公开(公告)号：US08208684B2

公开(公告)日：2012-06-26

申请号：US12497341

申请日：2009-07-02

申请人： Paul A. Hosier ,  Martin Edward Banton ,  Frederick O. Hayes, III

发明人： Paul A. Hosier ,  Martin Edward Banton ,  Frederick O. Hayes, III

IPC分类号： G06K9/00 ,  H01L27/00 ,  H04N1/46

CPC分类号： H04N1/047 ,  G06T3/4007 ,  H04N1/193 ,  H04N1/1934 ,  H04N2201/03162 ,  H04N2201/04787 ,  H04N2201/04789 ,  H04N2201/04791 ,  H04N2201/04793

摘要： A method of processing image data from a multi-chip array with a plurality of photosensitive chips aligned substantially in a transverse direction, including: generating, using a processor for at least one specially programmed computer, a Δy or Δx optical error value equal to a difference in process and transverse directions, respectively, between actual and apparent locations for a first photosensor, the apparent location due to optical error; and storing, in a memory element for the specially programmed computer, respective outputs from the photosensors in the array for first and second scan lines. The actual location is included in the first scan line. The processor retrieves, for use as at least part of useful image data for the first photosensor, the stored output of: the first photosensor for the second scan line for a Δy optical error, or a second photosensor for the first line for a Δx optical error.

摘要翻译： 一种处理来自多芯片阵列的图像数据的方法，所述多芯片阵列具有基本在横向上排列的多个感光芯片，包括：使用用于至少一个专门编程的计算机的处理器，产生＆Dgr; y或＆Dgr; x光学误差 值分别等于第一光电传感器的实际和表观位置之间的过程和横向方向的差异，由于光学误差引起的表观位置; 以及将用于特殊编程的计算机的存储元件存储在用于第一和第二扫描线的阵列中的光电传感器的相应输出。 实际位置包含在第一条扫描线中。 处理器检索用作第一光电传感器的有用图像数据的至少一部分，存储的输出：用于第一扫描线的第一光电传感器用于光学误差，或用于第一行的第二光电传感器 ＆Dgr; x光学错误。

公开(公告)号：US20120140014A1

公开(公告)日：2012-06-07

申请号：US12957896

申请日：2010-12-01

申请人： Paul A. HOSIER

发明人： Paul A. HOSIER

IPC分类号： B41J2/435

CPC分类号： B41J2/45 ,  B41J2/385 ,  B41J2/40 ,  B41J2/405 ,  B41J2/435 ,  G06K15/1247

摘要： A device including: a photoreceptor; an LED printbar; and a computer processor for: determining how long LEDs on the printbar are energized while the device is operated to generate an image output; determining that a first plurality of LEDs has been energized less than a second plurality of LEDs; energizing the first plurality of LEDs for a correction time period as the LEDs are aligned with an inter-document zone (IDZ); and de-energizing the second plurality of LEDs during the time period. Energizing the second plurality of LEDs is unrelated to energizing the LEDs for purposes of evaluating an image. The time period is concurrent with operation of the device to generate an image output.

摘要翻译： 一种装置，包括：感光体; LED打印条 以及计算机处理器，用于：在所述设备被操作以产生图像输出的同时，确定所述打印机上的LED被激励多长时间; 确定第一多个LED已被激励小于第二多个LED; 当LED与文档间区域（IDZ）对准时，激励第一多个LED用于校正时间段; 并且在该时间段期间使第二多个LED断电。 为了评估图像的目的，使第二多个LED通电与LED的通电无关。 该时间段与设备的操作同时生成图像输出。

公开(公告)号：US08129258B2

公开(公告)日：2012-03-06

申请号：US12646590

申请日：2009-12-23

申请人： Paul A. Hosier ,  Nicholas J. Salatino

发明人： Paul A. Hosier ,  Nicholas J. Salatino

IPC分类号： H01L21/00

CPC分类号： H01L23/544 ,  H01L21/268 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for dicing a semiconductor wafer, including: cutting a reference slot in a back main surface of the wafer; cutting a back slot in the back main surface, the back slot positioned with respect to the reference slot; determining a desired location for a chip edge with respect to the reference slot; and applying radiant energy in a path such that a series of reformed regions are formed within the wafer along the path. A crystalline structure of the wafer is modified in the series of reformed regions and an alignment of an edge of the laser is with respect to the desired location for the chip edge and in alignment with the back slot. The method includes separating the wafer along the series of reformed regions to divide portions of the wafer on either side of the series of reformed regions.

