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    Decorative chrome electroplate on plastics
    1.
    发明授权
    Decorative chrome electroplate on plastics 失效
    装饰镀铬电镀在塑料上

    公开(公告)号：US06468672B1

    公开(公告)日：2002-10-22

    申请号：US09606800

    申请日：2000-06-29

    Applicant: Lawrence P. Donovan, III ,  Roger J. Timmer

    Inventor： Lawrence P. Donovan, III ,  Roger J. Timmer

    IPC: B32B1508

    CPC classification number: C25D5/56 ,  C25D5/14 ,  Y10S428/935 ,  Y10T428/12569 ,  Y10T428/12944

    Abstract: A process for forming a decorative chromium plating on a plastic substrate includes depositing an electrically conductive coating on the plastic substrate, electrodepositing on the electrically conductive coating a high leveling semi-bright nickel electroplate layer, electrodepositing on the high leveling semi-bright nickel electroplate layer a bright nickel electroplate layer, and electrodepositing over the bright nickel electroplate layer a chromium electroplate layer. An advantage of the process is that a lustrous decorative chromium plating having good corrosion resistance and thermal cycling characteristics is obtained without a copper sublayer, and while using relatively thin nickel sublayers.

    Abstract translation: 一种用于在塑料基板上形成装饰性镀铬的工艺，包括在塑料基板上沉积导电涂层，在导电涂层上电沉积高均匀半亮镍电镀层，电沉积在高均匀半光亮镍电镀层 一个光亮的镍电镀层，并在光亮的镍电镀层上电沉积铬电镀层。 该方法的优点是获得具有良好耐腐蚀性和热循环特性的光泽的装饰性铬镀层，而不需要铜层，并且在使用相对较薄的镍层的同时获得。

    Plating rack with rotatable insert
    5.
    发明授权
    Plating rack with rotatable insert 失效
    带旋转插件的电镀架

    公开(公告)号：US07097749B2

    公开(公告)日：2006-08-29

    申请号：US10266884

    申请日：2002-10-08

    Applicant: Lawrence P. Donovan, III ,  David P. Hartrick ,  John A. Piselli ,  Brian Ellison

    Inventor： Lawrence P. Donovan, III ,  David P. Hartrick ,  John A. Piselli ,  Brian Ellison

    IPC: C25D17/08

    CPC classification number: C25D17/08

    Abstract: A processing rack, such as for electroplating, which minimizes shelf areas of an article during processing of the article and during removal of the article from a processing bath and which allows easy mounting of articles on the rack and demounting of articles from the rack includes a frame and a plurality of article mounting fixtures that are each pivotally mounted on the frame and independently pivotable from a first orientation that facilitates mounting and/or demounting of articles, to a second orientation that is most conducive to producing high quality, substantially defect-free plating.

    Abstract translation: 诸如用于电镀的处理架，其在制品处理期间以及在从加工槽移除制品期间最小化物品的搁板面积并且允许物品容易地安装在搁架上并且从物品架拆卸物品包括： 框架和多个物品安装固定件，每个物品安装固定件各自可枢转地安装在框架上并且可以从便于装置和/或拆卸物品的第一定位独立地枢转到最有利于产生高质量，基本上无缺陷的第二定向 电镀。

    Electroplating tool and method for selective plating
    6.
    发明授权
    Electroplating tool and method for selective plating 失效
    电镀工具及选择电镀方法

    公开(公告)号：US07070688B2

    公开(公告)日：2006-07-04

    申请号：US10778409

    申请日：2004-02-16

    Applicant: Lawrence P. Donovan, III

    Inventor： Lawrence P. Donovan, III

    IPC: C25D5/02 ,  C25D17/00

    CPC classification number: C25D17/06 ,  C25D5/02

    Abstract: A tool for electroplating a portion of the surface of each of a plurality of pieces includes a first plate having a plurality of holes, and a second plate having a plurality of retaining elements. Each of the holes is configured to receive a piece that is to be electroplated, and to mask a portion of the surface and expose another portion of the surface of the piece. The first and second plates are held together, and a mechanism is provided for shifting one of the plates with respect to the other between a first orientation in which the retaining elements are disengaged from pieces received in the holes and a second orientation in which the retaining elements are engaged with pieces received in the holes. This arrangement allows the pieces to be quickly and easily retained for an electroplating operation and released after the electroplating operation.

    Abstract translation: 用于对多个片中的每一个的表面的一部分进行电镀的工具包括具有多个孔的第一板和具有多个保持元件的第二板。 每个孔被构造成接收待电镀的部件，并且掩盖该表面的一部分并暴露该片的表面的另一部分。 第一和第二板被保持在一起，并且提供一种机构，用于在其中保持元件与容纳在孔中的片脱离的第一取向和第二取向之间相对于另一个移动板中的一个，并且第二取向 元件与接收在孔中的件接合。 这种布置允许这些片快速容易地保留用于电镀操作，并且在电镀操作之后被释放。

    Method for controlling organic micelle size in nickel-plating solution
    7.
    发明授权
    Method for controlling organic micelle size in nickel-plating solution 有权
    镍镀液中有机胶束尺寸的控制方法

    公开(公告)号：US06306275B1

    公开(公告)日：2001-10-23

    申请号：US09540226

    申请日：2000-03-31

    Applicant: Lawrence P. Donovan, III ,  Roger J. Timmer ,  David P. Hartrick

    Inventor： Lawrence P. Donovan, III ,  Roger J. Timmer ,  David P. Hartrick

    IPC: C25D2118

    CPC classification number: C25D21/18 ,  C25D3/12

    Abstract: A process for controlling the micelle size distribution of an alkylene oxide dispersion in a nickel-plating electrolyte is used to maintain the electrolyte in a condition suitable for producing nickel coatings having a uniform satin finish in which finish characteristics such as roughness depth are maintained within desired limits. The process involves steps of removing a portion of the electrolyte from the electroplating bath, filtering the alkylene oxide from the electrolyte removed from the electroplating bath, adding alkylene oxide to the electroplating bath, and returning the filtered electrolyte to the electroplating bath. The process removes larger alkylene oxide micelles from the electrolyte and replaces them with smaller micelles to maintain a desired micelle size distribution.

    Abstract translation: 使用用于控制镀镍电解质中的烯化氧分散体的胶束尺寸分布的方法来将电解质保持在适于生产具有均匀缎面光洁度的镍涂层的条件下，其中粗糙度深度的整理特性保持在期望的范围内 限制 该方法包括从电镀浴中除去一部分电解质的步骤，从电镀浴中除去的电解质中过滤环氧烷，将氧化烯加入到电镀浴中，并将经过滤的电解液返回到电镀浴中。 该方法从电解质中除去较大的环氧烷胶束，并用较小的胶束代替它们以维持所需的胶束尺寸分布。

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