公开(公告)号：US20150332985A1

公开(公告)日：2015-11-19

申请号：US14554058

申请日：2014-11-26

申请人： Jianshe Bi ,  Lanping Bai ,  Quan Chen ,  Liping Guo ,  Yanbo Xu

发明人： Jianshe Bi ,  Lanping Bai ,  Quan Chen ,  Liping Guo ,  Yanbo Xu

IPC分类号： H01L23/31 ,  H01L21/82 ,  H01L21/56 ,  H01L23/48 ,  H01L23/00

CPC分类号： H01L21/565 ,  H01L21/67126 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/75272 ,  H01L2224/75705 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/81192 ,  H01L2224/81903 ,  H01L2224/81904 ,  H01L2224/83193 ,  H01L2224/83862 ,  H01L2224/9221 ,  H01L2224/97 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/83

摘要： A method for packaging an integrated circuit (IC) device in which conventional manufacturing steps of mechanically bonding a die to a corresponding interconnecting substrate, wire bonding the die, and encapsulating the die in a protective shell are replaced by a single manufacturing step that includes thermally treating an appropriate assembly of parts to both form proper electrical connections for the die in the resulting IC package and cause the molding compound(s) to encapsulate the die in a protective enclosure.

摘要翻译： 一种用于封装集成电路（IC）装置的方法，其中将模具机械地结合到相应的互连基板，将芯片引线接合并将模具封装在保护壳体中的常规制造步骤由单个制造步骤代替，该制造步骤包括热 处理部件的适当组件以在所得IC封装中为模具形成适当的电连接，并使模塑化合物将模具封装在保护外壳中。

公开(公告)号：US09196557B1

公开(公告)日：2015-11-24

申请号：US14554058

申请日：2014-11-26

申请人： Jianshe Bi ,  Lanping Bai ,  Quan Chen ,  Liping Guo ,  Yanbo Xu

发明人： Jianshe Bi ,  Lanping Bai ,  Quan Chen ,  Liping Guo ,  Yanbo Xu

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L23/48 ,  H01L23/00 ,  H01L21/56 ,  H01L21/82

CPC分类号： H01L21/565 ,  H01L21/67126 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/75272 ,  H01L2224/75705 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/81192 ,  H01L2224/81903 ,  H01L2224/81904 ,  H01L2224/83193 ,  H01L2224/83862 ,  H01L2224/9221 ,  H01L2224/97 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/83

摘要： A method for packaging an integrated circuit (IC) device in which conventional manufacturing steps of mechanically bonding a die to a corresponding interconnecting substrate, wire bonding the die, and encapsulating the die in a protective shell are replaced by a single manufacturing step that includes thermally treating an appropriate assembly of parts to both form proper electrical connections for the die in the resulting IC package and cause the molding compound(s) to encapsulate the die in a protective enclosure.

摘要翻译： 一种用于封装集成电路（IC）装置的方法，其中将模具机械地结合到相应的互连基板，将芯片引线接合并将模具封装在保护壳体中的常规制造步骤由单个制造步骤代替，该制造步骤包括热 处理部件的适当组件以在所得IC封装中为模具形成适当的电连接，并使模塑化合物将模具封装在保护外壳中。