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11 条记录 (耗时 0.019 秒)

    Semiconductor device having bipolar transistors
    1.
    发明授权
    Semiconductor device having bipolar transistors 失效
    具有双极晶体管的半导体器件

    公开(公告)号：US06768183B2

    公开(公告)日：2004-07-27

    申请号：US10125582

    申请日：2002-04-19

    申请人： Shigeki Takahashi ,  Satoshi Shiraki ,  Hiroaki Himi ,  Hiroyuki Ban ,  Osamu Seya

    发明人： Shigeki Takahashi ,  Satoshi Shiraki ,  Hiroaki Himi ,  Hiroyuki Ban ,  Osamu Seya

    IPC分类号： H01L2900

    CPC分类号： H01L27/0826 ,  H01L27/0623

    摘要： An NPN bipolar transistor and a PNP bipolar transistor are formed in a semiconductor substrate. The NPN bipolar transistor has a p type emitter region, a p type collector region and an n type base region and is formed in an NPN forming region. The PNP bipolar transistor has an n type emitter region, an n type collector region and a p type base region and is formed in a PNP forming region. Only one conductive type burying region is formed in at least one of the NPN forming region and the PNP forming region. A current that flows from the p type emitter region to the n type base region flows in the n type base region in a direction perpendicular to the substrate.

    摘要翻译： 在半导体衬底中形成NPN双极晶体管和PNP双极晶体管。 NPN双极晶体管具有p型发射极区域，p型集电极区域和n型基极区域，并且形成在NPN形成区域中。 PNP双极晶体管具有n型发射极区域，n型集电极区域和p型基极区域，并且形成在PNP形成区域中。 在NPN形成区域和PNP形成区域的至少一个中仅形成一个导电型掩埋区域。 从p型发射极区域流向n型基极区域的电流在与基板垂直的方向上流入n型基极区域。

    Process for forming an ultrafine copper alloy wire
    3.
    发明授权
    Process for forming an ultrafine copper alloy wire 有权
    用于形成超细铜合金线的工艺

    公开(公告)号：US06751855B2

    公开(公告)日：2004-06-22

    申请号：US10309046

    申请日：2002-12-04

    申请人： Hakaru Matsui ,  Takaaki Ichikawa ,  Koichi Tamura ,  Seigi Aoyama ,  Osamu Seya ,  Ryohei Okada

    发明人： Hakaru Matsui ,  Takaaki Ichikawa ,  Koichi Tamura ,  Seigi Aoyama ,  Osamu Seya ,  Ryohei Okada

    IPC分类号： H01R4300

    CPC分类号： H01B1/026 ,  Y10T29/49117 ,  Y10T29/5187

    摘要： A process for forming an ultrafine copper alloy wire is provided. The alloy includes a copper matrix of high purity copper having a total unavoidable impurity content of not more than 10 mass ppm. The matrix contains 0.05 to 0.9 mass % of at least one metallic element of the group of tin, indium, silver, antimony, magnesium, aluminum, and boron. The alloy is melted in a carbon crucible. The molten alloy is cast into a wire rod utilizing a carbon mold. The wire rod is then subjected to a primary wire drawing, an annealing, and a secondary wire drawing. The produced ultrafine copper alloy wire has excellent tensile strength, electrical conductivity, and drawability.

    摘要翻译： 提供一种形成超细铜合金线的工艺。 该合金包括总不可避免的杂质含量不大于10质量ppm的高纯度铜的铜基质。 该基质含有0.05〜0.9质量％的锡，铟，银，锑，镁，铝和硼组中的至少一种金属元素。 合金在碳坩埚中熔化。 将熔融的合金用碳素模铸成线材。 然后对线材进行一次拉丝，退火和二次拉丝。 所生产的超细铜合金线材具有优异的拉伸强度，导电性和拉伸性。

    Ultrafine copper alloy wire and process for producing the same
    7.
    发明授权
    Ultrafine copper alloy wire and process for producing the same 有权
    超细铜合金线及其制造方法

    公开(公告)号：US06518505B1

    公开(公告)日：2003-02-11

    申请号：US09714668

    申请日：2000-11-17

    申请人： Hakaru Matsui ,  Takaaki Ichikawa ,  Koichi Tamura ,  Seigi Aoyama ,  Osamu Seya ,  Ryohei Okada

    发明人： Hakaru Matsui ,  Takaaki Ichikawa ,  Koichi Tamura ,  Seigi Aoyama ,  Osamu Seya ,  Ryohei Okada

    IPC分类号： H01B102

    CPC分类号： H01B1/026 ,  Y10T29/49117 ,  Y10T29/5187

    摘要： An ultrafine copper alloy wire drawn to a diameter of not more than 0.08 mm is provided which is formed of an alloy having a copper matrix of high purity copper with a total unavoidable impurity content of not more than 10 mass ppm. Contained in the matrix is 0.05 to 0.9 mass % of at least one metallic element selected from the group including tin, indium, silver, antimony, magnesium, aluminum, and boron. By virtue of this constitution, the ultrafine copper alloy wire has excellent tensile strength, electrical conductivity, and drawability.

