公开(公告)号：US20110301782A1

公开(公告)日：2011-12-08

申请号：US13201891

申请日：2010-08-31

申请人： Masataka Yamamoto ,  Masayuki Kondo

发明人： Masataka Yamamoto ,  Masayuki Kondo

IPC分类号： G06F7/00

CPC分类号： B60R21/015 ,  B60N2/002 ,  B60R21/0152 ,  G01G19/4142

摘要： It is provided a subsystem for seat weight detection, the configuration of which enables improved assemblability and economization of space in layout. A seat weight detecting subsystem is provided for each seat 7 mounted inside a vehicle. Each seat weight detecting subsystem 4 includes weight detection sensors 8 which are installed in a seat 7, and a power supplying member 9 which is connected to the weight detecting sensors 8, a power supply 5, an ECU 3 and the like. The power supplying member 9 is provided with an FPC 10 and a seat side ECU functional portion 11 that is integratedly attached to the FPC 10. The seat-side ECU functional portion 11 includes sensor connecting sections 13, a signal receiving section 14, a data generating section 15, and a data outputting section 16.

摘要翻译： 它提供了一个座椅重量检测子系统，其配置使得布局中空间的组装和节省得以改善。 为安装在车辆内的每个座椅7设置座椅重量检测子系统。 每个座椅重量检测子系统4包括安装在座椅7中的重量检测传感器8和连接到重量检测传感器8的电源构件9，电源5，ECU 3等。 供电部件9设置有FPC 10和一体地安装在FPC10上的座侧ECU功能部分11.座椅侧ECU功能部分11包括传感器连接部分13，信号接收部分14，数据 生成部分15和数据输出部分16。

公开(公告)号：US20100085686A1

公开(公告)日：2010-04-08

申请号：US12522077

申请日：2008-06-17

申请人： Ryousuke Sugihara ,  Masayuki Kondo ,  Yuhei Tsurumoto

发明人： Ryousuke Sugihara ,  Masayuki Kondo ,  Yuhei Tsurumoto

IPC分类号： H01G9/02 ,  C09K3/00 ,  H01G9/022

CPC分类号： H01G9/028 ,  C08G61/12 ,  C08K5/42 ,  C08L65/00 ,  H01G9/0036

摘要： The present invention provides an agent serving as oxidant and dopant in which it does not generate precipitates in a state of an alcohol solution for a certain period of time and the oxidizing power is not too strong. By using the same, the present invention provides a conductive polymer having a high conductivity and heat resistance. By using the same, the present invention provides a solid electrolytic capacitor reliable under a high temperature condition. The present invention provides an agent serving as oxidant and dopant for conductive polymer production, the agent serving as oxidant and dopant comprising: a ferric salt of acids comprising a benzene sulfonic acid derivative represented by formula (1) and sulfuric acid. “R” represents an alkyl or alkoxy group having a carbon number of 1 to 4. More than 90 mole % of the benzene sulfonic acid derivative have R at the para position with respect to the SO3H group. Sulfuric acid is contained at 0.05 to 1.5 mass % in the acids. An alkali metal and alkali earth metal as an inorganic alkali component are included at a total content of 300 ppm or less (based on mass). ammonia and an amine as an organic alkali component are included at a total content of 0.01 mole % or less. A pH value is 1.5 to 3.0 when the agent serving as oxidant and dopant is made into an aqueous solution at a concentration of 8 mass %.

摘要翻译： 本发明提供了作为氧化剂和掺杂剂的试剂，其在醇溶液状态下不会在某一时间段内产生沉淀物，并且氧化能力不太强。 通过使用它们，本发明提供了具有高导电性和耐热性的导电聚合物。 通过使用本发明，本发明提供一种在高温条件下可靠的固体电解电容器。 本发明提供了用作导电聚合物生产的氧化剂和掺杂剂的试剂，用作氧化剂和掺杂剂的试剂包括：包含由式（1）表示的苯磺酸衍生物和硫酸的酸的三价盐。 “R”表示碳原子数为1〜4的烷基或烷氧基。相对于SO 3 H基，相对于SO 3 H基，相对于90％以上的苯磺酸衍生物的对位为R。 酸中的硫酸含量为0.05〜1.5质量％。 作为无机碱成分的碱金属和碱土金属含量为300ppm以下（以质量计）。 氨和作为有机碱成分的胺的总含量为0.01摩尔％以下。 将作为氧化剂和掺杂剂的试剂制成浓度为8质量％的水溶液时，pH值为1.5〜3.0。

