公开(公告)号：US09698302B2

公开(公告)日：2017-07-04

申请号：US15028228

申请日：2015-12-02

申请人： Min Yan ,  Jun Cheng ,  Mingbo Zhou

发明人： Min Yan ,  Jun Cheng ,  Mingbo Zhou

IPC分类号： H01L29/18 ,  H01L21/66 ,  H01L33/20 ,  H01L33/62 ,  H01L21/329 ,  H01L29/45 ,  H01L33/00

CPC分类号： H01L33/007 ,  H01L22/14 ,  H01L25/0753 ,  H01L33/005

摘要： A method for manufacturing on a compound glass substrate a multi-colored LED for use in a video display board includes preparing a first masking layer on a compound glass substrate; depositing a first-color epitaxial layer on the first-color LED growing region and the first masking layer, to form a first-color LED; removing the first masking layer and the first-color epitaxial layer on the first masking layer; preparing a second masking layer, wherein the second masking layer is used to mask another region except a second-color LED growing region; depositing a second-color epitaxial layer on the second-color LED growing region and the second masking layer, to form a second-color LED; removing the second masking layer and the second-color epitaxial layer on the second masking layer; and grinding, cleaning, and performing an electrical test on a surface of the compound glass substrate.

公开(公告)号：US09633972B2

公开(公告)日：2017-04-25

申请号：US14903934

申请日：2014-05-06

申请人： Jun Cheng ,  Min Yan ,  Mingbo Zhou

发明人： Jun Cheng ,  Min Yan ,  Mingbo Zhou

IPC分类号： H01L25/04 ,  H01L21/50 ,  H01L21/66 ,  H01L25/03 ,  H01L25/075 ,  H01L33/00 ,  H01L23/00 ,  H01L33/62 ,  H01L25/00

CPC分类号： H01L25/042 ,  H01L21/50 ,  H01L22/12 ,  H01L22/14 ,  H01L22/22 ,  H01L24/95 ,  H01L25/03 ,  H01L25/0753 ,  H01L25/50 ,  H01L33/0095 ,  H01L33/62 ,  H01L2924/01322 ,  H01L2924/10158 ,  H01L2933/0066 ,  H01L2924/00

摘要： A manufacturing method includes: attaching a film onto a bonding surface of a wafer; performing laser cutting on the wafer to obtain a plurality of semiconductor light-emitting eutectic chips; attaching light-emitting surfaces of the plurality of eutectic chips on to an expansion film; detaching films from bonding surfaces of the plurality of eutectic chips; performing wafer expansion on the expansion film so that the plurality of eutectic chips have the same intervals as chip loading spaces on a substrate; attaching the expansion film onto a tray, and moving the tray so that positions of the plurality of eutectic chips correspond to that of the chip loading spaces; moving the tray so that the plurality of eutectic chips approach the chip loading spaces on the substrate; and embedding the plurality of eutectic chips into the chip loading spaces so that the plurality of eutectic chips are electrically connected to the substrate.

公开(公告)号：US20160329459A1

公开(公告)日：2016-11-10

申请号：US15028228

申请日：2015-12-02

申请人： Min YAN ,  Jun CHENG ,  Mingbo ZHOU

发明人： Min YAN ,  Jun CHENG ,  Mingbo ZHOU

IPC分类号： H01L33/00 ,  H01L21/66

CPC分类号： H01L33/007 ,  H01L22/14 ,  H01L25/0753 ,  H01L33/005

摘要： A method for manufacturing on a composite glass substrate a multi-colored LED for use in a video display board includes preparing a first masking layer on a composite glass substrate; depositing a first-color epitaxial layer on the first-color LED growing region and the first masking layer, to form a first-color LED; removing the first masking layer and the first-color epitaxial layer on the first masking layer; preparing a second masking layer, wherein the second masking layer is used to mask another region except a second-color LED growing region; depositing a second-color epitaxial layer on the second-color LED growing region and the second masking layer, to form a second-color LED; removing the second masking layer and the second-color epitaxial layer on the second masking layer; and grinding, cleaning, and performing an electrical test on a surface of the composite glass substrate.

摘要翻译： 在复合玻璃基板上制造用于视频显示板的多色LED的方法包括：在复合玻璃基板上制备第一掩模层; 在第一颜色LED生长区和第一掩蔽层上沉积第一颜色外延层以形成第一颜色LED; 去除第一掩模层上的第一掩模层和第一颜色外延层; 制备第二掩蔽层，其中所述第二掩蔽层用于掩蔽除了第二颜色LED生长区域之外的另一区域; 在所述第二颜色LED生长区域和所述第二掩模层上沉积第二颜色外延层，以形成第二颜色LED; 去除第二掩模层上的第二掩模层和第二颜色外延层; 并对复合玻璃基板的表面进行研磨，清洗和进行电气试验。

公开(公告)号：US20160225740A1

公开(公告)日：2016-08-04

申请号：US14903934

申请日：2014-05-06

申请人： Jun CHENG ,  Min YAN ,  Mingbo ZHOU

发明人： Jun CHENG ,  Min YAN ,  Mingbo ZHOU

IPC分类号： H01L25/04 ,  H01L21/66 ,  H01L33/62 ,  H01L33/00

CPC分类号： H01L25/042 ,  H01L21/50 ,  H01L22/12 ,  H01L22/14 ,  H01L22/22 ,  H01L24/95 ,  H01L25/03 ,  H01L25/0753 ,  H01L25/50 ,  H01L33/0095 ,  H01L33/62 ,  H01L2924/01322 ,  H01L2924/10158 ,  H01L2933/0066 ,  H01L2924/00

摘要： A manufacturing method includes: attaching a film onto a bonding surface of a wafer; performing laser cutting on the wafer to obtain a plurality of semiconductor light-emitting eutectic chips; attaching light-emitting surfaces of the plurality of eutectic chips on to an expansion film; detaching films from bonding surfaces of the plurality of eutectic chips; performing wafer expansion on the expansion film so that the plurality of eutectic chips have the same intervals as chip loading spaces on a substrate; attaching the expansion film onto a tray, and moving the tray so that positions of the plurality of eutectic chips correspond to that of the chip loading spaces; moving the tray so that the plurality of eutectic chips approach the chip loading spaces on the substrate; and embedding the plurality of eutectic chips into the chip loading spaces so that the plurality of eutectic chips are electrically connected to the substrate.

摘要翻译： 一种制造方法包括：将膜附着到晶片的接合表面上; 在晶片上进行激光切割以获得多个半导体发光共晶芯片; 将多个共晶芯片的发光面附着在膨胀膜上; 从所述多个共晶芯片的接合表面分离膜; 在膨胀膜上进行晶片膨胀，使得多个共晶芯片具有与基板上的芯片加载空间相同的间隔; 将所述膨胀膜附接到托盘上，并且移动所述托盘，使得所述多个共晶芯片的位置对应于所述芯片加载空间的位置; 移动托盘使得多个共晶芯片接近基板上的芯片加载空间; 以及将所述多个共晶芯片嵌入所述芯片装载空间中，使得所述多个共晶芯片电连接到所述基板。