公开(公告)号：US09815146B2

公开(公告)日：2017-11-14

申请号：US14001486

申请日：2012-02-28

Applicant: Hermann Oppermann ,  Matthias Hutter ,  Christian Ehrhardt

Inventor： Hermann Oppermann ,  Matthias Hutter ,  Christian Ehrhardt

IPC: B23K35/26 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  B23K35/02 ,  B23K35/32 ,  H01L23/00

CPC classification number: B23K35/025 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/262 ,  B23K35/264 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/322 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/362 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29294 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29499 ,  H01L2224/32507 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/13055 ,  H01L2924/15787 ,  Y10T403/479 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

Abstract: The invention relates to a paste, preferably for joining components of power electronics modules, the paste comprising a solder powder, a metal powder and a binder, wherein the binder binds solder powder and metal powder before a first heating. According to the invention, the binder is free of flux or is a flux having only low activation. In this way, a joining layer which exhibits only few included voids and good mechanical and electrical stability can be provided between a first and a second component.

公开(公告)号：US20110162871A1

公开(公告)日：2011-07-07

申请号：US13001820

申请日：2009-06-26

Applicant: Rolf Diehm ,  Wolfgang Ludeck ,  Andrey Prihodovsky ,  Wolfgang Schmitt ,  Hubert Trageser ,  Andreas Fix ,  Matthias Hutter ,  Uwe Pape ,  Patrick Zerrer ,  Hartmut Meier ,  Bernd Müller ,  Ulrich Wittreich ,  Dirk Wormuth

Inventor： Rolf Diehm ,  Wolfgang Ludeck ,  Andrey Prihodovsky ,  Wolfgang Schmitt ,  Hubert Trageser ,  Andreas Fix ,  Matthias Hutter ,  Uwe Pape ,  Patrick Zerrer ,  Hartmut Meier ,  Bernd Müller ,  Ulrich Wittreich ,  Dirk Wormuth

IPC: H01B5/00 ,  B23K35/363 ,  B23K1/20

CPC classification number: B23K35/3618 ,  B23K35/0227 ,  B23K35/0244 ,  B23K35/025 ,  B23K2101/36 ,  H05K3/282 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2201/0224 ,  H05K2203/0425

Abstract: Solder materials, such as a solder paste, and contact surfaces for solder connections are provided in which a metal stearate is used as a flux. The metal stearate is applied either as a solid layer on the solder particles or as contact surfaces or is present as a dispersion or solution in a binder. Advantageously, such materials allow one to avoid the use of classical fluxes. In particular, non-resin solder materials can be provided. A simplified storage and processability of the solder materials results, while at the same time producing comparatively better solder connections. The ability to use metal stearates as a flux is achieved if the first oxide of the metals used is formed from pure metal at lower oxygen activity (ao) than the first chromium oxide of chromium, preferably lower than the first titanium oxide of titanium, and if the metal stearate is present in a sufficient amount.

Abstract translation: 提供诸如焊膏的焊料和用于焊接连接的接触表面，其中使用金属硬脂酸酯作为焊剂。 金属硬脂酸酯作为固体层施加在焊料颗粒上或作为接触表面，或作为粘合剂中的分散体或溶液存在。 有利地，这样的材料允许避免使用经典助焊剂。 特别地，可以提供非树脂焊料材料。 导致焊料材料的简化存储和加工性能，同时产生较好的焊接连接。 使用金属硬脂酸盐作为助熔剂的能力是实现的，如果使用的金属的第一氧化物由比第一氧化铬（优选低于钛的第一氧化钛）低的氧活性（ao）的纯金属形成， 如果金属硬脂酸酯以足够的量存在。