    摘要翻译： 提供了一种直径不大于0.08mm的超细铜合金线，其由具有不大于10质量ppm的总不可避免的杂质含量的具有高纯度铜的铜基质的合金形成。 在基质中含有0.05〜0.9质量％的选自锡，铟，银，锑，镁，铝和硼的至少一种金属元素。 根据该结构，超细铜合金线材具有优异的拉伸强度，导电性和拉伸性。

    Method of manufacturing porous ultraviolet curable resin coated wire, porous ultraviolet curable resin coated wire and coaxial cable
    8.
    发明申请
    Method of manufacturing porous ultraviolet curable resin coated wire, porous ultraviolet curable resin coated wire and coaxial cable 审中-公开
    制造多孔紫外线固化树脂涂层线，多孔紫外线固化树脂涂层线和同轴电缆的方法

    公开(公告)号：US20120090865A1

    公开(公告)日：2012-04-19

    申请号：US13067089

    申请日：2011-05-06

    申请人： Yoshihisa Kato ,  Osamu Seya ,  Detian Huang

    发明人： Yoshihisa Kato ,  Osamu Seya ,  Detian Huang

    IPC分类号： H01B11/06 ,  B05D5/12 ,  B32B3/26

    CPC分类号： H01B3/56 ,  B05D3/067 ,  B05D7/542 ,  B05D2256/00 ,  B32B1/08 ,  B32B15/04 ,  B32B2597/00 ,  H01B3/308 ,  H01B3/447 ,  H01B7/0233 ,  Y10T428/249953

    摘要： A method of manufacturing a porous ultraviolet curable resin coated wire includes (a) preparing an ultraviolet curable resin composition not including a hydrous water absorbent polymer, (b) preparing a hydrous water absorbent polymer-dispersed ultraviolet curable resin composition having a water content of 40% or more by preparing a water-swollen hydrous water absorbent polymer including a water absorbent polymer and water, and then dispersing the hydrous water absorbent polymer into the ultraviolet curable resin composition, (c) forming a two-layer structure on a metal wire by coating the metal wire with the ultraviolet curable resin composition not including the hydrous water absorbent polymer and the hydrous water absorbent polymer, and (d) performing a dehydration on the two-layer structure.

    摘要翻译： 制造多孔紫外线固化型树脂涂布线的方法包括（a）制备不含水合吸水性聚合物的紫外线固化型树脂组合物，（b）制备水含量为40的含水吸水性聚合物分散型紫外线固化型树脂组合物 通过制备包含吸水性聚合物和水的水溶胀含水吸水性聚合物，然后将含水吸水性聚合物分散在紫外线固化性树脂组合物中，（c）在金属丝上形成双层结构，通过 用不含有含水吸水性聚合物和含水吸水性聚合物的紫外线固化树脂组合物涂覆金属线，（d）在双层结构上进行脱水。

    Composite conductor, production method thereof and cable using the same
    10.
    发明授权
    Composite conductor, production method thereof and cable using the same 有权
    复合导体及其制造方法及使用其的电缆

    公开(公告)号：US06649843B2

    公开(公告)日：2003-11-18

    申请号：US09834724

    申请日：2001-04-16

    申请人： Seigi Aoyama ,  Koichi Tamura ,  Takaaki Ichikawa ,  Hakaru Matsui ,  Osamu Seya ,  Fumitaka Nakahigashi

    发明人： Seigi Aoyama ,  Koichi Tamura ,  Takaaki Ichikawa ,  Hakaru Matsui ,  Osamu Seya ,  Fumitaka Nakahigashi

    IPC分类号： H01B500

    CPC分类号： H01B1/026

    摘要： This invention provides a composite conductor having excellent strength, flexing resistance and corrosion resistance, a production method thereof and a cable employing the same composite conductor. A corrosion resistant layer is formed of Au, Ag, Sn, Ni, solder, Zn, Pd, Sn—Ni alloy, Ni—Co alloy, Ni—P alloy, Ni—Co—P alloy, Cu—Zn alloy, Sn—Bi alloy, Sn—Ag—cu alloy, Sn—Cu alloy or Sn—Zn alloy in the thickness of 0.5 &mgr;m or more on an external periphery of a core made of copper-metal fiber conductor. A wire material made of the copper-metal fiber conductor is subjected to area reduction processing. In the middle of the area reduction processing or after the area reduction processing is completed, corrosion resistant layer is formed on the periphery of the wire material in the thickness of 0.5 &mgr;m or more by plating with Au, Ag, Sn, Ni, solder, Zn, Pd, Sn—Ni alloy, Ni—Co alloy, Ni—P alloy, Ni—Co—P alloy, Cu—Zn alloy, Sn—Bi alloy, Sn—Ag—Cu alloy, Sn—Cu alloy or Sn—Zn alloy.

    摘要翻译： 本发明提供了具有优异的强度，抗弯曲性和耐腐蚀性的复合导体，其制造方法和使用该复合导体的电缆。 耐腐蚀层由Au，Ag，Sn，Ni，焊料，Zn，Pd，Sn-Ni合金，Ni-Co合金，Ni-P合金，Ni-Co-P合金，Cu-Zn合金，Sn- Bi合金，Sn-Ag-Cu合金，Sn-Cu合金或Sn-Zn合金，在由铜 - 金属纤维导体制成的芯的外周上为0.5μm或更大。 由铜金属纤维导体制成的线材进行面积缩小处理。 在区域缩小处理的中间或者在减小区域处理完成之后，通过用Au，Ag，Sn，Ni，焊料进行电镀，在线材周围形成0.5μm以上的耐腐蚀层， Zn，Pd，Sn-Ni合金，Ni-Co合金，Ni-P合金，Ni-Co-P合金，Cu-Zn合金，Sn-Bi合金，Sn-Ag-Cu合金，Sn-Cu合金或Sn- 锌合金。