公开(公告)号：US06935551B2

公开(公告)日：2005-08-30

申请号：US10471773

申请日：2002-02-14

申请人： Masayuki Kondo

发明人： Masayuki Kondo

IPC分类号： B23K20/10 ,  B23K101/38 ,  H01R43/02 ,  B23K1/06 ,  B23K37/00

CPC分类号： B23K20/10 ,  B23K2101/38

摘要： Intersected portions (C) of coated electric wires 20 and (21) are sandwiched and pressurized between a horn-side chip (11) and an anvil-side chip (12) (sandwiching step). Ultrasonic vibration force determined by a first vibration condition is applied to the horn-side chip (11) to melt insulators (20a) and (21a) of the coated electric wires (20) and (21) (insulator-melting step). A time point when conductors (20b) and (21b) of the coated electric wires (20) and (21) come into contact with each other is automatically detected by the melting of the insulators (20a) and (21a) (conductor contact-detecting step). After the conductors came into contact with each other, ultrasonic vibration force determined by a second vibration condition is applied to the horn-side chip (11), thereby bonding the conductors (20b) and (21b) to each other (conductor-bonding step).

摘要翻译： 涂覆电线20和（21）的交叉部分（C）在喇叭侧芯片（11）和砧座侧芯片（12）之间夹持并加压（夹持步骤）。 通过第一振动条件确定的超声波振动力被施加到喇叭侧芯片11，以熔化被覆电线（20）和（21）的绝缘体（20A）和（21a）（绝缘体熔融步骤） 。 涂覆电线（20）和（21）的导体（20b）和（21b）彼此接触的时间点是通过绝缘体（20a）和（21a）的熔化来自动检测的， （导体接触检测步骤）。 在导体相互接触之后，通过第二振动条件确定的超声波振动力被施加到喇叭侧芯片11，从而将导体（20b）和（21b）彼此接合（导体 - 键合步骤）。

公开(公告)号：US06796781B2

公开(公告)日：2004-09-28

申请号：US09732788

申请日：2000-12-11

申请人： Masayuki Kondo

发明人： Masayuki Kondo

IPC分类号： B29C3342

CPC分类号： B29C45/14467 ,  B29C45/14426 ,  B29L2031/3462

摘要： An apparatus in which a pair of hollow molding portions 53 and 54 for molding in which a terminal connecting portion with a terminal fitting 20 crimped onto a conductor 11 at a tip portion of a sheathed wire 10 is accommodated and set are provided inside a mold 50 made up by an upper mold 51 and a lower mold 52, a molding resin 30 in a molten state being injected and poured into the molding portions 53 and 54 to cover and mold the terminal connecting portion so as to provide waterproofing, the terminal connecting portion subjected to covering and molding being released from the mold so as to be removed outside the mold. A casting surface of the molding portion 53 of the upper mold 51 is provided with a gradient or a curvature for facilitating the release of the terminal connecting portion subjected to covering and molding from the mold, whereby the terminal connecting portion subjected to covering and molding remains in the molding portion 54 of the lower mold 52 during mold releasing.

摘要翻译： 一种用于模制的一对中空成型部分53和54被设置在模具50的内部，该中空成形部分53和54被容纳和固定在其中，在端子连接部分中端子接头20被压接在铠装导线10的顶端处的导体11上 由上模51和下模52构成，将熔融状态的模塑树脂30注入并注入到模制部分53和54中，以覆盖和模制端子连接部分以提供防水，端子连接部分 经过覆盖和模制从模具中释放，以便在模具外部移除。 上模51的模制部分53的铸造表面设置有梯度或曲率，以便于从模具中脱模覆盖和模制的端子连接部分的释放，从而保持覆盖和模制的端子连接部分保持 在脱模时在下模具52的模制部分54中。

公开(公告)号：US06626696B2

公开(公告)日：2003-09-30

申请号：US09933072

申请日：2001-08-21

申请人： Masayuki Kondo

发明人： Masayuki Kondo

IPC分类号： H01R1358

CPC分类号： H02G15/113 ,  H01R12/772 ,  H01R13/582 ,  H01R13/5829 ,  H01R13/5837 ,  H02G15/007

摘要： Projections are provided in gaps between each wire opening for electric wire main bodies of a flat cable in a connection box to clamp and hold the flat cable. Stronger holding force is easily attained with smaller body size of the connection box for a flat cable. Various flat cables with deferent wire diameter are accepted in the same size connection box. The operation for assembling the connection box and the flat cable is facilitated.