摘要翻译： 一种用于切割半导体晶片的方法，包括：切割晶片的后主表面中的参考槽; 切割后主表面中的后槽，相对于参考槽定位的后槽; 确定芯片边缘相对于参考时隙的期望位置; 并且在路径中施加辐射能，使得沿着路径在晶片内形成一系列重整区。 在一系列重整区域中修改了晶片的晶体结构，并且激光器边缘的对准相对于芯片边缘的期望位置并与后槽对准。 该方法包括沿着一系列重整区域分离晶片以将晶片的部分划分在一系列重整区域的两侧。

公开(公告)号：US20110200346A1

公开(公告)日：2011-08-18

申请号：US12706327

申请日：2010-02-16

申请人： Paul A. HOSIER

发明人： Paul A. HOSIER

IPC分类号： G03G15/00 ,  H04N1/405

CPC分类号： H04N1/4058 ,  G03G15/5041 ,  H04N1/58 ,  H04N1/6033

摘要： Disclosed herein are a method and a printing apparatus implementing the method to minimize cross-process direction non-uniformities of color images in printed documents. When printing images on a photoreceptor, halftone test patches are generated for each color. A first halftone cell orientation (of dots) of the test patches and their corresponding color image data is determined. The halftone cells of test patches may be provided or rotated to a second orientation (or angle or degrees) for printing in an inter-document zone of the photoreceptor, while the first orientation of the color image data in the document image area of the photoreceptor remains the same. Errors or non-uniformities (e.g., with TRC correction) caused by sensor misreading of test patches at specific orientations in the cross-process direction are substantially eliminated, thereby providing output images without streaks or visible errors.

摘要翻译： 这里公开了一种方法和打印设备，其实现了使打印文档中的彩色图像的交叉过程方向不均匀性最小化的方法。 当在感光体上打印图像时，会为每种颜色生成半色调测试贴片。 确定测试片的第一个半色调细胞取向（点）及其对应的彩色图像数据。 可以将测试贴片的半色调细胞提供或旋转到用于在感光体的文档间区域中打印的第二取向（或角度或度），同时在感光体的文档图像区域中的彩色图像数据的第一取向 保持不变。 基本上消除了在交叉处理方向上的特定取向处的测试片的传感器误读造成的错误或非均匀性（例如，由于TRC校正），由此提供没有条纹或可见错误的输出图像。

公开(公告)号：US07359093B2

公开(公告)日：2008-04-15

申请号：US10845164

申请日：2004-05-14

申请人： Stuart A. Schweid ,  Shen-ge Wang ,  Paul A. Hosier

发明人： Stuart A. Schweid ,  Shen-ge Wang ,  Paul A. Hosier

IPC分类号： H04N1/409

CPC分类号： H04N1/4097 ,  H04N1/00092 ,  H04N1/1215 ,  H04N1/193

摘要： A streak detection method and system in a fixed imaging array digital scanning system obtains image data from each of the plurality of rows in the at least one full color spectrum channel set of rows of positionally discrete sensors and integrates this data to produce an estimate of image data recorded by at least one clear channel row of positionally discrete sensors. A clear channel error signal is generated by the comparison to alert the operator to the presence of non-image data. The clear channel error signal may be refined to through a low pass column filtering process in order to filter out potentially erroneous clear channel error resulting from thermal, mechanical or other noise sources unrelated to image scanning. Stationary obstructions in the field of view of the imaging array, or defects in one or more sensors in the imaging array, are detected through this comparison which would otherwise appear repeatedly reproduced as streaks or lines in the reproduced output image.

