公开(公告)号：US20130062642A1

公开(公告)日：2013-03-14

申请号：US13366375

申请日：2012-02-06

申请人： PI-CHIANG HU ,  MENG-HSIEN HONG ,  SHIH-YUAN HSU

发明人： PI-CHIANG HU ,  MENG-HSIEN HONG ,  SHIH-YUAN HSU

IPC分类号： H01L33/60

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package device comprises a substrate, a first electrode, a second electrode, a reflector, an encapsulation layer and an LED die. The substrate includes a top surface and a bottom surface opposite to the top surface, wherein the first and the second electrodes are located on the top surface of the substrate. A sum of the areas of the first and the second electrodes on the top surface is smaller than ¼-⅔ the area of the top surface. Therefore, an increased contacting area between the reflector and the substrate is formed to enhance the tightness of the LED package device.

摘要翻译： LED封装器件包括衬底，第一电极，第二电极，反射器，封装层和LED管芯。 衬底包括顶表面和与顶表面相对的底表面，其中第一和第二电极位于衬底的顶表面上。 上表面上的第一和第二电极的面积之和小于上表面的面积的1/4。 因此，形成反射器和基板之间增加的接触面积，以增强LED封装器件的紧密度。

公开(公告)号：US20120326175A1

公开(公告)日：2012-12-27

申请号：US13370317

申请日：2012-02-10

申请人： PI-CHIANG HU ,  SHIH-YUAN HSU

发明人： PI-CHIANG HU ,  SHIH-YUAN HSU

IPC分类号： H01L33/60 ,  H01L33/52 ,  H01L33/08

CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L33/46 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： An LED package includes a substrate with two opposite lateral bulging portions, an LED die, an electrode structure, and a reflective layer. The substrate includes a first substrate and a second substrate stacked together; the first substrate and the second substrate are transparent; and the substrate includes an emitting surface for emitting light of the LED package. The electrode structure is sandwiched between the first substrate and the second substrate. The LED die is mounted in the substrate and electrically connected to the electrode structure. The reflective layer is formed on an outer surface of the substrate except the emitting surface and the bulging portions. The disclosure also provides a method for manufacturing such an LED package.

摘要翻译： LED封装包括具有两个相对的侧向凸出部分的基板，LED管芯，电极结构和反射层。 基板包括堆叠在一起的第一基板和第二基板; 第一基板和第二基板是透明的; 并且所述基板包括用于发射所述LED封装的光的发射表面。 电极结构夹在第一基板和第二基板之间。 LED管芯安装在基板中并与电极结构电连接。 反射层形成在除了发光面和凸出部之外的基板的外表面上。 本公开还提供了制造这种LED封装的方法。

公开(公告)号：US08569781B2

公开(公告)日：2013-10-29

申请号：US13288042

申请日：2011-11-03

申请人： Pi-Chiang Hu ,  Shih-Yuan Hsu ,  Kai-Lun Wang

发明人： Pi-Chiang Hu ,  Shih-Yuan Hsu ,  Kai-Lun Wang

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2933/0033 ,  H01L2924/00014

摘要： An LED package comprises a substrate, a reflector, a light-absorbing layer, an encapsulation layer and an LED chip. The light-absorbing layer is located around the reflector and is able to absorb any light which penetrates through the reflector. Therefore, any vignetting or halation of light from the LED package is prevented. Moreover, the LED package can be constructed on a very small scale with no reduction in its color rendering properties.

摘要翻译： LED封装包括基板，反射器，光吸收层，封装层和LED芯片。 光吸收层位于反射器周围，并且能够吸收穿透反射器的任何光。 因此，防止来自LED封装件的光的任何渐晕或晕倒。 此外，LED封装可以以非常小的尺寸构造，而不会降低其显色性能。

公开(公告)号：US20120217046A1

公开(公告)日：2012-08-30

申请号：US13366371

申请日：2012-02-06

申请人： PI-CHIANG HU ,  KAI-LUN WANG

发明人： PI-CHIANG HU ,  KAI-LUN WANG

IPC分类号： H05K1/03

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2924/00

摘要： A plurality of conductive areas is formed on a conductive substrate which includes a frame. Each of the conductive areas includes a lead frame and two electrodes. The frame includes a first side and an opposite second side. The lead frame includes first and second lead frame beams. The first and second lead frame beams extend from the first side toward the second side to connect with the two electrodes. The first and second electrodes extend respectively from the first and second lead frame beams. Each conductive area also includes a supporting portion interconnecting the electrodes and the frame to reinforce the connection between the frame and the conductive area so that the conductive area can sustain a pressure when an insulation shell is injection molded on the conductive area.

