公开(公告)号：US09533233B2

公开(公告)日：2017-01-03

申请号：US13468423

申请日：2012-05-10

申请人： J. Austin Rucker ,  C. Evangelos Kafantaris ,  Susie E. Buckman ,  Leo Shen ,  Roy Hu ,  Josiah T. S. Li

发明人： J. Austin Rucker ,  C. Evangelos Kafantaris ,  Susie E. Buckman ,  Leo Shen ,  Roy Hu ,  Josiah T. S. Li

IPC分类号： A63H3/20 ,  A63H13/02

CPC分类号： A63H13/02

摘要： One or more methods, apparatuses, and/or systems are disclosed herein for selectively grasping one or more target objects. The apparatus includes a string and a winding mechanism. The winding mechanism is configured to selectively unwind and wind the string, wherein a first portion of the apparatus is configured to be separated from a second portion of the apparatus when the string is unwound and wherein the first and second portions are configured to be adjacent to one another when the string is wound. A plurality of members are pivotally mounted to the apparatus and operably coupled to the winding mechanism, wherein the plurality of members are configured to grasp an object responsive to actuation of a button that is located within an area defined by the plurality of members.

摘要翻译： 本文公开了一种或多种方法，装置和/或系统，用于选择性地抓握一个或多个目标对象。 该装置包括一串和一绕线机构。 所述卷绕机构构造成选择性地退绕并缠绕所述绳索，其中所述装置的第一部分被配置为当所述绳索展开时与所述装置的第二部分分离，并且其中所述第一和第二部分被配置为与所述绳索相邻 当弦被缠绕时，彼此相交。 多个构件枢转地安装到设备并可操作地联接到卷绕机构，其中多个构件被构造成响应于位于由多个构件限定的区域内的按钮的致动而抓住物体。

公开(公告)号：US20080257590A1

公开(公告)日：2008-10-23

申请号：US12034564

申请日：2008-02-20

申请人： Chung W. Ho ,  Leo Shen

发明人： Chung W. Ho ,  Leo Shen

IPC分类号： H05K1/03 ,  H01B13/00

CPC分类号： H01L23/142 ,  H01L23/49861 ,  H01L33/64 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/44 ,  H05K2201/0355 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0323 ,  H05K2203/0369 ,  H01L2924/00

摘要： A manufacturing process of a high thermal conducting circuit substrate is provided. First, a metal core substrate is provided and then the metal core substrate is etched at different etching speeds. Afterwards, two insulating layers are formed respectively on two sides of the etched metal core substrate. In addition, as an option, two conducting layers are formed respectively on two sides of the metal core substrate and are on top of the insulting layers. The conducting layers are patterned according to designs appropriate for the products. Because the high thermal conducting circuit substrate fabricated as the aforementioned manufacturing process mainly comprises the metal core substrate, it helps to elevate the thermal conduction of the circuit substrate itself.

摘要翻译： 提供了一种高导热电路基板的制造工艺。 首先，提供金属芯基板，然后以不同的蚀刻速度蚀刻金属芯基板。 之后，在蚀刻后的金属芯基板的两面分别形成两层绝缘层。 此外，作为选择，分别在金属芯基板的两侧形成两个导电层，并且在绝缘层的顶部。 根据适合于产品的设计对导电层进行图案化。 由于作为上述制造工艺制造的高导热电路基板主要包括金属芯基板，所以有助于提高电路基板本身的热传导。

公开(公告)号：US20130237123A1

公开(公告)日：2013-09-12

申请号：US13468423

申请日：2012-05-10

申请人： J. Austin Rucker ,  C. Evangelos Kafantaris ,  Susie E. Buckman ,  Leo Shen ,  Roy Hu ,  Josiah T.S. Li

发明人： J. Austin Rucker ,  C. Evangelos Kafantaris ,  Susie E. Buckman ,  Leo Shen ,  Roy Hu ,  Josiah T.S. Li

