Abstract:
Embodiments of a hybrid imaging sensor that optimizes a pixel array area on a substrate using a stacking scheme for placement of related circuitry with minimal vertical interconnects between stacked substrates and associated features are disclosed. Embodiments of maximized pixel array size/die size (area optimization) are disclosed, and an optimized imaging sensor providing improved image quality, improved functionality, and improved form factors for specific applications common to the industry of digital imaging are also disclosed.
Abstract:
Programmable data readout for optical image sensors is disclosed herein. By way of example, vertical skipping and vertical mixing functionality is provided that is responsive to commands, enabling dynamic selectivity and processing of optical sensor data. A data output control system can be incorporated with or coupled to data readout circuitry of an optical sensor. The output control system comprises a vertical skipping engine that can dynamically select a subset of data for output in response to one or more skipping commands, and a vertical mixing engine that can act upon subsets of data in accordance with processing functions called by respective mixing commands. The disclosure provides simplification of selective data readout and processing for image sensors, potentially reducing design, testing, and maintenance overhead, as well as cost and number of integrated circuit components.
Abstract:
Systems and methods are provided that facilitate employing a plurality of independent reset buses for a column of pixels in a pixel array of a CMOS sensor imager. Utilization of the plurality of independent reset buses for the column of pixels can enable independent reset to be effectuated when employing sub-frame integration. For example, rows to be read and reset during a given readout time interval can be selected based upon one or more criteria. Further, each of the rows selected during the given readout time interval can be associated with a respective distinct reset bus. By leveraging the plurality of independent reset buses, uniformity in pixel operation can be maintained whether operating in full frame integration mode or sub-frame integration mode. Thus, noise resultant from changing between integration modes can be mitigated by using the plurality of independent reset buses.
Abstract:
Embodiments of a hybrid imaging sensor that optimizes a pixel array area on a substrate using a stacking scheme for placement of related circuitry with minimal vertical interconnects between stacked substrates and associated features are disclosed. Embodiments of maximized pixel array size/die size (area optimization) are disclosed, and an optimized imaging sensor providing improved image quality, improved functionality, and improved form factors for specific applications common to the industry of digital imaging are also disclosed. Embodiments of the above may include systems, methods and processes for staggering ADC or column circuit bumps in a column or sub-column hybrid image sensor using vertical interconnects are also disclosed.
Abstract:
Embodiments of a hybrid imaging sensor that optimizes a pixel array area on a substrate using a stacking scheme for placement of related circuitry with minimal vertical interconnects between stacked substrates and associated features are disclosed. Embodiments of maximized pixel array size/die size (area optimization) are disclosed, and an optimized imaging sensor providing improved image quality, improved functionality, and improved form factors for specific applications common to the industry of digital imaging are also disclosed.
Abstract:
An endoscopic device having embodiments of a hybrid imaging sensor that optimizes a pixel array area on a substrate using a stacking scheme for placement of related circuitry with minimal vertical interconnects between stacked substrates and associated features are disclosed. Embodiments of maximized pixel array size/die size (area optimization) are disclosed, and an optimized imaging sensor providing improved image quality, improved functionality, and improved form factors for specific applications common to the industry of digital imaging are also disclosed. Embodiments of the above may include systems, methods and processes for staggering ADC or column circuit bumps in a column or sub-column hybrid image sensor using vertical interconnects are also disclosed.
Abstract:
Systems and methods are provided that facilitate mitigating pixel or column fixed pattern noise in a CMOS imaging System-on-Chip (iSoC) sensor. For instance, pixel or column fixed pattern noise can be recognized by gating a pixel array without firing a transfer signal (TX). Inhibiting the transfer signal can cause zero input to be provided to pixels in the pixel array; thus, the sampled output from the pixels under such conditions can be a function of noise. Calibration and correction can thereafter be effectuated. Moreover, uniform frame rates for outputted frames can be yielded irrespective of use of a subset of read out frames for calibration. For example, frames employed for calibration can be replaced in a sequence of outputted frames by copies of stored frames. Further, signal levels can be balanced to account for differences in light integration time, which can result from blocking and unblocking firing of transfer signals.
Abstract:
Systems and methods are provided that facilitate employing a plurality of independent reset buses for a column of pixels in a pixel array of a CMOS sensor imager. Utilization of the plurality of independent reset buses for the column of pixels can enable independent reset to be effectuated when employing sub-frame integration. For example, rows to be read and reset during a given readout time interval can be selected based upon one or more criteria. Further, each of the rows selected during the given readout time interval can be associated with a respective distinct reset bus. By leveraging the plurality of independent reset buses, uniformity in pixel operation can be maintained whether operating in full frame integration mode or sub-frame integration mode. Thus, noise resultant from changing between integration modes can be mitigated by using the plurality of independent reset buses.
Abstract:
The claimed subject matter provides systems and/or methods that facilitate reducing dark current and lag in a CMOS imaging System-on-Chip (iSoC) sensor. For instance, a vertical output driver can output a signal upon a node connected to gates of reset transistors and/or gates of transfer transistors of pixels in the pixel array while operating in rolling shutter mode and/or global shutter mode. Further, a pre-charger can transition a voltage of the node to a first voltage level. Moreover, a booster can further adjust the voltage of the node from the first voltage level to a second voltage level. The booster can have variable drive capability that enables varying operation thereof according to at least one degree of freedom (e.g., speed of the booster proceeding to the second voltage level, frequency of yielding charge to the node, the second voltage level, or timing of the booster and the pre-charger, . . . ).