摘要翻译： 在包括框架的导电基板上形成多个导电区域。 每个导电区域包括引线框架和两个电极。 框架包括第一侧和相对的第二侧。 引线框架包括第一和第二引线框架梁。 第一和第二引线框架梁从第一侧向第二侧延伸以与两个电极连接。 第一和第二电极分别从第一和第二引线框架梁延伸。 每个导电区域还包括互连电极和框架的支撑部分，以加强框架和导电区域之间的连接，使得当绝缘壳体被注塑在导电区域上时，导电区域可承受压力。

公开(公告)号：US20120061692A1

公开(公告)日：2012-03-15

申请号：US13082406

申请日：2011-04-08

申请人： CHAO-HSIUNG CHANG ,  PI-CHIANG HU

发明人： CHAO-HSIUNG CHANG ,  PI-CHIANG HU

IPC分类号： H01L27/15

CPC分类号： H01L33/36 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/09701 ,  H01L2924/00014

摘要： A light emitting diode (LED) package includes a substrate, a first LED chip and a second LED chip. The substrate includes first to fourth electrodes, and an interconnection electrode. A mounting area is defined at center of a top surface of the substrate. The first to fourth electrodes are respectively in four corners of the substrate out of the mounting area. The first interconnection electrode is embedded in the substrate to electrically connect the first and the third electrodes. The first LED chip and the second LED chip are arranged in the mounting area. Each LED chip includes an anode pad and a cathode pad. The first to fourth electrodes are respectively connected to the four pads of the first and the second LED chips via a plurality of metal wires, and no metal wire connection is formed between the first and the second LED chips.

摘要翻译： 发光二极管（LED）封装包括衬底，第一LED芯片和第二LED芯片。 基板包括第一至第四电极和互连电极。 安装区域被限定在基板的顶表面的中心。 第一至第四电极分别位于安装区域外的基板的四个角中。 第一互连电极嵌入在基板中以电连接第一和第三电极。 第一LED芯片和第二LED芯片布置在安装区域中。 每个LED芯片包括阳极焊盘和阴极焊盘。 第一至第四电极分别通过多条金属线连接到第一和第二LED芯片的四个焊盘，并且在第一和第二LED芯片之间不形成金属线连接。

公开(公告)号：US08912558B2

公开(公告)日：2014-12-16

申请号：US14201982

申请日：2014-03-10

申请人： Pi-Chiang Hu ,  Shih-Yuan Hsu

发明人： Pi-Chiang Hu ,  Shih-Yuan Hsu

IPC分类号： H01L33/44 ,  H01L33/50

CPC分类号： H01L33/507 ,  H01L33/505 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

摘要： An LED package includes a substrate, an LED chip arranged on the substrate, and a light transmission layer arranged on a light output path of the LED chip. The substrate includes a first electrode and a second electrode separated and electrically insulated from the first electrode. The LED chip is electrically connected to the first electrode and the second electrode of the substrate. The light transmission layer comprises two parallel transparent plates and a fluorescent layer sandwiched between the two transparent plates. The LED package further includes an encapsulation layer sealing the LED chip therein. The light transmission layer is directly located on a top surface of each LED chip, and the encapsulation layer seals the light transmission layer therein.

摘要翻译： LED封装包括基板，布置在基板上的LED芯片和布置在LED芯片的光输出路径上的光透射层。 衬底包括与第一电极分离并电绝缘的第一电极和第二电极。 LED芯片电连接到基板的第一电极和第二电极。 透光层包括两个平行的透明板和夹在两个透明板之间的荧光层。 LED封装还包括将LED芯片密封在其中的封装层。 光透射层直接位于每个LED芯片的顶表面上，并且封装层将透光层密封在其中。

公开(公告)号：US20140183587A1

公开(公告)日：2014-07-03

申请号：US14201982

申请日：2014-03-10

申请人： PI-CHIANG HU ,  SHIH-YUAN HSU

发明人： PI-CHIANG HU ,  SHIH-YUAN HSU

IPC分类号： H01L33/50

CPC分类号： H01L33/507 ,  H01L33/505 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

摘要： An LED package includes a substrate, an LED chip arranged on the substrate, and a light transmission layer arranged on a light output path of the LED chip. The substrate includes a first electrode and a second electrode separated and electrically insulated from the first electrode. The LED chip is electrically connected to the first electrode and the second electrode of the substrate. The light transmission layer comprises two parallel transparent plates and a fluorescent layer sandwiched between the two transparent plates. The LED package further includes an encapsulation layer sealing the LED chip therein. The light transmission layer is directly located on a top surface of each LED chip, and the encapsulation layer seals the light transmission layer therein.