IPC分类号： A63H3/20

CPC分类号： A63H13/02

摘要： One or more methods, apparatuses, and/or systems are disclosed herein for selectively grasping one or more target objects. The apparatus includes a string and a winding mechanism. The winding mechanism is configured to selectively unwind and wind the string, wherein a first portion of the apparatus is configured to be separated from a second portion of the apparatus when the string is unwound and wherein the first and second portions are configured to be adjacent to one another when the string is wound. A plurality of members are pivotally mounted to the apparatus and operably coupled to the winding mechanism, wherein the plurality of members are configured to grasp an object responsive to actuation of a button that is located within an area defined by the plurality of members.

摘要翻译： 本文公开了一种或多种方法，装置和/或系统，用于选择性地抓握一个或多个目标对象。 该装置包括一串和一绕线机构。 所述卷绕机构构造成选择性地退绕并缠绕所述绳索，其中所述装置的第一部分被配置为当所述绳索展开时与所述装置的第二部分分离，并且其中所述第一和第二部分被配置为与所述绳索相邻 当弦被缠绕时，彼此相交。 多个构件枢转地安装到设备并可操作地联接到卷绕机构，其中多个构件被构造成响应于位于由多个构件限定的区域内的按钮的致动而抓住物体。

公开(公告)号：US07540969B2

公开(公告)日：2009-06-02

申请号：US11565836

申请日：2006-12-01

申请人： Chung W. Ho ,  Leo Shen

发明人： Chung W. Ho ,  Leo Shen

IPC分类号： H01B13/00

CPC分类号： H01L23/142 ,  H01L23/49861 ,  H01L33/64 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/44 ,  H05K2201/0355 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0323 ,  H05K2203/0369 ,  H01L2924/00

摘要： A manufacturing process of a high thermal conducting circuit substrate is provided. First, a metal core substrate is provided and then the metal core substrate is etched at different etching speeds. Afterwards, two insulating layers are formed respectively on two sides of the etched metal core substrate. In addition, as an option, two conducting layers are formed respectively on two sides of the metal core substrate and are on top of the insulting layers. The conducting layers are patterned according to designs appropriate for the products. Because the high thermal conducting circuit substrate fabricated as the aforementioned manufacturing process mainly comprises the metal core substrate, it helps to elevate the thermal conduction of the circuit substrate itself.

摘要翻译： 提供了一种高导热电路基板的制造工艺。 首先，提供金属芯基板，然后以不同的蚀刻速度蚀刻金属芯基板。 之后，在蚀刻后的金属芯基板的两面分别形成两层绝缘层。 此外，作为选择，分别在金属芯基板的两侧形成两个导电层，并且在绝缘层的顶部。 根据适合于产品的设计对导电层进行图案化。 由于作为上述制造工艺制造的高导热电路基板主要包括金属芯基板，所以有助于提高电路基板本身的热传导。

公开(公告)号：US07223687B1

公开(公告)日：2007-05-29

申请号：US11465873

申请日：2006-08-21

申请人： Chung W. Ho ,  Shih-Lian Cheng ,  Leo Shen

发明人： Chung W. Ho ,  Shih-Lian Cheng ,  Leo Shen

IPC分类号： H01L21/4763

CPC分类号： H05K3/4682 ,  H05K3/0058 ,  H05K3/0097 ,  H05K2203/0152 ,  H05K2203/1536 ,  Y10T29/49124 ,  Y10T29/49126

摘要： A method of fabricating a printed wiring board comprising the following steps is provided. A portion of each of two dielectric layers or metal layers bonds to both sides of a carrier plate, respectively. Two build-up wiring structures are respectively formed on the dielectric layers or the metal layers by a build-up process. The portions of the dielectric layers or metal layers bonded to the carrier plate are removed such that the dielectric layers or metal layers and the build-up wiring structures formed thereon are released from the carrier plate to form two printed wiring boards.

