摘要:
A system and method of manufacture of an integrated circuit packaging system includes: a base substrate, the base substrate includes a base terminal; an integrated circuit device on the base substrate; a bottom conductive joint on the base terminal; a conductive ball on the bottom conductive joint, the conductive ball includes a core body; and an interposer over the conductive ball.
摘要:
Semiconductor packages with multiple substrates can incorporate apertures or slots between devices to minimize or reduce formation of defects during a molding process. The apertures or slots can be formed adjacent a top substrate in alignment with removable regions adjacent a bottom substrate whereby the apertures or slots can facilitate outflow of materials from cavities between the substrates. The apertures or slots may subsequently be removed in conjunction with the removable regions during a singulation process thereby producing the desired semiconductor packages with improved device reliability and yield.
摘要:
Simultaneous semiconductor packages can be produced using a dual-sided film-assist molding process. The process involves using a film or membrane having opposing surfaces for receiving un-encapsulated semiconductor packages on both surfaces. A slot can be formed in the film or membrane to facilitate introduction and passage of the encapsulation therethrough such that upon removal of the film or membrane, increased throughput and productivity of the completed semiconductor packages can be carried out to achieve considerable cost savings.