公开(公告)号：US11383972B2

公开(公告)日：2022-07-12

申请号：US17265230

申请日：2019-07-31

Applicant: LPKF Laser & Electronics AG

Inventor： Roman Ostholt ,  Norbert Ambrosius

IPC: B81C1/00

Abstract: A method for producing a microstructure in a substrate with a membrane-like bridging or overhanging surface includes modifying the substrate, which is made of glass, by laser radiation along a peripheral contour. A membrane layer is applied over a surface of the substrate for producing the bridging or overhanging surface, wherein, at least in partial surfaces enclosing the peripheral contour of the laser modifications, a sacrificial layer is disposed between the substrate and the membrane layer. A side of the substrate facing away from the membrane layer is exposed to an etching attack such that material is removed primarily along the peripheral contour until the sacrificial layer is reached and there is a disintegration or reduction of the sacrificial layer and a separation of a connection of a part of the substrate enclosed by the peripheral contour from the surrounding substrate and from the membrane layer.

公开(公告)号：US11377387B1

公开(公告)日：2022-07-05

申请号：US17608996

申请日：2020-04-23

Applicant: LPKF Laser & Electronics AG ,  Roman Ostholt ,  Norbert Ambrosius

Inventor： Roman Ostholt ,  Norbert Ambrosius

IPC: C03C15/00 ,  C03C23/00 ,  B23K26/364 ,  B23K103/00 ,  B81C1/00

Abstract: A method for producing microstructures includes introducing modifications by a laser beam into a volume between two opposite outer surfaces of a glass substrate. An etching method is carried out which provides anisotropic material removal in one of the outer surfaces so as to produce recesses that have a conical shape. A layer that is resistant to an etching effect of the etching method is applied as a cover layer to only one outer surface. Then, a further etching method is carried out so that material is removed in the other outer surface until recesses of this other outer surface, which are produced and/or enlarged by the further etching method, have reached the cover layer.

公开(公告)号：US20220089482A1

公开(公告)日：2022-03-24

申请号：US17420879

申请日：2020-01-29

Applicant: LPKF LASER & ELECTRONICS AG

Inventor： Robin Krüger ,  Roman Ostholt ,  Norbert Ambrosius ,  Oktavia Ostermann ,  Bernd Rösener ,  Daniel Dunker ,  Arne Schnoor ,  Malte Schulz-Ruhtenberg

IPC: C03C27/08 ,  B32B17/06 ,  B32B3/26 ,  C03C23/00

Abstract: The invention relates to a process for connecting glass substrates which allows glass substrates to be aligned in a site-specific manner and to subsequently be connected to one another, and to the site-specifically aligned and interconnected glass substrates. Generally, the process relates to connecting glass substrates to one another, optionally also without site-specific alignment. The interconnected glass substrates obtainable by processes according to the invention are characterized by a firm bond with one another, which is preferably formed by solidified glass solder that is in form-fitting engagement with the glass substrates. Therein, recesses, which are preformed in the glass substrate, with glass solder are used for aligning and optionally for connecting the glass substrates.

公开(公告)号：US11065716B2

公开(公告)日：2021-07-20

申请号：US16613444

申请日：2018-04-06

Applicant: LPKF Laser & Electronics AG

Inventor： Roman Ostholt ,  Norbert Ambrosius ,  Daniel Dunker ,  Arne Schnoor

IPC: B23K26/0622 ,  B23K26/362 ,  B23K26/402 ,  C03C15/00 ,  B23K26/00 ,  B23K26/361 ,  C03B33/02 ,  C03C23/00 ,  B23K26/53 ,  B23K103/00

Abstract: A method for machining, in particular for cutting an, in particular, planar substrate by laser-induced deep etching includes: moving laser radiation along a machining line; directing individual pulses onto the planar substrate at a spatial laser pulse distance (d); and subsequently removing an anisotropic material by etching at an etching rate (r) and an etching duration (t). Machining parameters are set according to a condition: 1>d/(R*t)>10−5.

公开(公告)号：US20180332711A1

公开(公告)日：2018-11-15

申请号：US15768190

申请日：2016-09-30

Applicant: PLASMA INNOVATIONS GMBH ,  LPKF LASER & ELECTRONICS AG

Inventor： Michael BISGES ,  Roman OSTHOLT ,  Bernd RÖSENER ,  Daniel DUNKER

IPC: H05K3/10 ,  C23C24/10 ,  H05K3/14 ,  H05K3/18

CPC classification number: H05K3/102 ,  C23C24/106 ,  H05K3/02 ,  H05K3/14 ,  H05K3/182 ,  H05K2203/025 ,  H05K2203/0522 ,  H05K2203/081 ,  H05K2203/088 ,  H05K2203/095 ,  H05K2203/107 ,  H05K2203/1344

Abstract: A method for creating patterned coatings on a molded article includes providing a molded article which has a surface comprising a first area and a second area, at least one surface property in the first area of the surface being different from that in the second area, applying a coating covering at least the first area and the second area to the surface of the molded article, the adhesion of said coating being greater in the first area than in the second area because of the at least one different surface property, and partially removing the coating by means of a removal process which is applied to the entire coating at a constant removal power that is determined such that the entire coating is removed in the second area while the coating remains in place on an entire surface of the first area.

