公开(公告)号：US20200253096A1

公开(公告)日：2020-08-06

申请号：US16844737

申请日：2020-04-09

Applicant: Laird Technologies, Inc.

Inventor： Douglas S. MCBAIN ,  Hoang Dinh DO

IPC: H05K9/00 ,  H01Q17/00

Abstract: Disclosed are exemplary embodiments of patterned electromagnetic interference (EMI) mitigation materials (e.g., EMI absorbers, thermally-conductive EMI absorbers, etc.) including carbon nanotubes. The carbon nanotubes may comprise single-walled carbon nanotubes, multi-walled carbon nanotubes, and/or carbon nanostructures comprising a branched network of crosslinked carbon nanotube structures. For example, an EMI mitigation material may comprise a filled dielectric including a pattern of EMI absorbers. The filled dielectric comprises carbon nanotubes.

公开(公告)号：US20240250416A1

公开(公告)日：2024-07-25

申请号：US18603420

申请日：2024-03-13

Applicant: Laird Technologies, Inc.

Inventor： Douglas S. MCBAIN ,  Nathan Alan GREENE

IPC: H01Q1/42 ,  B32B3/12 ,  B32B5/02 ,  B32B5/18 ,  B32B5/24 ,  B32B7/025 ,  B32B27/12

CPC classification number: H01Q1/422 ,  B32B3/12 ,  B32B5/024 ,  B32B5/18 ,  B32B5/245 ,  B32B7/025 ,  B32B27/12 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0253 ,  B32B2262/0269 ,  B32B2264/107 ,  B32B2307/204 ,  B32B2307/3065 ,  B32B2307/54 ,  B32B2307/558 ,  B32B2307/706 ,  B32B2307/712

Abstract: Exemplary embodiments are disclosed of low dielectric, low loss radomes. Also disclosed are materials and methods for making low dielectric, low loss radomes.

公开(公告)号：US20230032553A1

公开(公告)日：2023-02-02

申请号：US17962698

申请日：2022-10-10

Applicant: Laird Technologies, Inc.

Inventor： Douglas S. MCBAIN ,  Hoang Dinh DO

IPC: H05K9/00

Abstract: Disclosed are exemplary embodiments of electromagnetic interference (EMI) mitigation materials and EMI absorbing compositions including carbon nanotubes. The carbon nanotubes may comprise single-walled carbon nanotubes, multi-walled carbon nanotubes, and/or carbon nanostructures comprising a branched network of crosslinked carbon nanotube structures. For example, exemplary embodiments may include a composition comprising carbon nanotubes within a polymer resin, whereby the composition is operable for absorbing noise and/or for reflecting signals thereby inhibiting passage or transmission of the signals through the composition. Also, for example, exemplary embodiments may include broadband millimeter wave EMI absorbers comprising carbon nanotubes.

公开(公告)号：US20230327332A1

公开(公告)日：2023-10-12

申请号：US18209399

申请日：2023-06-13

Applicant: Laird Technologies, Inc.

Inventor： Hoang Dinh DO ,  Douglas S. MCBAIN ,  Nathan Alan GREENE

IPC: H01Q1/42

CPC classification number: H01Q1/424

Abstract: Exemplary embodiments are disclosed of low dielectric, low loss radomes. Also disclosed are materials for radomes according to exemplary embodiments.

公开(公告)号：US20240357783A1

公开(公告)日：2024-10-24

申请号：US18748418

申请日：2024-06-20

Applicant: Laird Technologies, Inc.

Inventor： Douglas S. MCBAIN ,  Hoang Dinh DO

IPC: H05K9/00 ,  H01Q17/00

CPC classification number: H05K9/009 ,  H01Q17/002 ,  H05K9/0088

Abstract: Disclosed are exemplary embodiments of patterned electromagnetic interference (EMI) mitigation materials (e.g., EMI absorbers, thermally-conductive EMI absorbers, etc.) including carbon nanotubes. The carbon nanotubes may comprise single-walled carbon nanotubes, multi-walled carbon nanotubes, and/or carbon nanostructures comprising a branched network of crosslinked carbon nanotube structures. For example, an EMI mitigation material may comprise a filled dielectric including a pattern of EMI absorbers. The filled dielectric comprises carbon nanotubes.

公开(公告)号：US20220029282A1

公开(公告)日：2022-01-27

申请号：US17490831

申请日：2021-09-30

Applicant: Laird Technologies, Inc.

Inventor： Hoang Dinh DO ,  Richard N. JOHNSON ,  Douglas S. MCBAIN

IPC: H01Q1/42 ,  B32B3/12 ,  B32B5/18 ,  B32B5/02 ,  B32B27/12 ,  B32B5/24 ,  B32B7/025

Abstract: A low dielectric, low loss radome comprising microspheres integrated into a matrix. The microspheres reduce overall dielectric constant, whereby the radome has a dielectric constant less than 2.5 through a thickness of the radome.

公开(公告)号：US20190132994A1

公开(公告)日：2019-05-02

申请号：US16125361

申请日：2018-09-07

Applicant: Laird Technologies, Inc.

Inventor： Keith David JOHNSON ,  Douglas S. MCBAIN ,  Eugene Anthony PRUSS ,  Jason L. STRADER

IPC: H05K7/20 ,  H01R13/6581 ,  C09K5/14

Abstract: Exemplary embodiments are disclosed of thermal interface materials with reinforcement for abrasion resistance and/or suitable for use between sliding components.