公开(公告)号：US20070187134A1

公开(公告)日：2007-08-16

申请号：US11641934

申请日：2006-12-19

申请人： Huang Detian ,  Hiromitsu Kuroda ,  Hakaru Matsui ,  Osamu Seya ,  Ryohei Okada ,  Shinichi Masui ,  Ryuji Nakagawa ,  Hiroshi Okikawa

发明人： Huang Detian ,  Hiromitsu Kuroda ,  Hakaru Matsui ,  Osamu Seya ,  Ryohei Okada ,  Shinichi Masui ,  Ryuji Nakagawa ,  Hiroshi Okikawa

IPC分类号： C22F1/08 ,  H01B5/00

CPC分类号： H01B5/08 ,  C22F1/08 ,  H01B11/20

摘要： An extra-fine copper alloy wire has: a wire diameter of 0.010 to 0.025 mm; 1 to 3 weight % of silver (Ag), and a balance consisting copper (Co) and an inevitable impurity; a tensile strength of not less than 850 MPa; an electrical conductivity of not less than 85% IACS; an elongation of 0.5 to 3.0%; and a lowering rate in tensile strength of not more than 2%. The lowering rate is represented by [(1−σh1/σh0)×100%] where σh1 is a tensile strength of the wire measured after a heat treatment under conditions of a heating temperature of not more than 350° C. and a heating time of not more than 5 seconds, and σh0 is a tensile strength of the wire measured before the heat treatment.

摘要翻译： 超细铜合金线具有：线径0.010至0.025mm; 1〜3重量％的银（Ag），余量由铜（Co）和不可避免的杂质构成; 拉伸强度不低于850MPa; 电导率不低于85％IACS; 伸长率为0.5〜3.0％; 拉伸强度的降低率不大于2％。 降低速率由[（1-sigma＆lt; h1 / sigma＆lt; h0＆gt;）×100％]表示，其中σσ是导线的拉伸强度 在加热温度不高于350℃，加热时间不超过5秒的条件下进行热处理之后测量，σσ是在 热处理。

公开(公告)号：US20090223713A1

公开(公告)日：2009-09-10

申请号：US12420576

申请日：2009-04-08

申请人： Huang Detian ,  Hiromitsu Kuroda ,  Hakaru Matsui ,  Osamu Seya ,  Ryohei Okada ,  Shinichi Masui ,  Ryuji Nakagawa ,  Hiroshi Okikawa

发明人： Huang Detian ,  Hiromitsu Kuroda ,  Hakaru Matsui ,  Osamu Seya ,  Ryohei Okada ,  Shinichi Masui ,  Ryuji Nakagawa ,  Hiroshi Okikawa

IPC分类号： H01B11/18 ,  H01B11/02 ,  H01B7/00

CPC分类号： H01B5/08 ,  C22F1/08 ,  H01B11/20

摘要： An extra-fine copper alloy twisted wire comprising a plurality of copper alloy wires with a wire diameter of 0.010 to 0.025 mm twisted together, each of the copper alloy wires comprising 1 to 3 weight % of silver (Ag) and a balance consisting of a copper and an inevitable impurity, the copper alloy twisted wire further comprising a tensile strength of not less than 850 MPa, and an electrical conductivity of not less than 85% IACS. The extra-fine copper alloy twisted wire comprises a solid insulation with a thickness of not more than 0.07 mm formed on an outer circumference of the extra-fine insulated wire.

摘要翻译： 一种超细铜合金绞线，其包括多个铜线合金线，其中​​丝线直径为0.010至0.025mm，绞合在一起，每个铜合金线包含1至3重量％的银（Ag），余量由 铜和不可避免的杂质，铜合金绞线进一步包含抗拉强度不低于850MPa，电导率不低于85％IACS。 超细铜合金绞线包括在超细绝缘电线的外周形成的厚度不大于0.07mm的固体绝缘体。

公开(公告)号：US08143517B2

公开(公告)日：2012-03-27

申请号：US12420576

申请日：2009-04-08

申请人： Huang Detian ,  Hiromitsu Kuroda ,  Hakaru Matsui ,  Osamu Seya ,  Ryohei Okada ,  Shinichi Masui ,  Ryuji Nakagawa ,  Hiroshi Okikawa

