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公开(公告)号：US20060057827A1
公开(公告)日：2006-03-16
申请号：US11217878
申请日：2005-09-01
申请人： Lauri Huhtasalo , Samuli Stromberg , Marko Hanhikorpi , Olli Hyvarinen , Pekka Taskinen , Tuija Suortti
发明人： Lauri Huhtasalo , Samuli Stromberg , Marko Hanhikorpi , Olli Hyvarinen , Pekka Taskinen , Tuija Suortti
IPC分类号： H01L21/20
CPC分类号： H05K3/207 , G06K19/07779 , G06K19/07783 , H05K1/092 , H05K3/386 , H05K2203/016 , H05K2203/0278 , H05K2203/087 , H05K2203/102 , H05K2203/1157 , H05K2203/125 , Y10T29/49149 , Y10T29/49155
摘要： The present invention relates to a method for manufacturing an electrically conductive pattern by printing a layer comprising metal oxide on a carrier substrate (2) and reducing the metal oxide to metal. The reduced layer is transferred to an application substrate (7). The present invention also relates to the use of the method.
摘要翻译： 本发明涉及通过在载体基板（2）上印刷包含金属氧化物的层并将金属氧化物还原成金属来制造导电图案的方法。 还原层被转移到施加衬底（7）上。 本发明还涉及该方法的用途。
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公开(公告)号：US07386936B2
公开(公告)日：2008-06-17
申请号：US11217878
申请日：2005-09-01
申请人： Lauri Huhtasalo , Samuli Strömberg , Marko Hanhikorpi , Olli Hyvärinen , Pekka Taskinen , Tuija Suortti
发明人： Lauri Huhtasalo , Samuli Strömberg , Marko Hanhikorpi , Olli Hyvärinen , Pekka Taskinen , Tuija Suortti
CPC分类号： H05K3/207 , G06K19/07779 , G06K19/07783 , H05K1/092 , H05K3/386 , H05K2203/016 , H05K2203/0278 , H05K2203/087 , H05K2203/102 , H05K2203/1157 , H05K2203/125 , Y10T29/49149 , Y10T29/49155
摘要： The present invention relates to a method for manufacturing an electrically conductive pattern by printing a layer comprising metal oxide on a carrier substrate (2) and reducing the metal oxide to metal. The reduced layer is transferred to an application substrate (7). The present invention also relates to the use of the method.
摘要翻译： 本发明涉及通过在载体基板（2）上印刷包含金属氧化物的层并将金属氧化物还原成金属来制造导电图案的方法。 还原层被转移到施加衬底（7）上。 本发明还涉及该方法的用途。
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公开(公告)号：US07682871B2
公开(公告)日：2010-03-23
申请号：US10559243
申请日：2004-06-01
CPC分类号： H01L21/563 , G06K19/07749 , G06K19/0775 , H01L23/49855 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/16225 , H01L2224/2919 , H01L2224/73203 , H01L2224/73204 , H01L2224/81801 , H01L2224/83192 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01R4/04 , H01R12/57 , H01L2924/00
摘要： A method for forming a joint. A module is introduced including a paper or plastic substrate, an integrated circuit on a chip mounted on the substrate and in electrical contact with contact areas of the module being located on the surface of the substrate. A web is introduced including one circuitry pattern after another provided with contact areas of the circuitry pattern. Settable isotropically conductive adhesive is dispensed on the contact areas of the circuitry pattern. The contact areas of the module are attached to the contact areas of the circuitry pattern by the isotropically conductive adhesive. The isotropically conductive adhesive is cured at the ambient atmospheric pressure. Settable nonconductive adhesive is dispensed at the side of the module in such a manner that the adhesive is sucked underneath the module by capillary forces. The nonconductive adhesive is cured at the ambient atmospheric pressure.
摘要翻译： 一种形成接头的方法。 引入了包括纸或塑料基板的模块，安装在基板上的芯片上的集成电路，并与位于基板表面上的模块的接触区域电接触。 介绍了包括一个电路图案的网络，其中设置有电路图案的接触区域。 可设置的各向异性导电粘合剂被分配在电路图案的接触区域上。 模块的接触区域通过各向异性导电粘合剂附接到电路图案的接触区域。 各向同性导电粘合剂在环境大气压下固化。 在模块侧分配可设置的非导电粘合剂，使得粘合剂通过毛细管力吸附在模块的下方。 非导电粘合剂在环境大气压下固化。
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公开(公告)号：US20070105361A1
公开(公告)日：2007-05-10
申请号：US10559243
申请日：2004-06-01
IPC分类号： H01L21/44
CPC分类号： H01L21/563 , G06K19/07749 , G06K19/0775 , H01L23/49855 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/16225 , H01L2224/2919 , H01L2224/73203 , H01L2224/73204 , H01L2224/81801 , H01L2224/83192 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01R4/04 , H01R12/57 , H01L2924/00
摘要： A method for forming a joint. A module is introduced including a paper or plastic substrate, an integrated circuit on a chip mounted on the substrate and in electrical contact with contact areas of the module being located on the surface of the substrate. A web is introduced including one circuitry pattern after another provided with contact areas of the circuitry pattern. Settable isotropically conductive adhesive is dispensed on the contact areas of the circuitry pattern. The contact areas of the module are attached to the contact areas of the circuitry pattern by the isotropically conductive adhesive. The isotropically conductive adhesive is cured at the ambient atmospheric pressure. Settable nonconductive adhesive is dispensed at the side of the module in such a manner that the adhesive is sucked underneath the module by capillary forces. The nonconductive adhesive is cured at the ambient atmospheric pressure.
摘要翻译： 一种形成接头的方法。 引入了包括纸或塑料基板的模块，安装在基板上的芯片上的集成电路，并与位于基板表面上的模块的接触区域电接触。 介绍了包括一个电路图案的网络，其中设置有电路图案的接触区域。 可设置的各向异性导电粘合剂被分配在电路图案的接触区域上。 模块的接触区域通过各向异性导电粘合剂附接到电路图案的接触区域。 各向同性导电粘合剂在环境大气压下固化。 在模块侧分配可设置的非导电粘合剂，使得粘合剂通过毛细管力吸附在模块的下方。 非导电粘合剂在环境大气压下固化。
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