公开(公告)号：US20110272452A1

公开(公告)日：2011-11-10

申请号：US12773099

申请日：2010-05-04

申请人： Kui Kam Lam ,  Pingliang Tu ,  Chun Hung Samuel Ip

发明人： Kui Kam Lam ,  Pingliang Tu ,  Chun Hung Samuel Ip

IPC分类号： B23K31/02

CPC分类号： B23K1/20 ,  B23K1/0016 ,  B23K3/063 ,  B23K2101/40 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00

摘要： An apparatus for dispensing solder onto a substrate for mounting a semiconductor chip on the substrate comprises a dispensing body and first and second dispensing channels extending through the dispensing body. Each dispensing channel is operative to receive a separate solder wire to feed the solder wire to an end of the dispensing body facing the substrate. The dispensing channels are further operative to introduce the solder wires in a solid state simultaneously from the end of the dispensing body to be melted upon contact with the substrate which is heated.

摘要翻译： 用于将衬底分配到衬底上用于将半导体芯片安装在衬底上的装置包括分配本体和延伸穿过分配本体的第一和第二分配通道。 每个分配通道可操作以接收单独的焊丝，以将焊丝馈送到面向衬底的分配主体的端部。 分配通道还可操作以从固化状态将焊丝从分配体的端部引入，以在与加热的基底接触时熔化。

公开(公告)号：US20150072473A1

公开(公告)日：2015-03-12

申请号：US14141767

申请日：2013-12-27

申请人： Kui Kam LAM ,  Pingliang TU ,  Zhao YANG ,  Jun QI ,  Chun Hung Samuel IP

发明人： Kui Kam LAM ,  Pingliang TU ,  Zhao YANG ,  Jun QI ,  Chun Hung Samuel IP

IPC分类号： H01L23/00 ,  B23K3/08 ,  B23K3/06

CPC分类号： B23K3/082 ,  B23K1/0016 ,  B23K1/206 ,  B23K3/063 ,  B23K3/08 ,  B23K2101/42 ,  H01L24/742 ,  H01L24/75 ,  H01L24/83 ,  H01L2021/60052 ,  H01L2224/2733 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/7501 ,  H01L2224/7565 ,  H01L2224/7801 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2924/00014 ,  H01L2924/014

摘要： A die attachment apparatus for attaching a semiconductor die onto a substrate having a metallic surface comprises a material dispensing station for dispensing a bonding material onto the substrate and a die attachment station for placing the semiconductor die onto the bonding material which has been dispensed onto the substrate. An activating gas generator positioned before the die attachment station introduces activated forming gas onto the substrate in order to reduce oxides on the substrate.

摘要翻译： 用于将半导体管芯附着在具有金属表面的基板上的管芯附接装置包括用于将粘合材料分配到基板上的材料分配站和用于将半导体管芯放置在已分配到基板上的接合材料上的管芯附着站 。 定位在管芯附着工位之前的激活气体发生器将激活的成形气体引入到衬底上，以便减少衬底上的氧化物。

公开(公告)号：US10399170B2

公开(公告)日：2019-09-03

申请号：US14141767

申请日：2013-12-27

申请人： Kui Kam Lam ,  Pingliang Tu ,  Zhao Yang ,  Jun Qi ,  Chun Hung Samuel Ip

发明人： Kui Kam Lam ,  Pingliang Tu ,  Zhao Yang ,  Jun Qi ,  Chun Hung Samuel Ip

IPC分类号： B23K3/08 ,  B23K1/00 ,  B23K1/20 ,  B23K3/06 ,  H01L23/00 ,  H01L21/60 ,  B23K101/42

摘要： A die attachment apparatus for attaching a semiconductor die onto a substrate having a metallic surface comprises a material dispensing station for dispensing a bonding material onto the substrate and a die attachment station for placing the semiconductor die onto the bonding material which has been dispensed onto the substrate. An activating gas generator positioned before the die attachment station introduces activated forming gas onto the substrate in order to reduce oxides on the substrate.

公开(公告)号：US20130119113A1

公开(公告)日：2013-05-16

申请号：US13738716

申请日：2013-01-10

申请人： Kui Kam LAM ,  Pingliang TU ,  Chun Hung Samuel IP

发明人： Kui Kam LAM ,  Pingliang TU ,  Chun Hung Samuel IP

IPC分类号： B23K1/20

CPC分类号： B23K1/20 ,  B23K1/0016 ,  B23K3/063 ,  B23K2101/40 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00

摘要： An apparatus for dispensing solder onto a substrate for mounting a semiconductor chip on the substrate comprises a dispensing body and first and second dispensing channels extending through the dispensing body. Each dispensing channel is operative to receive a separate solder wire to feed the solder wire to an end of the dispensing body facing the substrate. The dispensing channels are further operative to introduce the solder wires in a solid state simultaneously from the end of the dispensing body to be melted upon contact with the substrate which is heated.

摘要翻译： 用于将衬底分配到衬底上用于将半导体芯片安装在衬底上的装置包括分配本体和延伸穿过分配本体的第一和第二分配通道。 每个分配通道可操作以接收单独的焊丝，以将焊丝馈送到面向衬底的分配主体的端部。 分配通道还可操作以从固化状态将焊丝从分配体的端部引入，以在与加热的基底接触时熔化。