发明人： Huang Detian ,  Hiromitsu Kuroda ,  Hakaru Matsui ,  Osamu Seya ,  Ryohei Okada ,  Shinichi Masui ,  Ryuji Nakagawa ,  Hiroshi Okikawa

IPC分类号： H01B7/00

CPC分类号： H01B5/08 ,  C22F1/08 ,  H01B11/20

摘要： An extra-fine copper alloy twisted wire including a plurality of copper alloy wires with a wire diameter of 0.010 to 0.025 mm twisted together, each of the copper alloy wires including 1 to 3 weight % of silver (Ag) and a balance consisting of a copper and an inevitable impurity, the copper alloy twisted wire further including a tensile strength of not less than 850 MPa, and an electrical conductivity of not less than 85% IACS. The extra-fine copper alloy twisted wire includes a solid insulation with a thickness of not more than 0.07 mm formed on an outer circumference of the extra-fine insulated wire.

摘要翻译： 一种超细铜合金绞线，其包括线直径为0.010〜0.025mm的多根铜合金线绞合在一起，每根铜合金线包括1〜3重量％的银（Ag），余量由 铜和不可避免的杂质，铜合金绞线进一步包括抗拉强度不低于850MPa，电导率不低于85％IACS。 超细铜合金绞线包括在超细绝缘电线的外周形成的厚度不大于0.07mm的固体绝缘体。

公开(公告)号：US07544886B2

公开(公告)日：2009-06-09

申请号：US11641934

申请日：2006-12-19

申请人： Huang Detian ,  Hiromitsu Kuroda ,  Hakaru Matsui ,  Osamu Seya ,  Ryohei Okada ,  Shinichi Masui ,  Ryuji Nakagawa ,  Hiroshi Okikawa

发明人： Huang Detian ,  Hiromitsu Kuroda ,  Hakaru Matsui ,  Osamu Seya ,  Ryohei Okada ,  Shinichi Masui ,  Ryuji Nakagawa ,  Hiroshi Okikawa

IPC分类号： H01B11/06

CPC分类号： H01B5/08 ,  C22F1/08 ,  H01B11/20

摘要： An extra-fine copper alloy wire has: a wire diameter of 0.010 to 0.025 mm; 1 to 3 weight % of silver (Ag), and a balance consisting copper (Co) and an inevitable impurity; a tensile strength of not less than 850 MPa; an electrical conductivity of not less than 85% IACS; an elongation of 0.5 to 3.0%; and a lowering rate in tensile strength of not more than 2%. The lowering rate is represented by [(1−σh1/σh0)×100%] where σh1 is a tensile strength of the wire measured after a heat treatment under conditions of a heating temperature of not more than 350° C. and a heating time of not more than 5 seconds, and σh0 is a tensile strength of the wire measured before the heat treatment.

摘要翻译： 超细铜合金线具有：线径0.010至0.025mm; 1〜3重量％的银（Ag），余量由铜（Co）和不可避免的杂质构成; 拉伸强度不低于850MPa; 电导率不低于85％IACS; 伸长率为0.5〜3.0％; 拉伸强度的降低率不大于2％。 降低率由[（1-sigmah1 / sigmah0）×100％]表示，其中sigmah1是在加热温度不高于350℃的条件下在热处理后测量的线的拉伸强度，加热时间 不超过5秒，sigmah0是在热处理之前测量的线的拉伸强度。

公开(公告)号：US20130042949A1

公开(公告)日：2013-02-21

申请号：US13571781

申请日：2012-08-10

申请人： Hideyuki Sagawa ,  Seigi Aoyama ,  Hiromitsu Kuroda ,  Toru Sumi ,  Keisuke Fujito ,  Ryohei Okada ,  Shinichi Masui

发明人： Hideyuki Sagawa ,  Seigi Aoyama ,  Hiromitsu Kuroda ,  Toru Sumi ,  Keisuke Fujito ,  Ryohei Okada ,  Shinichi Masui

IPC分类号： C22F1/08 ,  B21D31/00

CPC分类号： C22F1/08 ,  B21C1/003 ,  C22C9/00 ,  H01B1/026 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45611 ,  H01L2224/45618 ,  H01L2224/45639 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/01022 ,  H01L2924/01012 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01025 ,  H01L2924/01024 ,  H01L2924/01016 ,  H01L2924/01008 ,  H01L2924/01205

摘要： A method of manufacturing a soft-dilute-copper-alloy material includes a plastic working of a soft-dilute-copper-alloy including an additional element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn and Cr, and a balance consisting of copper and inevitable impurity, and a subsequent annealing treatment of the soft-dilute-copper-alloy. A working ratio in the plastic working before the annealing treatment is not less than 50%.