摘要翻译： 固定成像阵列数字扫描系统中的条纹检测方法和系统从至少一个位置离散传感器行的全色谱通道组中的多行中的每一行获得图像数据，并对该数据进行积分以产生图像估计 通过位置离散传感器的至少一个清晰通道行记录的数据。 通过比较产生清晰的通道错误信号，以向操作员警告非图像数据的存在。 可以通过低通列滤波处理来将清除信道误差信号细化为过滤掉与图像扫描无关的热，机械或其它噪声源引起的潜在错误的清除信道误差。 通过该比较来检测成像阵列的视场中的固定障碍物或成像阵列中的一个或多个传感器中的缺陷，否则该比较将被再现为再现的输出图像中的条纹或线条。

公开(公告)号：US06955989B2

公开(公告)日：2005-10-18

申请号：US09996681

申请日：2001-11-30

申请人： Alain E. Perregaux ,  Paul A. Hosier ,  Josef E. Jedlicka ,  Nicholas J. Salatino ,  Jagdish C. Tandon

发明人： Alain E. Perregaux ,  Paul A. Hosier ,  Josef E. Jedlicka ,  Nicholas J. Salatino ,  Jagdish C. Tandon

IPC分类号： B28D5/02 ,  H01L21/301 ,  H01L21/3065 ,  H01L21/302

CPC分类号： B28D5/022 ,  H01L21/78

摘要： The present disclosure relates that by modifying chip die dicing methodology to a U-groove profile from a V-groove profile by modifying the second etch step to be a dry etch instead of a wet etch results in a direct cost savings by eliminating a more expensive process step, as well as the need for stripping the developed photoresist layer. Furthermore, going to a U-groove profile accomplishes additional indirect and greater cost savings resulting from increased process throughput, improved yield, and reduced metal layer defects.

摘要翻译： 本公开内容涉及通过将第二蚀刻步骤通过将第二蚀刻步骤修改为干蚀刻而不是湿蚀刻将芯片芯片切割方法修改为U形沟槽轮廓导致通过消除更昂贵的直接成本节省 工艺步骤，以及剥离显影的光致抗蚀剂层的需要。 此外，进入U形凹槽轮廓可实现额外的间接和更大的成本节省，这是由于加工量增加，产量提高和金属层缺陷减少。

公开(公告)号：US6157019A

公开(公告)日：2000-12-05

申请号：US282317

申请日：1999-03-31

申请人： Paul A. Hosier

发明人： Paul A. Hosier

IPC分类号： H01L27/14 ,  G06T1/00 ,  H01L27/146 ,  H04N1/028 ,  H01L27/00 ,  H01L31/0232 ,  H01L31/062

CPC分类号： H01L27/14643 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14632

摘要： The present invention relates to photosensitive chips for creating electrical signals from an original image, as would be found for example in a digital scanner, copier, facsimile machine, or other document generating or reproducing device. More specifically, the present invention provides a way of shielding the edge photosites with an opaque layer that overlaps the diced region and preserves the integrity of the filter layers while eliminating the need for a guardring to decrease the dead space and consequently reduce the undesirable effects of Moire patterns.

摘要翻译： 本发明涉及用于从原始图像产生电信号的感光芯片，例如在数字扫描仪，复印机，传真机或其他文件生成或再现装置中可以找到。 更具体地说，本发明提供了一种通过与切割区域重叠的不透明层来屏蔽边缘光电子的方式，并且保持了滤光层的完整性，同时消除了防护装置的需要以减小死空间，并因此减少不利影响 Moir + E，acu e + EE图案。

公开(公告)号：US6014160A

公开(公告)日：2000-01-11

申请号：US50272

申请日：1998-03-30

申请人： Scott L. Tewinkle ,  Paul A. Hosier ,  Jagdish C. Tandon

发明人： Scott L. Tewinkle ,  Paul A. Hosier ,  Jagdish C. Tandon

IPC分类号： H04N1/191 ,  H04N1/193 ,  H04N1/40 ,  H04N5/369 ,  H04N1/19

CPC分类号： H04N1/1934 ,  H04N1/193 ,  H04N1/40 ,  H04N3/1581 ,  H04N3/1593

摘要： An image sensor array includes a plurality of photosensor chips, which are butted end-to-end to form a single linear array of photosensors. Each individual chip in the array is provided with an independently-addressable output enable line and video output line. This configuration allows individual chips to be addressed to output image data at specific times and in a specific manner suitable for any kind of downstream circuitry.

