公开(公告)号：US20130255079A1

公开(公告)日：2013-10-03

申请号：US13878864

申请日：2010-10-14

申请人： Juha Maijala ,  Petri Sirviö

发明人： Juha Maijala ,  Petri Sirviö

IPC分类号： H05K3/30

CPC分类号： H05K3/30 ,  B23K1/0016 ,  H01L2224/16225 ,  H01L2224/75 ,  H01L2224/81 ,  H05K3/1266 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3494 ,  H05K13/0465 ,  H05K2203/0278 ,  H05K2203/111 ,  Y10T29/4913 ,  Y10T29/53178

摘要： A chip is attached to a printed conductive surface. The chip is first heated to a first temperature, which is lower than what the chip can stand without being damaged by the heat. The heated chip is pressed against the printed conductive surface with a first pressing force. A combination of said first temperature and said first pressing force is sufficient to at least partly melt the material of at least one of: the printed conductive surface, contact point on the chip.

摘要翻译： 芯片附着在印刷导电表面上。 该芯片首先被加热到第一温度，该温度低于芯片可以承受而不被热量损坏的温度。 加热的芯片以第一按压力压靠印刷的导电表面。 所述第一温度和所述第一按压力的组合足以至少部分地熔化所述印刷导电表面，芯片上的接触点中的至少一个的材料。

公开(公告)号：US08493421B2

公开(公告)日：2013-07-23

申请号：US12989332

申请日：2009-04-24

申请人： Jonas Pettersson ,  Petri Sirviö ,  Marko Ryynänen ,  Juha Lehtola

发明人： Jonas Pettersson ,  Petri Sirviö ,  Marko Ryynänen ,  Juha Lehtola

IPC分类号： B41J2/00 ,  B31B1/00

CPC分类号： B31B50/00 ,  B31B50/006 ,  B31B50/16 ,  B31B50/20 ,  B31B50/88

摘要： Packages are manufactured in a digitally controlled process. A digital printing machine (101) produces printed workpieces and a cutting machine (104) cuts packaging blanks (105) from them. A conveyor line (107) transfers the printed work-pieces automatically from the digital printing machine (101) to the cutting machine (104). A digital control system (109) exchanges digital control information with at least the digital printing machine (101) and the cutting machine (104).

摘要翻译： 包装以数字控制的方式制造。 数字印刷机（101）生产印刷的工件，切割机（104）从其中切割包装坯料（105）。 输送线（107）将打印的工件自动地从数字印刷机（101）传送到切割机（104）。 数字控制系统（109）至少与数字印刷机（101）和切割机（104）交换数字控制信息。

公开(公告)号：US09629255B2

公开(公告)日：2017-04-18

申请号：US13878864

申请日：2010-10-14

申请人： Juha Maijala ,  Petri Sirviö

发明人： Juha Maijala ,  Petri Sirviö

IPC分类号： H05K3/30 ,  B23K1/00 ,  H05K13/04 ,  H05K3/32 ,  H05K3/34

CPC分类号： H05K3/30 ,  B23K1/0016 ,  H01L2224/16225 ,  H01L2224/75 ,  H01L2224/81 ,  H05K3/1266 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3494 ,  H05K13/0465 ,  H05K2203/0278 ,  H05K2203/111 ,  Y10T29/4913 ,  Y10T29/53178

摘要： A chip attached to and electrically connected with a printed conductive surface, whereby the chip is heated to a temperature, which is lower than what the chip can stand without being damaged by the heat, the heated chip is then pressed against the printed conductive surface with a pressing force, whereby a combination of said temperature and said pressing force is sufficient to at least partly melt the material of at least one of the printed conductive surface, the contact point on the chip, or both, thereby attaching and electrically connecting the chip to the printed conductive surface.

公开(公告)号：US20110122212A1

公开(公告)日：2011-05-26

申请号：US12989332

申请日：2009-04-24

申请人： Jonas Pettersson ,  Petri Sirviö ,  Marko Ryynänen ,  Juha Lehtola

发明人： Jonas Pettersson ,  Petri Sirviö ,  Marko Ryynänen ,  Juha Lehtola

IPC分类号： B41J2/00

CPC分类号： B31B50/00 ,  B31B50/006 ,  B31B50/16 ,  B31B50/20 ,  B31B50/88

摘要： Packages are manufactured in a digitally controlled process. A digital printing machine (101) produces printed workpieces and a cutting machine (104) cuts packaging blanks (105) from them. A conveyor line (107) transfers the printed work-pieces automatically from the digital printing machine (101) to the cutting machine (104). A digital control system (109) exchanges digital control information with at least the digital printing machine (101) and the cutting machine (104).

摘要翻译： 包装以数字控制的方式制造。 数字印刷机（101）生产印刷的工件，切割机（104）从其中切割包装坯料（105）。 输送线（107）将打印的工件自动地从数字印刷机（101）传送到切割机（104）。 数字控制系统（109）至少与数字印刷机（101）和切割机（104）交换数字控制信息。

公开(公告)号：USRE48018E1

公开(公告)日：2020-05-26

申请号：US16007530

申请日：2018-06-13

申请人： Juha Maijala ,  Petri Sirviö

发明人： Juha Maijala ,  Petri Sirviö

IPC分类号： H05K3/30 ,  B23K1/00 ,  H05K1/00 ,  H05K3/32 ,  H05K3/34 ,  H05K13/04 ,  H05K3/12

摘要： A chip attached to and electrically connected with a printed conductive surface, whereby the chip is heated to a temperature, which is lower than what the chip can stand without being damaged by the heat, the heated chip is then pressed against the printed conductive surface with a pressing force, whereby a combination of said temperature and said pressing force is sufficient to at least partly melt the material of at least one of the printed conductive surface, the contact point on the chip, or both, thereby attaching and electrically connecting the chip to the printed conductive surface.

公开(公告)号：US08654502B2

公开(公告)日：2014-02-18

申请号：US12991598

申请日：2008-05-09

申请人： Juha Maijala ,  Petri Sirviö

发明人： Juha Maijala ,  Petri Sirviö

IPC分类号： H01H47/00

CPC分类号： C23C26/00 ,  C23C24/10 ,  H05K1/0393 ,  H05K3/1266 ,  H05K2203/0143 ,  H05K2203/0517 ,  H05K2203/0522 ,  H05K2203/1131 ,  H05K2203/1545 ,  Y10T428/24322 ,  Y10T428/24521 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/256

摘要： An apparatus, a method, a planar insulating substrate and a chipset have been presented, comprising at least one module configured to establish a predefined pattern on a planar insulating substrate so that conductive particles can gather according to the predefined pattern. At least one another module is configured to transfer the conductive particles to the planar insulating substrate, wherein the conductive particles are arranged to gather according to the predefined pattern. A sintering module is configured to fuse the conductive particles on the planar insulating substrate, wherein the conductive particles are arranged to fuse according to the predefined pattern to establish a conductive plane on the planar insulating substrate. Embodiment of the invention relate to printable or printing electronics on a fibrous web.

摘要翻译： 已经提出了一种装置，方法，平面绝缘基板和芯片组，其包括至少一个模块，其被配置为在平面绝缘基板上建立预定图案，使得导电颗粒可以根据预定图案聚集。 至少另一个模块被配置为将导电颗粒转移到平面绝缘基板，其中导电颗粒被布置为根据预定图案聚集。 烧结模块被配置为熔合平面绝缘衬底上的导电颗粒，其中导电颗粒被布置成根据预定图案熔合以在平面绝缘衬底上建立导电平面。 本发明的实施例涉及在纤维网上的可印刷或印刷电子元件。