摘要:
The semiconductor device bonding apparatus 1 of the present invention includes: a pressing member 15 that presses the semiconductor device 10 toward the substrate 11 side in a state where a bump 14 is provided between the semiconductor device 10 and the substrate 11; an ultrasonic vibration applying member 16 that vibrates the semiconductor device 10 and the substrate 11 relatively by applying an ultrasonic vibration to at least one of the semiconductor device 10 and the substrate 11; a time measuring member 17 that measures a required time period from a time when starting to apply the ultrasonic vibration to a time when the semiconductor device 10 is pressed a predetermined distance; and a controlling member 18 that controls an output of an ultrasonic vibration during subsequent bonding, based on the time period measured by the time measuring member 17.
摘要:
A phosphor layer forming apparatus (1) in which a paste (21) containing a phosphor is discharged so as to cover each of a plurality of light-emitting elements (11) mounted on a substrate (10) includes the following: a discharge portion (12) for discharging the paste (21) in the form of droplets onto each of the light-emitting elements (11); a measurement portion (13) for measuring the thickness of individual phosphor layers that are formed of the paste (21) covering each of the light-emitting elements (11); and a discharge control portion (14) for controlling the amount of the paste (21) to be redischarged for each phosphor layer in accordance with the thickness of the individual phosphor layers measured by the measurement portion (13). This phosphor layer forming apparatus can reduce the manufacturing time.
摘要:
A phosphor layer forming apparatus (1) in which a paste (21) containing a phosphor is discharged so as to cover each of a plurality of light-emitting elements (11) mounted on a substrate (10) includes the following: a discharge portion (12) for discharging the paste (21) in the form of droplets onto each of the light-emitting elements (11); a measurement portion (13) for measuring the thickness of individual phosphor layers that are formed of the paste (21) covering each of the light-emitting elements (11); and a discharge control portion (14) for controlling the amount of the paste (21) to be redischarged for each phosphor layer in accordance with the thickness of the individual phosphor layers measured by the measurement portion (13). This phosphor layer forming apparatus can reduce the manufacturing time.
摘要:
A light-emitting module (2) includes a mounting board (1) with a conductor pattern and a plurality of light-emitting elements (15) mounted on the conductor pattern via wires (21). The extending direction of each of the wires (21) toward the conductor pattern is oriented irregularly when viewed perpendicularly to the mounting board (1). This can prevent the shadows of the wires (21) from overlapping, and thus can suppress the luminance nonuniformity.
摘要:
A light-emitting module (2) includes a mounting board (1) with a conductor pattern and a plurality of light-emitting elements (15) mounted on the conductor pattern via wires (21). The extending direction of each of the wires (21) toward the conductor pattern is oriented irregularly when viewed perpendicularly to the mounting board (1). This can prevent the shadows of the wires (21) from overlapping, and thus can suppress the luminance nonuniformity.
摘要:
The semiconductor device bonding apparatus 1 of the present invention includes: a pressing member 15 that presses the semiconductor device 10 toward the substrate 11 side in a state where a bump 14 is provided between the semiconductor device 10 and the substrate 11; an ultrasonic vibration applying member 16 that vibrates the semiconductor device 10 and the substrate 11 relatively by applying an ultrasonic vibration to at least one of the semiconductor device 10 and the substrate 11; a time measuring member 17 that measures a required time period from a time when starting to apply the ultrasonic vibration to a time when the semiconductor device 10 is pressed a predetermined distance; and a controlling member 18 that controls an output of an ultrasonic vibration during subsequent bonding, based on the time period measured by the time measuring member 17.
摘要:
A suction nozzle 65 of a reversing head device 22 has a distal end surface 65a with a suction hole 65b opened therein, and a suction passage 65c communicated with the suction hole 65b at one end thereof. A portion of the distal end surface 65a outside of the suction hole 65b abuts against bumps 39 of an electronic component 12. The suction hole 65b is opposed with a gap to a portion of a mounting side surface 12a where no bumps 39 are present. A vacuum pump 65 creates an air flow that flows from the gap between the suction hole 65b and mounting side surface 12a into the suction passage 65c through the suction hole 65b. The electronic component 12 is held at the distal end surface 65a by a negative pressure generated by the air flow.
摘要:
A suction nozzle (65) of a reversing head device (22) has a distal end surface (65a) with a suction hole (65b) opened therein, and a suction passage (65c) communicated with the suction hole (65b) at one end thereof. A portion of the distal end surface (65a) outside of the suction hole (65b) abuts against bumps (39) of an electronic component (12). The suction hole (65b) is opposed with a gap to a portion of a mounting side surface (12a) where no bumps (39) are present. A vacuum pump (65) creates an air flow that flows from the gap between the suction hole (65b) and the mounting side surface (12a) into the suction passage (65c) through the suction hole (65b). The electronic component (12) is held at the distal end surface (65a) by a negative pressure generated by the air flow.
摘要:
A method and an apparatus for mounting electronic components that enables precise mounting of electronic components, such as deformation-prone thin IC chips or fine-pitch and high-pin-count IC chips, on a substrate. Thin IC chips, which conventionally tend to lose flatness because of warping that occurs during production or deformation that occurs when picked up with a suction nozzle, are pressed against a substrate (4) with a preset load using a suction nozzle with a flat suction surface (11b) so as to correct deformation; the suction nozzle (11) is controlled to move up to make up for a decrease in the distance between the oppositely spaced IC chip and the substrate (4) that is caused by thermal expansion due to the heating for melting solder bumps (1a) on the electrodes; and the suction nozzle (11) is controlled to move down to mitigate the effect of a pulling-apart force applied to the molten parts as the thermally expanded parts cool down and contract.
摘要:
By arranging bonding members formed of a gold nanopaste between chip-electrodes and board-electrodes, making the chip-electrodes are brought in contact with the respective board-electrodes via the bonding members and applying ultrasonic vibrations to the bonding members in the contact state, the bonding members are bonded to the board-electrodes and the chip-electrodes.