公开(公告)号：US20050161806A1

公开(公告)日：2005-07-28

申请号：US10763795

申请日：2004-01-22

申请人： Mysore Divakar ,  Thomas Templeton

发明人： Mysore Divakar ,  Thomas Templeton

IPC分类号： H01L23/10 ,  H01L23/28 ,  H01L23/31 ,  H01L23/34 ,  H01L23/36 ,  H01L23/373 ,  H01L23/495

CPC分类号： H01L23/3737 ,  H01L23/3107 ,  H01L23/36 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device has a semiconductor die (12) mounted to a leadframe (25). The semiconductor die is a power semiconductor device. A thermally conductive overmolding compound (22) is formed over the semiconductor die. The overmolding compound is made with a thermally conductive epoxy that conducts heat in the range of 2-5 watts/meter K. A pin-fin heat sink (24) is mounted to a top surface of the thermally conductive overmolding compound. The heat sink has a solid base (28) with a plurality of pin-fins (30) extending from the base. Scour lines (40) are cut in the base between the pin-fins. The heat generated by the semiconductor die is dissipated through the thermally conductive overmolding compound to the pin-fin heat sink.

摘要翻译： 半导体器件具有安装到引线框架（25）的半导体管芯（12）。 半导体管芯是功率半导体器件。 在半导体管芯上方形成导热性包覆成型化合物（22）。 包覆成型化合物由导热环氧树脂制成，其传导2-5瓦/米K范围内的热量。针状散热片（24）安装在导热二次成型化合物的顶表面上。 散热器具有固体基部（28），其具有从基部延伸的多个销翅片（30）。 擦拭线（40）在针脚之间的底部被切割。 由半导体管芯产生的热量通过导热包覆成型化合物散发到针鳍散热片。

公开(公告)号：US20050052849A1

公开(公告)日：2005-03-10

申请号：US10715907

申请日：2003-11-18

申请人： David Keating ,  Antoin Russell ,  Mysore Divakar ,  Thomas Templeton ,  John Maxwell

发明人： David Keating ,  Antoin Russell ,  Mysore Divakar ,  Thomas Templeton ,  John Maxwell

IPC分类号： H01R20060101 ,  H01R43/02 ,  H05K7/20

CPC分类号： H01R12/52 ,  H01R12/57 ,  H01R12/7064 ,  H01R43/0263

摘要： The invention provides arrangements to facilitate surface mounting of subassembly boards on a motherboard with reliable, high conductivity interconnection. In accordance with the invention, the subassembly interconnection arrangement is composed of separate power and sense connector arms formed on one or more base headers. The arrangement interconnects and supports the subassembly board on the motherboard surface. Each power arm advantageously comprises a plurality of split-based mounting lugs secured to the arm in a coplanar configuration. Each sense connector arm preferably comprises a plurality of connector pins secured to the arm in a coplanar configuration. Embodiments are disclosed for vertical and horizontal surface mounting.

摘要翻译： 本发明提供了便于在具有可靠的高导电性互连的母板上表面安装子组件板的布置。 根据本发明，子组件互连装置由形成在一个或多个底部集管上的分开的功率和感测连接臂构成。 该布置将主组件板上的子组件板互连并支撑。 每个动力臂有利地包括以共面构造固定到臂的多个基于分组的安装凸耳。 每个感测连接器臂优选地包括以共面构造固定到臂的多个连接器销。 公开了用于垂直和水平表面安装的实施例。