摘要:
Engineering changes (EC) for an integrated-circuit (IC) module or circuits connected to an IC module sometimes require the addition of discrete electrical components or circuit chips. Such engineering changes are implemented herein on a small printed circuit card or board that may be physically attached to the top of the IC module. The EC pads on the printed circuit EC card are juxtaposed with the IC module input/output (I/O) pins that require the engineering change. A short fly wire is then soldered between each juxtaposed EC pad and the I/O pin to make the electrical connection between the EC card and the module. In this way, no additional surface area is consumed on the printed circuit board on which the module is mounted.
摘要:
A method and apparatus is provided which introduces a relative skew between a servo pattern and a magneto-resistive (MR) head in order to reduce interference introduced by inductive reading of shields formed as part of the MR head. The relative skew may be accomplished by introducing a skew angle directly on the head or by skewing the servo pattern formed on the magnetic medium relative to the head. Various skewed patterns may be used to reduce the overall interference.