摘要翻译： LED封装包括基板，布置在基板上的LED芯片和布置在LED芯片的光输出路径上的光透射层。 衬底包括与第一电极分离并电绝缘的第一电极和第二电极。 LED芯片电连接到基板的第一电极和第二电极。 透光层包括两个平行的透明板和夹在两个透明板之间的荧光层。 LED封装还包括将LED芯片密封在其中的封装层。 光透射层直接位于每个LED芯片的顶表面上，并且封装层将透光层密封在其中。

公开(公告)号：US20120235193A1

公开(公告)日：2012-09-20

申请号：US13288042

申请日：2011-11-03

申请人： PI-CHIANG HU ,  SHIH-YUAN HSU ,  KAI-LUN WANG

发明人： PI-CHIANG HU ,  SHIH-YUAN HSU ,  KAI-LUN WANG

IPC分类号： H01L33/60

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2933/0033 ,  H01L2924/00014

摘要： An LED package comprises a substrate, a reflector, a light-absorbing layer, an encapsulation layer and an LED chip. The light-absorbing layer is located around the reflector and is able to absorb any light which penetrates through the reflector. Therefore, any vignetting or halation of light from the LED package is prevented. Moreover, the LED package can be constructed on a very small scale with no reduction in its color rendering properties.

摘要翻译： LED封装包括基板，反射器，光吸收层，封装层和LED芯片。 光吸收层位于反射器周围，并且能够吸收穿透反射器的任何光。 因此，防止来自LED封装件的光的任何渐晕或晕倒。 此外，LED封装可以以非常小的尺寸构造，而不会降低其显色性能。

公开(公告)号：US08709842B2

公开(公告)日：2014-04-29

申请号：US13476038

申请日：2012-05-21

申请人： Pi-Chiang Hu ,  Shih-Yuan Hsu

发明人： Pi-Chiang Hu ,  Shih-Yuan Hsu

IPC分类号： H01L33/44

CPC分类号： H01L33/507 ,  H01L33/505 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

摘要： An LED package includes a substrate, an LED chip arranged on the substrate, and a light transmission layer arranged on a light output path of the LED chip. The substrate includes a first electrode and a second electrode separated and electrically insulated from the first electrode. The LED chip is electrically connected to the first electrode and the second electrode of the substrate. The light transmission layer comprises two parallel transparent plates and a fluorescent layer sandwiched between the two transparent plates. The LED package further includes a transparent encapsulation layer sealing the LED chip therein, and in one embodiment, the light transmission layer is located on the encapsulation layer and in another embodiment, the encapsulation layer also seals the light transmission layer therein. A method for manufacturing the LED package is also provided.

摘要翻译： LED封装包括基板，布置在基板上的LED芯片和布置在LED芯片的光输出路径上的光透射层。 衬底包括与第一电极分离并电绝缘的第一电极和第二电极。 LED芯片电连接到基板的第一电极和第二电极。 透光层包括两个平行的透明板和夹在两个透明板之间的荧光层。 LED封装还包括将LED芯片密封在其中的透明封装层，在一个实施例中，光透射层位于封装层上，而在另一个实施例中，封装层也将光透射层密封在其中。 还提供了用于制造LED封装的方法。

公开(公告)号：US08581117B2

公开(公告)日：2013-11-12

申请号：US13366371

申请日：2012-02-06

申请人： Pi-Chiang Hu ,  Kai-Lun Wang

发明人： Pi-Chiang Hu ,  Kai-Lun Wang

IPC分类号： H01L23/28

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2924/00

摘要： A plurality of conductive areas is formed on a conductive substrate which includes a frame. Each of the conductive areas includes a lead frame and two electrodes. The frame includes a first side and an opposite second side. The lead frame includes first and second lead frame beams. The first and second lead frame beams extend from the first side toward the second side to connect with the two electrodes. The first and second electrodes extend respectively from the first and second lead frame beams. Each conductive area also includes a supporting portion interconnecting the electrodes and the frame to reinforce the connection between the frame and the conductive area so that the conductive area can sustain a pressure when an insulation shell is injection molded on the conductive area.

摘要翻译： 在包括框架的导电基板上形成多个导电区域。 每个导电区域包括引线框架和两个电极。 框架包括第一侧和相对的第二侧。 引线框架包括第一和第二引线框架梁。 第一和第二引线框架梁从第一侧向第二侧延伸以与两个电极连接。 第一和第二电极分别从第一和第二引线框架梁延伸。 每个导电区域还包括互连电极和框架的支撑部分，以加强框架和导电区域之间的连接，使得当绝缘壳体被注塑在导电区域上时，导电区域可承受压力。