摘要翻译： 软 - 稀铜合金材料的制造方法包括：软 - 稀铜合金的塑性加工，其包含选自Ti，Mg，Zr，Nb，Ca，V，Ni， Mn和Cr，余量由铜和不可避免的杂质组成，以及随后的软 - 稀铜铜合金的退火处理。 退火处理前塑料加工的加工率不小于50％。

公开(公告)号：US07737370B2

公开(公告)日：2010-06-15

申请号：US11882089

申请日：2007-07-30

申请人： Seigi Aoyama ,  Toshiyuki Horikoshi ,  Hiromitsu Kuroda ,  Yuzo Ito ,  Hiroshi Komuro ,  Hiroshi Okikawa

发明人： Seigi Aoyama ,  Toshiyuki Horikoshi ,  Hiromitsu Kuroda ,  Yuzo Ito ,  Hiroshi Komuro ,  Hiroshi Okikawa

IPC分类号： H05K9/00

CPC分类号： H05K9/0096

摘要： An electromagnetic shielding filter has two transparent boards and a conductive mesh with plural wires, where the conductive mesh is sandwiched between the two transparent boards. The plural wires are formed of a Cu—Sn—In alloy or a Cu—Ag alloy.

摘要翻译： 电磁屏蔽过滤器具有两个透明板和具有多个导线的导电网，其中导电网被夹在两个透明板之间。 多根金属线由Cu-Sn-In合金或Cu-Ag合金形成。

公开(公告)号：US09279176B2

公开(公告)日：2016-03-08

申请号：US12998727

申请日：2009-11-20

申请人： Hajime Nishi ,  Yuju Endo ,  Ken Takahashi ,  Hiromitsu Kuroda ,  Hiroyuki Akutsu ,  Katsunori Sawahata ,  Hiroshi Bando ,  Iku Higashidani ,  Hiroshi Okikawa

发明人： Hajime Nishi ,  Yuju Endo ,  Ken Takahashi ,  Hiromitsu Kuroda ,  Hiroyuki Akutsu ,  Katsunori Sawahata ,  Hiroshi Bando ,  Iku Higashidani ,  Hiroshi Okikawa

IPC分类号： H01B5/00 ,  C23C2/08 ,  C23C2/02 ,  C23C6/00 ,  C23C26/02 ,  H01L31/05 ,  C23C28/00

CPC分类号： H01L31/02013 ,  C23C2/02 ,  C23C2/08 ,  C23C6/00 ,  C23C26/02 ,  C23C28/321 ,  C23C28/322 ,  C23C28/345 ,  H01L31/0508 ,  H01L31/0512 ,  Y02E10/50

摘要： A solar cell lead wire includes a molten solder plated layer on a strip-shaped conductive material formed rectangular in a cross section thereof so as to be bonded by soldering to an electrode of a solar cell, using a flux. A thickness of an oxide film on a surface of the molten solder plated layer, which is a sum of a thickness of an SnO layer and a thickness of an SnO2 layer on the surface of the molten solder plated layer, is not more than 7 nm.

摘要翻译： 太阳能电池引线包括在其横截面上形成为矩形的条形导电材料上的熔融焊料镀层，以便通过使用焊剂将其焊接到太阳能电池的电极上。 在熔融焊料镀层的表面上的氧化膜的厚度为SnO层的厚度与熔融焊料镀层的表面上的SnO 2层的厚度之和的总和为7nm以下 。

公开(公告)号：US20100218981A1

公开(公告)日：2010-09-02

申请号：US12659172

申请日：2010-02-26

申请人： Hajime Nishi ,  Ken Takahashi ,  Hiromitsu Kuroda ,  Hiroshi Okikawa ,  Kuniaki Kimoto ,  Hiroyuki Akutsu ,  Yukio Ito ,  Iku Higashidani

发明人： Hajime Nishi ,  Ken Takahashi ,  Hiromitsu Kuroda ,  Hiroshi Okikawa ,  Kuniaki Kimoto ,  Hiroyuki Akutsu ,  Yukio Ito ,  Iku Higashidani

IPC分类号： H05K1/09 ,  B21B45/00

CPC分类号： H01L31/0508 ,  H01L2924/0002 ,  Y02E10/50 ,  H01L2924/00

摘要： A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120° C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness.

