公开(公告)号：US20150072473A1

公开(公告)日：2015-03-12

申请号：US14141767

申请日：2013-12-27

申请人： Kui Kam LAM ,  Pingliang TU ,  Zhao YANG ,  Jun QI ,  Chun Hung Samuel IP

发明人： Kui Kam LAM ,  Pingliang TU ,  Zhao YANG ,  Jun QI ,  Chun Hung Samuel IP

IPC分类号： H01L23/00 ,  B23K3/08 ,  B23K3/06

CPC分类号： B23K3/082 ,  B23K1/0016 ,  B23K1/206 ,  B23K3/063 ,  B23K3/08 ,  B23K2101/42 ,  H01L24/742 ,  H01L24/75 ,  H01L24/83 ,  H01L2021/60052 ,  H01L2224/2733 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/7501 ,  H01L2224/7565 ,  H01L2224/7801 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2924/00014 ,  H01L2924/014

摘要： A die attachment apparatus for attaching a semiconductor die onto a substrate having a metallic surface comprises a material dispensing station for dispensing a bonding material onto the substrate and a die attachment station for placing the semiconductor die onto the bonding material which has been dispensed onto the substrate. An activating gas generator positioned before the die attachment station introduces activated forming gas onto the substrate in order to reduce oxides on the substrate.

摘要翻译： 用于将半导体管芯附着在具有金属表面的基板上的管芯附接装置包括用于将粘合材料分配到基板上的材料分配站和用于将半导体管芯放置在已分配到基板上的接合材料上的管芯附着站 。 定位在管芯附着工位之前的激活气体发生器将激活的成形气体引入到衬底上，以便减少衬底上的氧化物。

公开(公告)号：US20130119113A1

公开(公告)日：2013-05-16

申请号：US13738716

申请日：2013-01-10

申请人： Kui Kam LAM ,  Pingliang TU ,  Chun Hung Samuel IP

发明人： Kui Kam LAM ,  Pingliang TU ,  Chun Hung Samuel IP

IPC分类号： B23K1/20

CPC分类号： B23K1/20 ,  B23K1/0016 ,  B23K3/063 ,  B23K2101/40 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00

摘要： An apparatus for dispensing solder onto a substrate for mounting a semiconductor chip on the substrate comprises a dispensing body and first and second dispensing channels extending through the dispensing body. Each dispensing channel is operative to receive a separate solder wire to feed the solder wire to an end of the dispensing body facing the substrate. The dispensing channels are further operative to introduce the solder wires in a solid state simultaneously from the end of the dispensing body to be melted upon contact with the substrate which is heated.

摘要翻译： 用于将衬底分配到衬底上用于将半导体芯片安装在衬底上的装置包括分配本体和延伸穿过分配本体的第一和第二分配通道。 每个分配通道可操作以接收单独的焊丝，以将焊丝馈送到面向衬底的分配主体的端部。 分配通道还可操作以从固化状态将焊丝从分配体的端部引入，以在与加热的基底接触时熔化。

公开(公告)号：US20090145950A1

公开(公告)日：2009-06-11

申请号：US11952296

申请日：2007-12-07

申请人： Kui Kam LAM ,  Chun Hung Samuel Ip

发明人： Kui Kam LAM ,  Chun Hung Samuel Ip

IPC分类号： B23K1/20 ,  B23K3/06

CPC分类号： B23K1/0016 ,  B23K3/063 ,  B23K2101/40 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00

摘要： A method for mounting a semiconductor chip onto a substrate comprises the steps of positioning a solder dispenser over the substrate and passing a length of solder wire through the solder dispenser to the substrate. The feeding of the wire to the substrate in a feeding direction is controlled with a wire feeder. The solder dispenser is moved relative to the substrate with a positioning device along at least one of two orthogonal axes that are substantially perpendicular to the feeding direction contemporaneously with feeding the solder wire to the surface of the substrate to dispense a line of molten solder onto the substrate. The semiconductor chip is then mounted onto the molten solder that has been dispensed onto the substrate.

