公开(公告)号：US09698302B2

公开(公告)日：2017-07-04

申请号：US15028228

申请日：2015-12-02

申请人： Min Yan ,  Jun Cheng ,  Mingbo Zhou

发明人： Min Yan ,  Jun Cheng ,  Mingbo Zhou

IPC分类号： H01L29/18 ,  H01L21/66 ,  H01L33/20 ,  H01L33/62 ,  H01L21/329 ,  H01L29/45 ,  H01L33/00

CPC分类号： H01L33/007 ,  H01L22/14 ,  H01L25/0753 ,  H01L33/005

摘要： A method for manufacturing on a compound glass substrate a multi-colored LED for use in a video display board includes preparing a first masking layer on a compound glass substrate; depositing a first-color epitaxial layer on the first-color LED growing region and the first masking layer, to form a first-color LED; removing the first masking layer and the first-color epitaxial layer on the first masking layer; preparing a second masking layer, wherein the second masking layer is used to mask another region except a second-color LED growing region; depositing a second-color epitaxial layer on the second-color LED growing region and the second masking layer, to form a second-color LED; removing the second masking layer and the second-color epitaxial layer on the second masking layer; and grinding, cleaning, and performing an electrical test on a surface of the compound glass substrate.

公开(公告)号：US09633972B2

公开(公告)日：2017-04-25

申请号：US14903934

申请日：2014-05-06

申请人： Jun Cheng ,  Min Yan ,  Mingbo Zhou

发明人： Jun Cheng ,  Min Yan ,  Mingbo Zhou

IPC分类号： H01L25/04 ,  H01L21/50 ,  H01L21/66 ,  H01L25/03 ,  H01L25/075 ,  H01L33/00 ,  H01L23/00 ,  H01L33/62 ,  H01L25/00

CPC分类号： H01L25/042 ,  H01L21/50 ,  H01L22/12 ,  H01L22/14 ,  H01L22/22 ,  H01L24/95 ,  H01L25/03 ,  H01L25/0753 ,  H01L25/50 ,  H01L33/0095 ,  H01L33/62 ,  H01L2924/01322 ,  H01L2924/10158 ,  H01L2933/0066 ,  H01L2924/00

摘要： A manufacturing method includes: attaching a film onto a bonding surface of a wafer; performing laser cutting on the wafer to obtain a plurality of semiconductor light-emitting eutectic chips; attaching light-emitting surfaces of the plurality of eutectic chips on to an expansion film; detaching films from bonding surfaces of the plurality of eutectic chips; performing wafer expansion on the expansion film so that the plurality of eutectic chips have the same intervals as chip loading spaces on a substrate; attaching the expansion film onto a tray, and moving the tray so that positions of the plurality of eutectic chips correspond to that of the chip loading spaces; moving the tray so that the plurality of eutectic chips approach the chip loading spaces on the substrate; and embedding the plurality of eutectic chips into the chip loading spaces so that the plurality of eutectic chips are electrically connected to the substrate.