摘要翻译： 提供一种制造印刷电路板的方法，包括以下步骤。 两个电介质层或金属层中的每一个的一部分分别结合到载体板的两侧。 通过堆积工艺在电介质层或金属层上分别形成两个堆叠布线结构。 去除与载体板接合的电介质层或金属层的部分，使得形成在其上的电介质层或金属层和积聚线结构从载体板释放以形成两个印刷线路板。

公开(公告)号：US20170058980A1

公开(公告)日：2017-03-02

申请号：US15252700

申请日：2016-08-31

申请人： Alberto De Bernardi ,  Enrico Di Stefano ,  Ciney Zhang ,  Leo Shen

发明人： Alberto De Bernardi ,  Enrico Di Stefano ,  Ciney Zhang ,  Leo Shen

IPC分类号： F16D65/18

CPC分类号： F16D65/18 ,  F16D2121/24 ,  F16D2125/40 ,  F16D2125/48 ,  F16D2125/582

摘要： A brake device for a linear actuator is provided having a torque transmission mechanism for forward transfer of driving torque and a spring friction mechanism for blocking backward transfer of load torque. The mechanism provides an input shaft and a first coupled claw connected to the input shaft that rotates synchronously therewith, a driving torque output shaft and a second coupled claw connected to the output shaft and capable rotating synchronously therewith. The first coupled claw and second coupled claw are matched and engaged together, and used to transfer driving torque in a forward direction from the input shaft to the output shaft. The spring friction mechanism provides a brake housing and a friction coil spring disposed elastically in a cylindrical inner hole of the brake housing. The friction coil spring formed with end parts at two axial ends for hooking onto the first and second coupled claws.

摘要翻译： 提供一种用于线性致动器的制动装置，其具有用于正向传递驱动扭矩的扭矩传递机构和用于阻止负载转矩的反向传递的弹簧摩擦机构。 该机构提供输入轴和连接到与其同步旋转的输入轴的输入轴和第一联接爪，驱动扭矩输出轴和连接到输出轴并能够与其同步旋转的第二联接爪。 第一耦合爪和第二耦合爪匹配并接合在一起，用于将驱动扭矩从输入轴向前传送到输出轴。 弹簧摩擦机构提供制动壳体和弹性地设置在制动器壳体的圆柱形内孔中的摩擦螺旋弹簧。 摩擦螺旋弹簧在两个轴向端部形成有端部用于钩住第一和第二连接爪。

公开(公告)号：US20070126093A1

公开(公告)日：2007-06-07

申请号：US11565836

申请日：2006-12-01

申请人： CHUNG W. HO ,  LEO SHEN

发明人： CHUNG W. HO ,  LEO SHEN

IPC分类号： H01L23/495 ,  H01L21/58

CPC分类号： H01L23/142 ,  H01L23/49861 ,  H01L33/64 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/44 ,  H05K2201/0355 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0323 ,  H05K2203/0369 ,  H01L2924/00

摘要： A manufacturing process of a high thermal conducting circuit substrate is provided. First, a metal core substrate is provided and then the metal core substrate is etched at different etching speeds. Afterwards, two insulating layers are formed respectively on two sides of the etched metal core substrate. In addition, as an option, two conducting layers are formed respectively on two sides of the metal core substrate and are on top of the insulting layers. The conducting layers are patterned according to designs appropriate for the products. Because the high thermal conducting circuit substrate fabricated as the aforementioned manufacturing process mainly comprises the metal core substrate, it helps to elevate the thermal conduction of the circuit substrate itself.

摘要翻译： 提供了一种高导热电路基板的制造工艺。 首先，提供金属芯基板，然后以不同的蚀刻速度蚀刻金属芯基板。 之后，在蚀刻后的金属芯基板的两面分别形成两层绝缘层。 此外，作为选择，分别在金属芯基板的两侧形成两个导电层，并且在绝缘层的顶部。 根据适合于产品的设计对导电层进行图案化。 由于作为上述制造工艺制造的高导热电路基板主要包括金属芯基板，所以有助于提高电路基板本身的热传导。