摘要:
A light-emitting device (1) includes a base (10), a light reflecting member (11) placed on the base (10), a case (12) surrounding the light reflecting member (11), and a plurality of light-emitting elements (13) arranged on the inner surface of the case (12). The light reflecting member (11) reflects light emitted from an emission source including the light-emitting elements (13) toward an opening (12a) of the case (12). In the light-emitting device (1), since a plurality of light-emitting elements (13) can be arranged three-dimensionally, the size of the light-emitting device can be reduced easily. Moreover, the light reflecting member (11) reflects light emitted from the emission source including the light-emitting elements (13) toward the opening (12a) of the case (12), so that the light-emitting device can have high brightness.
摘要:
A method of controlling contact load in an apparatus for mounting electronic components on a substrate includes a head holding an electronic component being lowered at a first speed to a first position where the electronic component does not contact the substrate. The head is lowered at a second speed slower than the first speed from the first position until a predetermined target contact load is detected. The head is moved down by a small step for a predetermined distance at the second speed and a contact load is measured after moving the head down. The method includes determining whether a measured contact load has reached the predetermined target contact load. The moving and the measuring is sequentially repeated until the measured contact load reaches the predetermined target contact load. The predetermined distance is set to a first predetermined distance when moving the head down until the electronic component contacts the substrate. The predetermined distance is set to a second predetermined distance when moving the head down after the electronic component contacts the substrate and the second predetermined distance is smaller than the first predetermined distance.
摘要:
The semiconductor device bonding apparatus 1 of the present invention includes: a pressing member 15 that presses the semiconductor device 10 toward the substrate 11 side in a state where a bump 14 is provided between the semiconductor device 10 and the substrate 11; an ultrasonic vibration applying member 16 that vibrates the semiconductor device 10 and the substrate 11 relatively by applying an ultrasonic vibration to at least one of the semiconductor device 10 and the substrate 11; a time measuring member 17 that measures a required time period from a time when starting to apply the ultrasonic vibration to a time when the semiconductor device 10 is pressed a predetermined distance; and a controlling member 18 that controls an output of an ultrasonic vibration during subsequent bonding, based on the time period measured by the time measuring member 17.
摘要:
An arithmetic processing apparatus includes a first data storage unit, two-dimensional arithmetic unit, and main control unit. The first data storage unit stores data to be processed. The two-dimensional arithmetic unit performs two-dimensional operation. The main control unit controls the two-dimensional arithmetic unit. The two-dimensional arithmetic unit includes an input address calculation unit which calculates the addresses of a set of input data necessary for a designated type of operation in the first data storage unit in accordance with an execution start instruction which designates the type of operation and a parameter from the main control unit, and an arithmetic execution unit which performs the designated type of operation for the set of input data which are stored at the calculated addresses in the first data storage unit.
摘要:
A logical circuit layout pattern verification method. Verification of a logical circuit layout pattern is performed by: adding the parasitic capacitance of a layout pattern of a logical circuit to a load capacitance of logic gates, calculating an output value of the logical circuit based on the total capacitance, and verifying the layout pattern by comparing the output value and the expected output value calculated at initial design. In the calculation of the delay time of the logic gate, the delay time corresponding to discrete representative values of the load capacitance are first calculated, the functions describing the relationship between the load capacitance and the delay time are calculated using the delay time, and based on the function, the delay time corresponding to the load capacitance having continuous values is calculated. With the method, malfunctioning of the circuit caused by delay time is predictable.
摘要:
A phosphor layer forming apparatus (1) in which a paste (21) containing a phosphor is discharged so as to cover each of a plurality of light-emitting elements (11) mounted on a substrate (10) includes the following: a discharge portion (12) for discharging the paste (21) in the form of droplets onto each of the light-emitting elements (11); a measurement portion (13) for measuring the thickness of individual phosphor layers that are formed of the paste (21) covering each of the light-emitting elements (11); and a discharge control portion (14) for controlling the amount of the paste (21) to be redischarged for each phosphor layer in accordance with the thickness of the individual phosphor layers measured by the measurement portion (13). This phosphor layer forming apparatus can reduce the manufacturing time.