductive ball includes a core body; and an interposer over the conductive ball.
摘要翻译: 一种集成电路封装系统的制造方法和制造方法,其特征在于,包括:基底基板,所述基底基板包括基底; 在基底基板上的集成电路器件; 基端子上的底部导电接头; 底部导电接头上的导电球,导电球包括芯体; 以及导电球上的插入件。