公开(公告)号：US20130032947A1

公开(公告)日：2013-02-07

申请号：US13482415

申请日：2012-05-29

申请人： Sang-sick Park ,  Tae-je Cho ,  Sang-wook Park ,  Teak-hoon Lee ,  Kwang-chul Choi ,  Myung-sung Kang

发明人： Sang-sick Park ,  Tae-je Cho ,  Sang-wook Park ,  Teak-hoon Lee ,  Kwang-chul Choi ,  Myung-sung Kang

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3135 ,  H01L23/544 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552

摘要： A semiconductor package that stably protects an internal semiconductor chip from external shocks, and a method of manufacturing the semiconductor package is disclosed. The semiconductor package includes a first semiconductor chip including a first body layer having a first surface, a second surface, and a lateral surface between the first surface and the second surface, and a first protective layer that exposes an edge portion of the first surface and forms a step difference with the first surface; an encapsulation structure that covers a lateral surface of the first body layer and the edge portion of the first surface so as to encapsulate the first semiconductor chip to have a locking structure; and a first conductive terminal formed on the first body layer through the protective layer.

摘要翻译： 公开了一种稳定地保护内部半导体芯片免受外部冲击的半导体封装以及半导体封装的制造方法。 该半导体封装包括第一半导体芯片，该第一半导体芯片包括具有第一表面，第二表面和第一表面与第二表面之间的侧表面的第一本体层，以及暴露第一表面的边缘部分的第一保护层和 与第一表面形成阶梯差; 封装结构，其覆盖第一主体层的侧面和第一表面的边缘部分，以便将第一半导体芯片封装成具有锁定结构; 以及通过保护层形成在第一主体层上的第一导电端子。

公开(公告)号：US07807507B2

公开(公告)日：2010-10-05

申请号：US12476601

申请日：2009-06-02

申请人： Won-Keun Kim ,  Myung-Kee Chung ,  Myung-Sung Kang

发明人： Won-Keun Kim ,  Myung-Kee Chung ,  Myung-Sung Kang

IPC分类号： H01L21/78

CPC分类号： H01L21/563 ,  H01L21/6836 ,  H01L25/0657 ,  H01L2221/68381 ,  H01L2224/73203 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/01078

摘要： A semiconductor package forming method includes mounting a backgrinding-underfill film which includes a laminated backgrinding film and a laminated underfill film on a semiconductor wafer so that the underfill film adheres to a front side of the semiconductor wafer; backgrinding a back side of the semiconductor wafer on which the backgrinding-underfill film has been mounted and removing the backgrinding film of the backgrinding-underfill film from the semiconductor wafer. The method further includes dicing the semiconductor wafer from which the backgrinding film has been removed, so that semiconductor chips are separated from the semiconductor wafer.

摘要翻译： 半导体封装形成方法包括在半导体晶片上安装包括层压背面研磨膜和层叠底部填充膜的背面研磨底部填充膜，使得底部填充膜粘附到半导体晶片的正面; 背面研磨已经安装了背面研磨底部填充膜的半导体晶片的背面，并从半导体晶片去除背面研磨底部填充膜的背面研磨膜。 该方法还包括对已经去除背面研磨膜的半导体晶片进行切割，使得半导体芯片与半导体晶片分离。

公开(公告)号：US20100047969A1

公开(公告)日：2010-02-25

申请号：US12476601

申请日：2009-06-02

申请人： WON-KEUN KIM ,  MYUNG-KEE CHUNG ,  MYUNG-SUNG KANG

发明人： WON-KEUN KIM ,  MYUNG-KEE CHUNG ,  MYUNG-SUNG KANG

IPC分类号： H01L21/78

CPC分类号： H01L21/563 ,  H01L21/6836 ,  H01L25/0657 ,  H01L2221/68381 ,  H01L2224/73203 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/01078

摘要： A semiconductor package forming method includes mounting a backgrinding-underfill film which includes a laminated backgrinding film and a laminated underfill film on a semiconductor wafer so that the underfill film adheres to a front side of the semiconductor wafer; backgrinding a back side of the semiconductor wafer on which the backgrinding-underfill film has been mounted and removing the backgrinding film of the backgrinding-underfill film from the semiconductor wafer. The method further includes dicing the semiconductor wafer from which the backgrinding film has been removed, so that semiconductor chips are separated from the semiconductor wafer.

摘要翻译： 半导体封装形成方法包括在半导体晶片上安装包括层压背面研磨膜和层叠底部填充膜的背面研磨底部填充膜，使得底部填充膜粘附到半导体晶片的正面; 背面研磨已经安装了背面研磨底部填充膜的半导体晶片的背面，并从半导体晶片去除背面研磨底部填充膜的背面研磨膜。 该方法还包括对已经去除背面研磨膜的半导体晶片进行切割，使得半导体芯片与半导体晶片分离。