Coating method and coated article obtained by the same

    公开(公告)号:US09943878B2

    公开(公告)日:2018-04-17

    申请号:US15106351

    申请日:2014-12-12

    IPC分类号: B05D3/02 B05D7/00 B05D1/36

    摘要: A coating method for forming a laminated coating film including a lower layer formed on a base material and an upper layer formed on the lower layer including: preparing a thermosetting coating material as a lower layer-coating material and preparing a thermosetting coating material as an upper layer-coating material; forming an uncured laminated coating film by applying the lower layer-coating material and the upper layer-coating material on the base material using a wet-on-wet technique; and simultaneously curing the lower layer-coating material and the upper layer-coating material by baking the uncured laminated coating film. In the preparation step, the lower layer-coating material and the upper layer-coating material are selected so that an absolute value of a difference in shrinkage ratio between the lower layer and the upper layer coating materials is 2.0% or smaller at a late stage of the baking step.

    Method for applying a powder coating
    10.
    发明授权
    Method for applying a powder coating 有权
    施用粉末涂料的方法

    公开(公告)号:US09586232B2

    公开(公告)日:2017-03-07

    申请号:US14386512

    申请日:2013-03-26

    摘要: A method for the application of at least two different powder coating layers to a substrate comprising the steps of application of a first powder coating layer followed by the application of a second powder coating layer, without any substantial curing of the first powder coating layer prior to the application of the second powder coating layer, followed by the simultaneous curing of the first powder coating layer and the second powder coating layer, wherein the first powder coating layer or the second powder coating layer comprises 1 to 10 weight % of a conductive component having a resistivity of below 5 Ωcm at a packing volume of ≦70%.

    摘要翻译: 一种用于将至少两种不同的粉末涂层施加到基底上的方法,包括以下步骤:施加第一粉末涂层,然后施加第二粉末涂层,而不在第一粉末涂层之前基本上固化第一粉末涂层 施加第二粉末涂层,然后同时固化第一粉末涂层和第二粉末涂层,其中第一粉末涂层或第二粉末涂层包含1至10重量%的导电组分,其具有 电阻率小于5Ωcm,填充体积≤70%。