摘要翻译： 图像传感器阵列包括多个光电传感器芯片，它们被端对端对接以形成光电传感器的单个线性阵列。 阵列中的每个芯片都提供独立可寻址的输出使能线和视频输出线。 这种配置允许单独的芯片被寻址以在特定时间和以适合于任何种类的下游电路的特定方式输出图像数据。

公开(公告)号：US5696626A

公开(公告)日：1997-12-09

申请号：US542247

申请日：1995-10-12

申请人： Paul A. Hosier ,  Jagdish C. Tandon ,  Josef E. Jedlicka ,  Brian T. Ormond

发明人： Paul A. Hosier ,  Jagdish C. Tandon ,  Josef E. Jedlicka ,  Brian T. Ormond

IPC分类号： H01L31/0216 ,  H04N1/04

CPC分类号： H01L31/02162

摘要： A photosensitive chip, such as used in a scanner or facsimile, defines a linear array of photosites, each photosite being covered with a filter formed from a cured translucent liquid. At the critical ends of the chip, between the end photosite in the array and the edge of the chip, there is provided a ridge which protrudes over the thickness of the filter. This ridge maintains the physical integrity of the filter.

摘要翻译： 诸如用于扫描仪或传真机中的感光芯片限定了一种线性阵列的光斑，每个光斑都被由固化的半透明液体形成的过滤器覆盖。 在芯片的临界端，在阵列中的端部闪光和芯片的边缘之间，设置有突出于过滤器厚度的脊。 该脊保持过滤器的物理完整性。

公开(公告)号：US5128282A

公开(公告)日：1992-07-07

申请号：US787445

申请日：1991-11-04

申请人： Brian T. Ormond ,  Kraig A. Quinn ,  Paul A. Hosier ,  Josef E. Jedlicka

发明人： Brian T. Ormond ,  Kraig A. Quinn ,  Paul A. Hosier ,  Josef E. Jedlicka

IPC分类号： H01L21/304 ,  H01L31/18

CPC分类号： H01L21/304 ,  H01L31/1804 ,  Y02E10/547

摘要： A process for separating image sensor dies and the like from a wafer in which pairs of separation grooves separating each row of dies are formed in the active side of the wafer, with the tab between each groove pair being substantially equal to the width of the dicing blade, cutting a single bottom groove in the inactive side of the wafer opposite to and spanning each pair of separation grooves, and aligning the dicing blade with the midpoint of the wall of one groove in each pair of grooves so as to cut between the rows of dies. In a second embodiment, a two-pass separation process is enabled in which the tab between separation grooves is slightly larger than the width of the dicing blade, with the dicing blade first aligned with the midpoint of one separation groove to cut one row of dies from the wafer together with part of the tab, with the blade realigned with the midpoint of the other separate groove to cut a second row of dies and the remainder of the tab.

摘要翻译： 用于从晶片分离图像传感器管芯等的工艺，其中在晶片的有源侧形成有分隔每一列管芯的隔离槽对，每个槽对之间的突片基本上等于切割宽度 切割晶片的不活动侧的单个底槽，与每对分隔槽相对并跨越每对分隔槽，并将切割刀片与每对槽中的一个槽的壁的中点对准，以便在行之间切割 的死亡。 在第二实施例中，能够进行双路分离处理，其中分离槽之间的突片略大于切割刀片的宽度，其中切割刀片首先与一个分隔槽的中点对齐，以切割一排模具 从晶片与片的一部分一起，刀片与另一个分开的凹槽的中点重新对准，以切割第二排模具和突片的其余部分。