公开(公告)号：US20090142940A1

公开(公告)日：2009-06-04

申请号：US12292718

申请日：2008-11-25

Applicant: Naoyuki Ikeda

Inventor： Naoyuki Ikeda

IPC: H01R12/00

CPC classification number: H05K7/026 ,  H05K1/0263 ,  H05K1/18 ,  H05K2201/10166 ,  H05K2201/10446 ,  H05K2201/10939

Abstract: The present invention is to provide a miniaturized electrical junction box including a miniaturized circuit board. The circuit board includes a plurality of transistors disposed side-by-side in-line each having a downwardly projecting control terminal, a laterally projecting output terminal, and an input terminal projecting oppositely of the control terminal and the output terminal of the associated transistor. The side-by-side in-line output terminals are oriented outwardly from the circuit board and inserted into a connector housing as connector terminals of a connector. The side-by-side in-line input terminals are connected to bus bars disposed rearward of the transistors for receiving electrical power through the bus bars.

Abstract translation: 本发明提供一种包括小型化电路板的小型电接线盒。 电路板包括并列排列的多个晶体管，每个具有向下突出的控制端子，横向投影的输出端子和与控制端子和相关联的晶体管的输出端相反地突出的输入端子。 并列输出端子从电路板向外取向，并作为连接器的连接器端子插入连接器壳体。 并排的串联输入端子连接到设置在晶体管后面的汇流条，用于通过母线接收电力。

公开(公告)号：US20170202088A1

公开(公告)日：2017-07-13

申请号：US15326870

申请日：2015-07-01

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd ,  Sumitomo Electric Industries, Ltd.

Inventor： Arinobu Nakamura

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0209 ,  H05K1/111 ,  H05K1/115 ,  H05K3/3421 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10757 ,  H05K2201/10939 ,  Y02P70/611 ,  Y02P70/613

Abstract: Provided is a circuit assembly that does not require e.g. bending of a terminal of an electronic component. A circuit assembly includes an electronic component that is to be mounted is connected to a conductive member through a first opening in a state in which its main body is disposed on one side of a substrate covering at least a part of the first opening formed in the substrate, and a first terminal is connected to a conductive pattern (a land) of the substrate, and a second terminal is connected to the conductive member through a second opening formed in the substrate.

公开(公告)号：US20150338451A1

公开(公告)日：2015-11-26

申请号：US14284451

申请日：2014-05-22

Applicant: Dell Products L.P.

Inventor： James Lewis Petivan ,  Alan R. Dellinger

IPC: G01R31/04 ,  H05K3/40 ,  H05K3/42

CPC classification number: G01R31/041 ,  G01R31/04 ,  G01R31/2813 ,  G01R31/2818 ,  H05K1/0268 ,  H05K1/0275 ,  H05K1/113 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/10022 ,  H05K2201/10151 ,  H05K2201/10651 ,  H05K2201/10939 ,  Y10T29/49156 ,  Y10T29/49167

Abstract: In accordance with embodiments of the present disclosure, a circuit board may include a connector configured to electrically couple a device to the circuit board. The connector may include a conductive element configured to be electrically coupled to a first voltage and a detection pad configured to be electrically coupled to a second voltage via a resistor, such that when a device pin of a device is electrically coupled to the conductive element, the detection pad is electrically coupled to the conductive element via the device pin.

Abstract translation: 根据本公开的实施例，电路板可以包括被配置为将设备电耦合到电路板的连接器。 连接器可以包括被配置为电耦合到第一电压的导电元件和被配置为经由电阻器电耦合到第二电压的检测焊盘，使得当器件的器件引脚电耦合到导电元件时， 检测焊盘通过器件引脚电耦合到导电元件。

公开(公告)号：US4040121A

公开(公告)日：1977-08-02

申请号：US581223

申请日：1975-05-27

Applicant: Reed H. Grundy

Inventor： Reed H. Grundy

IPC: H05K1/02 ,  H05K3/22 ,  H05K3/30 ,  H05K3/34 ,  H05K3/40 ,  H05K5/00

CPC classification number: H05K3/3447 ,  H05K3/308 ,  H05K2201/09418 ,  H05K2201/0979 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2201/10363 ,  H05K2201/10651 ,  H05K2201/10939 ,  H05K3/222 ,  H05K3/4046

Abstract: The external lead from a critical circuit element in a circuit component of a larger apparatus is connected to a first terminal or connector pad on a printed circuit board and at a more distant point on the lead to a second connector pad. The connection to the next element of that component is made from the second pad. Any component output to the next circuit component is connected to the first pad. Thus, any high resistance in a poor solder joint appears on the safe side of the first pad connections, that is, in the circuit connections to the next element or in the output circuit.

公开(公告)号：US20240049391A1

公开(公告)日：2024-02-08

申请号：US18229177

申请日：2023-08-02

Applicant: CYNTEC CO., LTD.

Inventor： Chien Ming Chen ,  DA-JUNG CHEN ,  SSU-LUNG HSU

IPC: H05K1/14 ,  H05K5/00 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/144 ,  H05K5/0065 ,  H05K1/028 ,  H05K1/118 ,  H05K1/147 ,  H05K5/0069 ,  H05K2201/10939

Abstract: An electronic module, comprising: a first electronic device, a first circuit board disposed over the first top surface, and a second circuit board disposed under the bottom surface of the body of the first electronic device, wherein a plurality of conductors are disposed over a first lateral surface for electrically connecting the first circuit board and the second circuit board, wherein a plurality of electrodes of the electronic module are disposed on a bottom surface of the second circuit board.

