公开(公告)号：US06673723B2

公开(公告)日：2004-01-06

申请号：US09815226

申请日：2001-03-22

申请人： Bharat Z. Patel ,  Jay D. Baker ,  Lakhi N. Goenka ,  Michael Allen Howey ,  Mohan R. Paruchuri ,  Richard Keith McMillan

发明人： Bharat Z. Patel ,  Jay D. Baker ,  Lakhi N. Goenka ,  Michael Allen Howey ,  Mohan R. Paruchuri ,  Richard Keith McMillan

IPC分类号： H01L21302

CPC分类号： H05K3/44 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4038 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0361 ,  H05K2201/0397 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09609 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/0733 ,  H05K2203/1184

摘要： A method 10 for making a multi-layer circuit board 70 having at least one electrically conductive interconnection portion or “via” 72 which extends within the board 70 and at least one air-bridge 74. The method 10 includes the steps of forming protuberances 13 upon a core member 12, attaching pre-circuit assemblies 32, 34 to the core member 12, thereby forming the circuit board 70 while concomitantly and selectively extending at least one of the protuberances 13 within the formed circuit board 70.

摘要翻译： 制造多层电路板70的方法10具有至少一个在板70内和至少一个空气桥74上延伸的导电互连部分或“通孔”72。方法10包括以下步骤：形成突起13 在芯构件12上，将预电路组件32,34附接到芯构件12，从而形成电路板70，同时并且选择性地延伸形成的电路板70内的至少一个突起13。