摘要翻译： 太阳能电池引线包括其表面涂覆有焊料电镀的带状导电材料。 涂覆的焊料镀层在其表面上包括凹凸部分，通过拉伸试验包括不大于90MPa的0.2％屈服应力。 涂覆的焊料镀层包括通过在带状导电材料的表面上提供熔融焊料而形成的热浸焊料镀层。 将电镀温度设定为不高于所使用焊料的液相线温度加上120℃，并且将热浸焊料镀层的表面上的氧化膜设定为不大于7nm 厚度。

公开(公告)号：US08653380B2

公开(公告)日：2014-02-18

申请号：US12659172

申请日：2010-02-26

申请人： Hajime Nishi ,  Ken Takahashi ,  Hiromitsu Kuroda ,  Hiroshi Okikawa ,  Kuniaki Kimoto ,  Hiroyuki Akutsu ,  Yukio Ito ,  Iku Higashidani

发明人： Hajime Nishi ,  Ken Takahashi ,  Hiromitsu Kuroda ,  Hiroshi Okikawa ,  Kuniaki Kimoto ,  Hiroyuki Akutsu ,  Yukio Ito ,  Iku Higashidani

IPC分类号： H05K1/16

CPC分类号： H01L31/0508 ,  H01L2924/0002 ,  Y02E10/50 ,  H01L2924/00

摘要： A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120° C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness.

摘要翻译： 太阳能电池引线包括其表面涂覆有焊料电镀的带状导电材料。 涂覆的焊料镀层在其表面上包括凹凸部分，通过拉伸试验包括不大于90MPa的0.2％屈服应力。 涂覆的焊料镀层包括通过在带状导电材料的表面上提供熔融焊料而形成的热浸焊料镀层。 将电镀温度设定为不高于所使用焊料的液相线温度加上120℃，并且将热浸焊料镀层的表面上的氧化膜设定为不大于7nm 厚度。

公开(公告)号：US20110220196A1

公开(公告)日：2011-09-15

申请号：US12998727

申请日：2009-11-20

申请人： Hajime Nishi ,  Yuju Endo ,  Ken Takahashi ,  Hiromitsu Kuroda ,  Hiroyuki Akutsu ,  Katsunori Sawahata ,  Hiroshi Bando ,  Iku Higashidani ,  Hiroshi Okikawa

发明人： Hajime Nishi ,  Yuju Endo ,  Ken Takahashi ,  Hiromitsu Kuroda ,  Hiroyuki Akutsu ,  Katsunori Sawahata ,  Hiroshi Bando ,  Iku Higashidani ,  Hiroshi Okikawa

IPC分类号： H01L31/05 ,  H01B5/00 ,  B21C23/24 ,  B65B1/04

CPC分类号： H01L31/02013 ,  C23C2/02 ,  C23C2/08 ,  C23C6/00 ,  C23C26/02 ,  C23C28/321 ,  C23C28/322 ,  C23C28/345 ,  H01L31/0508 ,  H01L31/0512 ,  Y02E10/50

摘要： Disclosed is a lead wire for a solar cell having excellent bondability with a solar cell. The solar cell lead wire (10) has a band plate-shaped electroconductive material (12) that is formed with straight-angled cross-sectional shape and is covered by a molten solder plating layer (13), with the thickness of the oxide film on the surface of the molten solder plating layer (13) being 7 nm or less.

摘要翻译： 公开了一种与太阳能电池具有优异的粘合性的太阳能电池用引线。 太阳能电池引线（10）具有带状导电材料（12），其形成为直角截面形状并被熔融焊料镀层（13）覆盖，氧化膜的厚度 在熔融焊料镀层（13）的表面上为7nm以下。