公开(公告)号：US4446254A

公开(公告)日：1984-05-01

申请号：US367045

申请日：1982-04-09

申请人： Hiroyuki Nakae ,  Isamu Noguchi ,  Masayuki Kondo

发明人： Hiroyuki Nakae ,  Isamu Noguchi ,  Masayuki Kondo

IPC分类号： C08J9/00 ,  C08J9/10 ,  C08J9/06

CPC分类号： C08J9/0066 ,  C08J9/0061 ,  C08J9/10 ,  C08J2323/08 ,  C08J2331/04 ,  C08J2423/00 ,  Y10S521/907 ,  Y10S521/908 ,  Y10S521/909 ,  Y10S521/915

摘要： A crosslinked foam having an expansion ratio of 25 to 60 which comprises a composition containing 100 parts by weight of a resin component consisting of an ethylenevinyl acetate copolymer or a mixture thereof with a thermoplastic resin and 50 to 500 parts by weight of an inorganic powder material.

摘要翻译： 膨胀率为25〜60的交联泡沫体，其包含含有100重量份由乙烯 - 乙酸乙烯酯共聚物或其与热塑性树脂的混合物组成的树脂组分和50-500重量份无机粉末材料的组合物 。

公开(公告)号：US4400070A

公开(公告)日：1983-08-23

申请号：US343512

申请日：1982-01-28

申请人： Masaru Isono ,  Kazuo Nunokawa ,  Masayuki Kondo ,  Shinzo Takada

发明人： Masaru Isono ,  Kazuo Nunokawa ,  Masayuki Kondo ,  Shinzo Takada

IPC分类号： A61B3/10 ,  A61B3/14 ,  G02B7/00 ,  G02B7/28 ,  G02B27/40 ,  G03B3/10 ,  G03B29/00 ,  H04N5/26

CPC分类号： G02B7/28 ,  A61B3/12

摘要： A focus detecting device for an eye fundus camera including a target having a target pattern comprised of a first slit and a second and third slits disposed in parallel with and at the opposite sides of the first slit. The second and third slits are symmetrical to each other with respect to the first slit. Deflecting prisms are provided to deflect the luminous flux through the first slit in one direction perpendicular to the longitudinal axis of the first slit and the luminous fluxes through the second and third slits in the opposite direction. The slit pattern is convenient for automatic focus adjustment.

摘要翻译： 一种用于眼底照相机的焦点检测装置，包括具有由第一狭缝构成的目标图案的目标物和与第一狭缝平行设置的第二和第三狭缝。 第二和第三狭缝相对于第一狭缝彼此对称。 提供偏转棱镜以使光束在垂直于第一狭缝的纵向轴线的一个方向上通过第一狭缝偏转，并且通过第二和第三狭缝沿相反方向偏转光束。 狭缝图案便于自动对焦调节。

公开(公告)号：US08930084B2

公开(公告)日：2015-01-06

申请号：US13201891

申请日：2010-08-31

申请人： Masataka Yamamoto ,  Masayuki Kondo

发明人： Masataka Yamamoto ,  Masayuki Kondo

IPC分类号： B60R22/00 ,  E05F15/00 ,  G05D1/00 ,  G05D3/00 ,  G06F7/00 ,  G06F17/00 ,  B60R21/015 ,  B60N2/00 ,  G01G19/414

CPC分类号： B60R21/015 ,  B60N2/002 ,  B60R21/0152 ,  G01G19/4142

摘要： It is provided a subsystem for seat weight detection, the configuration of which enables improved assemblability and economization of space in layout. A seat weight detecting subsystem is provided for each seat 7 mounted inside a vehicle. Each seat weight detecting subsystem 4 includes weight detection sensors 8 which are installed in a seat 7, and a power supplying member 9 which is connected to the weight detecting sensors 8, a power supply 5, an ECU 3 and the like. The power supplying member 9 is provided with an FPC 10 and a seat side ECU functional portion 11 that is integratedly attached to the FPC 10. The seat-side ECU functional portion 11 includes sensor connecting sections 13, a signal receiving section 14, a data generating section 15, and a data outputting section 16.