公开(公告)号：US20180261935A1

公开(公告)日：2018-09-13

申请号：US15913494

申请日：2018-03-06

Applicant: Tarng Yu Enterprise co.,ltd.

Inventor： Mu-Jung Huang ,  Ying-Chung Chen

IPC: H01R12/57 ,  H05K1/18 ,  H01R43/20

CPC classification number: H01R12/57 ,  H01R13/415 ,  H01R43/20 ,  H05K1/181 ,  H05K2201/10151 ,  H05K2201/10378 ,  H05K2201/10757 ,  H05K2201/10939

Abstract: An altitude increasing connector and the method for manufacturing the same for an electrical connection of a sensor element and a circuit substrate inside a portable electronic device, such that the sensor element is altitude increased, thereby an appropriate disposition altitude of the sensor element is adjusted, in order to ensure normal function of the sensor element, so that the yield of the portable electronic device is increased. The altitude increasing connector has a plurality of conductive terminals, each of which has a first welding pad for welding the sensor element and a second welding pad for welding the circuit substrate, wherein a distance between welding surfaces of both the first, second welding pads of each conductive terminal is fixed, such that a relative distance between electrical joints of both the sensor element and the circuit substrate is fixed.

公开(公告)号：US09974182B2

公开(公告)日：2018-05-15

申请号：US15326870

申请日：2015-07-01

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd ,  Sumitomo Electric Industries, Ltd.

Inventor： Arinobu Nakamura

IPC: H05K7/10 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0209 ,  H05K1/111 ,  H05K1/115 ,  H05K3/3421 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10757 ,  H05K2201/10939 ,  Y02P70/611 ,  Y02P70/613

Abstract: Provided is a circuit assembly that does not require e.g. bending of a terminal of an electronic component. A circuit assembly includes an electronic component that is to be mounted is connected to a conductive member through a first opening in a state in which its main body is disposed on one side of a substrate covering at least a part of the first opening formed in the substrate, and a first terminal is connected to a conductive pattern (a land) of the substrate, and a second terminal is connected to the conductive member through a second opening formed in the substrate.

公开(公告)号：US3888639A

公开(公告)日：1975-06-10

申请号：US42991774

申请日：1974-01-02

Applicant: TELEDYNE ELECTRO MECHANISMS

Inventor： HASTINGS MYRON L ,  ROBERTS JOSEPH P

IPC: H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/363 ,  H05K3/28 ,  H05K3/305 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/4038 ,  H05K3/4046 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/041 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10477 ,  H05K2201/10939 ,  H05K2201/10977 ,  Y10T29/49126

Abstract: A method for electrically and mechanically connecting two printed circuit boards involves creating a first hole in the overcoat of the first circuit board at all points where electrical connection to the second circuit is desired. Then a second, smaller hole is made within the first hole, completely through the first circuit board. Next, the two circuits are juxtaposed, with the first above the second, and fastened together by an adhesive. A third hole, smaller than the second and located nearly concentric with the first and second holes, is then made through the second circuit board. Finally, the electrical and additional mechanical connection is made by inverting the combination and passing it over a solder wave of a wave soldering machine. During this process the third hole acts as a vent.

公开(公告)号：US3184699A

公开(公告)日：1965-05-18

申请号：US27010463

申请日：1963-04-02

Applicant: PHILCO CORP

Inventor： SPERA FRANK T

IPC: H01R12/71 ,  H05K3/30 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K3/306 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/09645 ,  H05K2201/10424 ,  H05K2201/10477 ,  H05K2201/1059 ,  H05K2201/10689 ,  H05K2201/10765 ,  H05K2201/10939 ,  Y10T29/53183

公开(公告)号：US08569631B2

公开(公告)日：2013-10-29

申请号：US13101908

申请日：2011-05-05

Applicant: Robert L. Doneker ,  Kent G. R. Thompson

Inventor： Robert L. Doneker ,  Kent G. R. Thompson

IPC: H05K1/03

CPC classification number: H05K1/023 ,  H05K1/0216 ,  H05K1/0366 ,  H05K3/308 ,  H05K3/4046 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/0761 ,  H05K2201/10939 ,  H05K2203/1453

Abstract: A noise dampening energy efficient circuit board includes a carbon material layer for dampening electromagnetic interference between surface mount components and trace patterns of the circuit board. One or more ground plane layers are arranged relative to the carbon material layer to cooperatively dampen and repel noise of varying frequencies. The positioning of the carbon material layer with respect to the ground plane layer enhances the ground plane operation. Glass fiber material layers and other insulating dielectric layers are disposed at particular locations within the noise dampening energy efficient circuit board. The carbon material layer and the ground plane layer dampen electromagnetic noise, thereby permitting energy saving design considerations, increasing energy efficiencies and reducing power consumption. Mounting posts of the surface mount components include insulating sleeves to selectively insulate different layers of the circuit board from surface mount components. Methods for constructing and using the circuit board are also disclosed.

Abstract translation: 噪声抑制能效电路板包括用于抑制表面安装部件和电路板的迹线图案之间的电磁干扰的碳材料层。 相对于碳材料层布置一个或多个接地层，以协同地抑制和排斥变化频率的噪声。 碳材料层相对于接地层的定位增强了接地层的操作。 玻璃纤维材料层和其它绝缘电介质层设置在噪声抑制能效电路板内的特定位置。 碳材料层和接地层可抑制电磁噪声，从而节省设计考虑因素，提高能源效率并降低功耗。 表面安装部件的安装柱包括绝缘套管，以选择性地将电路板的不同层与表面安装部件绝缘。 还公开了构造和使用电路板的方法。