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公开(公告)号：US10892208B2
公开(公告)日：2021-01-12
申请号：US15787711
申请日：2017-10-19
IPC分类号： H01L23/473 , H01L23/367 , H01L25/11 , H01L23/40
摘要： An improved heat dissipation apparatus for limiting the temperature of multiple power semiconductors featuring flow balancers to manipulate the hydrodynamic pressure of the coolant fluid to regulate the coolant fluid flow distribution across the heat exchange fins to either create uniform flow distribution or purposefully disproportionate or custom coolant fluid flow distribution for the purpose of achieving higher heat transfer efficiency.
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公开(公告)号：US10910917B2
公开(公告)日：2021-02-02
申请号：US15893767
申请日：2018-02-12
申请人： George R Woody , Nayeem Arafat , Lon C Cooper
发明人： George R Woody , Nayeem Arafat , Lon C Cooper
IPC分类号： H02K9/19 , H02P27/06 , H02K11/33 , H05K1/14 , H05K7/14 , H02M7/537 , H02M7/00 , H05K7/20 , B60K7/00
摘要： A compact and thermally efficient traction drive motor inverter featuring an integrated printed circuit board carrying both power circuitry and signal circuitry on separate electrically isolated layers without significant electromagnetic interference. Electrical communication with subsequent electrically isolated layers is maintained through the use of plated blind vias. Thermal efficiency is improved by utilizing a liquid cooled insulated gate bipolar transistor module with featuring internal flow balancers to optimize coolant flow.
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公开(公告)号：US20190252949A1
公开(公告)日：2019-08-15
申请号：US15893767
申请日：2018-02-12
申请人： George R. Woody , Nayeem Arafat , Lon C. Cooper
发明人： George R. Woody , Nayeem Arafat , Lon C. Cooper
IPC分类号： H02K9/19 , H02P27/06 , H02K11/33 , H05K1/14 , H05K7/14 , B60K7/00 , H02M7/537 , H02M7/00 , H05K7/20
CPC分类号： H02K9/19 , B60K7/0007 , H02K11/33 , H02M7/003 , H02M7/537 , H02P27/06 , H05K1/141 , H05K7/1432 , H05K7/20263 , H05K7/20381 , H05K7/205 , H05K2201/10166
摘要： A compact and thermally efficient traction drive motor inverter featuring an integrated printed circuit board carrying both power circuitry and signal circuitry on separate electrically isolated layers without significant electromagnetic interference. Electrical communication with subsequent electrically isolated layers is maintained through the use of plated blind vias. Thermal efficiency is improved by utilizing a liquid cooled insulated gate bipolar transistor module with featuring internal flow balancers to optimize coolant flow.
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公开(公告)号：US20190139862A1
公开(公告)日：2019-05-09
申请号：US15787711
申请日：2017-10-19
IPC分类号： H01L23/473 , H01L23/367 , H01L25/11
摘要： An improved heat dissipation apparatus for limiting the temperature of multiple power semiconductors featuring flow balancers to manipulate the hydrodynamic pressure of the coolant fluid to regulate the coolant fluid flow distribution across the heat exchange fins to either create uniform flow distribution or purposefully disproportionate or custom coolant fluid flow distribution for the purpose of achieving higher heat transfer efficiency.
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公开(公告)号：US20130072311A1
公开(公告)日：2013-03-21
申请号：US13235687
申请日：2011-09-19
摘要： A flexible coupling assembly that may be provided with a vehicle drivetrain. The flexible coupling assembly may include a spacer ring, a first flexplate assembly, and a second flexplate assembly. The first and second flexplate assemblies may be spaced apart and fixedly disposed on the spacer ring. The first and second flexplate assemblies may be configured to independently flex.
摘要翻译： 可以设置有车辆传动系的柔性联接组件。 柔性联接组件可以包括间隔环，第一柔性板组件和第二柔性板组件。 第一和第二柔性板组件可以间隔开并且固定地设置在间隔环上。 第一和第二柔性板组件可以被配置为独立地弯曲。
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