摘要翻译： 它提供了一个座椅重量检测子系统，其配置使得布局中空间的组装和节省得以改善。 为安装在车辆内的每个座椅7设置座椅重量检测子系统。 每个座椅重量检测子系统4包括安装在座椅7中的重量检测传感器8和连接到重量检测传感器8的电源构件9，电源5，ECU 3等。 供电部件9设置有FPC 10和一体地安装在FPC10上的座侧ECU功能部分11.座椅侧ECU功能部分11包括传感器连接部分13，信号接收部分14，数据 生成部分15和数据输出部分16。

公开(公告)号：US07785426B2

公开(公告)日：2010-08-31

申请号：US10551222

申请日：2004-03-31

申请人： Masaaki Tabuchi ,  Hirokazu Okada ,  Masayuki Kondo ,  Susumu Tsukamoto ,  Fujio Abe

发明人： Masaaki Tabuchi ,  Hirokazu Okada ,  Masayuki Kondo ,  Susumu Tsukamoto ,  Fujio Abe

IPC分类号： C22C38/32 ,  C22C38/24 ,  C22C38/26

CPC分类号： C22C38/22 ,  C22C38/02 ,  C22C38/04 ,  C22C38/24 ,  C22C38/26 ,  C22C38/30

摘要： A welded joint of a tempered martensitic heat resisting steel includes a fine-grained heat affected zone of weldment of a heat resisting steel having a tempered martensite structure which exhibits a creep strength of 90% or more of the creep strength of the base metal thereof. The welded joint is inhibited in the formation of the fine-grained HAZ exhibiting a significantly reduced creep strength.

摘要翻译： 回火马氏体系耐热钢的焊接接头包括具有回火强度为90％以上的耐回火钢的焊接体的细粒热影响区域，其回火强度为其贱金属的蠕变强度。 焊接接头在形成细颗粒HAZ时被抑制，表现出显着降低的蠕变强度。

公开(公告)号：US20090061554A1

公开(公告)日：2009-03-05

申请号：US12162504

申请日：2007-01-30

申请人： Daisuke Suzuki ,  Masayuki Kondo

发明人： Daisuke Suzuki ,  Masayuki Kondo

IPC分类号： H01L21/00

CPC分类号： H01L31/0203 ,  H01L23/49861 ,  H01L27/14618 ,  H01L2924/0002 ,  H04N5/2253 ,  H01L2924/00

摘要： The present invention provides a resinous hollow package that includes a moisture-proof island that is a planar structure disposed below a semiconductor element mounting surface of the resinous hollow package, the semiconductor element mounting surface having an area of 200 mm2 or more and the maximum wave height of a wave curve of 35 μm or less. The resinous hollow package of the invention has an excellent moisture resistance due to the moisture-proof island included therein. Further, since the flatness of the semiconductor element mounting surface is excellent, decrease in the amount of light in a peripheral portion of an image can be suppressed in a digital single-lens reflex camera or the like with a large solid-state image sensor, even when a wide angle lens is used. According to the method of producing the resinous hollow package of the invention, by carrying out insert-molding while fixing the moisture-proof island with projection(s) disposed to the mold to prevent displacement thereof, the resinous hollow package having the maximum wave height of the semiconductor element mounting surface of 35 μm or less can be provided.

摘要翻译： 本发明提供了一种树脂中空包装，其包括防水岛，其是设置在树脂中空包装的半导体元件安装表面下方的平面结构，半导体元件安装表面具有200mm 2以上的面积和最大波 35米或更小的波形曲线的高度。 本发明的树脂中空包装由于其中包含防潮岛而具有优异的耐湿性。 此外，由于半导体元件安装面的平坦度优异，因此在具有大型固态图像传感器的数字单镜头反光照相机等中，可以抑制图像周边部分的光量的减少， 即使使用广角镜头也是如此。 根据本发明的树脂中空包装体的制造方法，通过在将防湿岛固定在配置于模具上的突起部进行插入成型的同时进行嵌入成型，以防止其移位，具有最大波高的树脂中空包装 的半导体元件安装面为35μm以下。