公开(公告)号：US08199527B2

公开(公告)日：2012-06-12

申请号：US12123944

申请日：2008-05-20

申请人： Masakazu Muranaga

发明人： Masakazu Muranaga

IPC分类号： H05K9/00

CPC分类号： H05K3/341 ,  H01L23/053 ,  H01L23/10 ,  H01L23/552 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K9/0026 ,  H05K2201/10371 ,  H05K2201/1084 ,  Y02P70/613 ,  Y10T428/24488 ,  H01L2924/014 ,  H01L2224/0401

摘要： When manufacturing an electronic component having a flip chip or a surface mount component mounted on a sheet substrate and being covered with a shield cover, the above shield cover is dipped into cream solder and placed on the above sheet substrate after the above cream solder is attached to the peripheral edge sides of the above shield cover, and then the shield cover is fixed to the sheet substrate by reflow process. With such manufacturing, it becomes possible to efficiently fix the shield cover to the sheet substrate. Also, the shield cover can securely be fixed against the bend of the sheet substrate produced during the reflow.

摘要翻译： 当制造具有安装在片状基板上并覆盖有屏蔽罩的倒装芯片或表面安装部件的电子部件时，将上述屏蔽盖浸入膏状焊剂中，并且在上述膏状焊料附着之后放置在上述片状基材上 到上述屏蔽罩的周边边缘，然后通过回流工艺将屏蔽盖固定到片状基板。 通过这样的制造，可以将屏蔽罩有效地固定在片状基板上。 此外，屏蔽盖可以牢固地固定抵靠在回流期间产生的片状基板的弯曲。

公开(公告)号：US20120044625A1

公开(公告)日：2012-02-23

申请号：US13173685

申请日：2011-06-30

申请人： Masakazu Muranaga ,  Kimihiro Maruyama ,  Koki Sato ,  Mitsuru Kobayashi

发明人： Masakazu Muranaga ,  Kimihiro Maruyama ,  Koki Sato ,  Mitsuru Kobayashi

IPC分类号： H05K7/00 ,  H05K3/34 ,  G06F1/16

CPC分类号： H05K5/026 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/10159 ,  Y10T29/49144

摘要： A card module includes a top case, a bottom case engaged with the top case, a substrate being positioned between the top case and the bottom case and including a first connection terminal, an electronic device provided in a space formed by engaging the top case with the bottom case, and a terminal substrate including a first surface on which a second connection terminal is formed, a second surface on which an electrode terminal is formed, and a through-hole in which a connection electrode is formed. The first connection terminal is connected to the second connection terminal. The second connection terminal and the electrode terminal are connected via the connection electrode.

摘要翻译： 卡模块包括顶壳，与顶壳接合的底壳，基板定位在顶壳和底壳之间，并且包括第一连接端子，设置在通过使顶壳接合形成的空间中的电子装置， 底壳体和包括形成有第二连接端子的第一表面的端子基板，形成有电极端子的第二表面和形成有连接电极的通孔。 第一连接端子连接到第二连接端子。 第二连接端子和电极端子经由连接电极连接。

公开(公告)号：US20080292846A1

公开(公告)日：2008-11-27

申请号：US12123944

申请日：2008-05-20

申请人： Masakazu MURANAGA

发明人： Masakazu MURANAGA

IPC分类号： B32B3/02 ,  B05D5/12

CPC分类号： H05K3/341 ,  H01L23/053 ,  H01L23/10 ,  H01L23/552 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K9/0026 ,  H05K2201/10371 ,  H05K2201/1084 ,  Y02P70/613 ,  Y10T428/24488 ,  H01L2924/014 ,  H01L2224/0401

摘要： When manufacturing an electronic component having a flip chip or a surface mount component mounted on a sheet substrate and being covered with a shield cover, the above shield cover is dipped into cream solder and placed on the above sheet substrate after the above cream solder is attached to the peripheral edge sides of the above shield cover, and then the shield cover is fixed to the sheet substrate by reflow process. With such manufacturing, it becomes possible to efficiently fix the shield cover to the sheet substrate. Also, the shield cover can securely be fixed against the bend of the sheet substrate produced during the reflow.

摘要翻译： 当制造具有安装在片状基板上并覆盖有屏蔽罩的倒装芯片或表面安装部件的电子部件时，将上述屏蔽盖浸入膏状焊剂中，并且在上述膏状焊料附着之后放置在上述片状基材上 到上述屏蔽罩的周边边缘，然后通过回流工艺将屏蔽盖固定到片状基板。 通过这样的制造，可以将屏蔽罩有效地固定在片状基板上。 此外，屏蔽盖可以牢固地固定抵靠在回流期间产生的片状基板的弯曲。