公开(公告)号：US20170341971A1

公开(公告)日：2017-11-30

申请号：US15681464

申请日：2017-08-21

Applicant: LPKF Laser & Electronics AG

Inventor： Robin Alexander Krueger ,  Norbert Ambrosius ,  Roman Ostholt

IPC: C03B33/02 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/364 ,  B23K26/00 ,  C03C15/00 ,  C03B33/09 ,  C03B33/033 ,  B23K26/402 ,  C03C17/00 ,  B23K26/06 ,  B23K101/40 ,  B23K103/00

CPC classification number: C03B33/0222 ,  B23K26/0006 ,  B23K26/0619 ,  B23K26/0624 ,  B23K26/064 ,  B23K26/364 ,  B23K26/402 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/54 ,  B23K2103/56 ,  C03B33/033 ,  C03B33/091 ,  C03C15/00 ,  C03C17/002 ,  C03C2218/32

Abstract: An aspect of the invention provides a device, comprising: a laser machining head configured to deflect laser radiation onto an optical system comprising a substrate, the device being configured to carry out a method for separating the substrate using the optical system, the optical system being configured to provide the laser radiation, a thickness of the substrate not exceeding 2 mm in a region of a separating line, the method comprising: applying pulsed laser radiation having a pulse duration (t) to a substrate material of the substrate using the optical system, the substrate material being transparent at least in part to a laser wavelength of the pulsed laser radiation, the pulsed laser radiation being focused using the optical system at an original focal depth (f1), an intensity of the pulsed laser radiation leading to a modification of the substrate along a beam axis (Z) of the pulsed laser radiation.

公开(公告)号：US20170256422A1

公开(公告)日：2017-09-07

申请号：US15511272

申请日：2015-08-07

Applicant: LPKF Laser & Electronics AG

Inventor： Norbert Ambrosius ,  Roman Ostholt

IPC: H01L21/48 ,  B23K26/382 ,  B23K26/0622

Abstract: A method for introducing at least one cutout, in particular in the form of an aperture, into a sheetlike workpiece having a thickness of less than 3 mm, involving detecting a laser beam onto the surface of the workpiece, selecting the exposure time of the laser beam to be extremely short so that only a modification of the workpiece concentrically around a beam axis of the laser beam occurs, such a modified region having defects resulting in a chain of blisters, and, as a result of the action of a corrosive medium, anisotropically removing material by successive etching in those regions of the workpiece that are formed by the defects and have previously been modified by the laser beam, resulting, along the cylindrical zone of action, in producing a cutout as an aperture in the workpiece.

公开(公告)号：US12221376B2

公开(公告)日：2025-02-11

申请号：US17426243

申请日：2020-01-29

Applicant: LPKF LASER & ELECTRONICS AG

Inventor： Robin Krüger ,  Oktavia Ostermann ,  Bernd Rösener ,  Malte Schulz-Ruhtenberg ,  Roman Ostholt ,  Tobias Jaus ,  Anna Kolossowski

IPC: C03C17/32 ,  C03C15/00 ,  C03C23/00 ,  C03C27/06

Abstract: A process for the production of a glass-plastic connection which is form-fitting, and to a form-fitting composite between glass and plastic which is obtainable by the process. The process and the glass-plastic composite are characterized in that a glass, which in particular is planar, neither during the process nor in the glass-plastic composite is subjected to a mechanical load which could lead to cracks, e.g. microcracks. Accordingly, in the composite, the glass is connected to a plastic in a stress-free manner The composite of glass with plastic is especially gas-proof and/or liquid-proof.

公开(公告)号：US20230250376A1

公开(公告)日：2023-08-10

申请号：US18004567

申请日：2022-05-06

Applicant: LPKF LASER & ELECTRONICS AG

Inventor： Robin A. Krüger ,  Antonia Heine-Dank ,  Oktavia Ostermann ,  Bernd Rösener ,  Malte Schultz-Ruhtenberg

IPC: C12M1/32 ,  C12M1/00 ,  C12M1/12

CPC classification number: C12M23/12 ,  C12M23/20 ,  C12M25/06

Abstract: The invention relates to a carrier which is suitable for the cultivation of cells and is preferably a plate-shaped carrier, e.g. made of glass, silicon or plastic or a combination thereof, in which carrier at least one first recess is formed which extends over a first thickness portion of the carrier, wherein an array of second recesses extends from the first recess into a second thickness portion of the carrier adjacent to the first thickness portion. The first thickness portion may have a thickness of a few micrometres to several centimetres. The second recesses, which extend from a first recess into the second thickness portion and each form a second array, form cups which are suitable for receiving cells and/or synthetic particles, e.g. made of plastic or glass.

公开(公告)号：US20230096742A1

公开(公告)日：2023-03-30

申请号：US17759319

申请日：2021-01-12

Applicant: LPKF Laser & Electronics AG

Inventor： Roman OSTHOLT ,  Norbert AMBROSIUS ,  Rafael SANTOS

IPC: H01L21/52 ,  H01L21/67

Abstract: A mounting method for an integrated semiconductor wafer device including a glass substrate a recess, at least one semiconductor wafer that is arranged in the recess, and at least one spring element engaging in the recess for maintaining the position or orienting the semiconductor wafer, wherein the method includes providing the glass substrate with a relaxed spring element engaging in the contour space of the semiconductor wafer, providing a spring manipulator substrate with a manipulation element adapted to the contour space and/or the at least one spring element, displacing the glass substrate in relation to the spring manipulator substrate such that its manipulation element runs into the recess, placing the semiconductor wafer into the recess, and displacing the glass substrate back in relation to the spring manipulator substrate such that its manipulation element moves out of the contour space of the semiconductor wafer, releasing the spring element.