摘要翻译： 将半导体芯片安装到衬底上的方法包括以下步骤：将焊料分配器定位在衬底上并将一定长度的焊丝通过焊料分配器传送到衬底。 在送丝方向上将丝线馈送到基片上用送丝机进行控制。 焊料分配器相对于基板移动，其中定位装置沿着两个正交轴线中的至少一个垂直于馈送方向，同时将焊丝馈送到基板的表面，以将熔融焊料线分配到 基质。 然后将半导体芯片安装到已经分配到基板上的熔融焊料上。

公开(公告)号：US20080078145A1

公开(公告)日：2008-04-03

申请号：US11536051

申请日：2006-09-28

申请人： Ping Liang TU ,  Deming LIU ,  Kui Kam LAM ,  Man Chung Raymond NG

发明人： Ping Liang TU ,  Deming LIU ,  Kui Kam LAM ,  Man Chung Raymond NG

IPC分类号： B65B31/00

CPC分类号： B23K1/008 ,  B23K2101/40

摘要： A manufacturing process and apparatus therefore are provided for processing an electronic device comprising oxidizable material during processing. The electronic device is located inside a chamber and is heated a processing temperature with a heater. A reductive atmosphere is created in the chamber by supplying a gas comprising glycolic acid vapor while processing the electronic device at the processing temperature.

摘要翻译： 因此，提供了一种制造工艺和装置，用于在加工期间处理包括可氧化材料的电子装置。 电子设备位于室内并用加热器加热处理温度。 通过在加工温度下处理电子装置的同时供应包含乙醇酸蒸汽的气体，在室中产生还原性气氛。

公开(公告)号：US20140341691A1

公开(公告)日：2014-11-20

申请号：US14271944

申请日：2014-05-07

申请人： Kui Kam LAM ,  Yen Hsi TANG ,  Wing Fai LAM

发明人： Kui Kam LAM ,  Yen Hsi TANG ,  Wing Fai LAM

IPC分类号： B65G47/04

CPC分类号： H01L21/67144 ,  H01L24/75 ,  H01L2224/7565 ,  H01L2224/75753 ,  H01L2224/758

摘要： Disclosed is a bonding apparatus, comprising: i) a supporting device for supporting a supply of electronic devices; ii) an ejecting device for ejecting an electronic device from the supply of electronic devices; iii) a plurality of delivery devices, each delivery device being for delivering a substrate for bonding the electronic devices thereto; and iv) a plurality of transfer devices, each transfer device having a rotary transfer arm operable to transfer the electronic devices from the supply of electronic devices at one or more pick locations to a respective one of the substrates for bonding thereto, upon the electronic devices being ejected by the ejecting device from the supply of electronic devices at the one or more pick locations. A method of bonding electronic devices to substrates is also disclosed.

摘要翻译： 公开了一种接合装置，包括：i）用于支撑电子设备供应的支撑装置; ii）用于从电子设备的供应中弹出电子设备的排出装置; iii）多个输送装置，每个输送装置用于输送用于将电子装置粘合的基板; 以及iv）多个传送装置，每个传送装置具有旋转传送臂，所述旋转传送臂可操作以将电子设备从一个或多个拾取位置处的电子设备的供应传送到相应的一个基板，以将其粘合到电子设备 由喷射装置从在一个或多个拾取位置处的电子装置的供应中弹出。 还公开了将电子器件接合到衬底的方法。

公开(公告)号：US20140160492A1

公开(公告)日：2014-06-12

申请号：US13706418

申请日：2012-12-06

申请人： Kui Kam LAM ,  Yen Hsi TANG ,  Wenling CHAN ,  Shun Ming FUNG

发明人： Kui Kam LAM ,  Yen Hsi TANG ,  Wenling CHAN ,  Shun Ming FUNG

IPC分类号： G01B11/14

CPC分类号： G01B11/14 ,  G01B11/002 ,  G01B2210/52 ,  H01L21/681

摘要： Disclosed is an optical apparatus for locating a plurality of placement positions on a carrier object. The optical apparatus comprises: i) an imaging device having a plurality of imaging sensors, each imaging sensor being operative to capture an image of a part of a selected row of placement positions on the carrier object and the plurality of imaging sensors defining a combined field of view that includes all the selected row of placement positions; ii) a positioning device coupled to the imaging device, the positioning device being operative to position the imaging device relative to successive rows of placement positions on the carrier object; and iii) a processor connected to the imaging device and which is configured to receive the images captured by the plurality of imaging sensors for image processing in order to identify exact locations of the placement positions comprised in the selected row of placement positions. A method of locating a plurality of placement positions on a carrier object is also disclosed.

摘要翻译： 公开了一种用于在载体物体上定位多个放置位置的光学装置。 光学装置包括：i）具有多个成像传感器的成像装置，每个成像传感器可操作以捕获载体对象上所选择的一排放置位置的一部分的图像，并且所述多个成像传感器限定组合场 包括所有选定的展示位置行; ii）耦合到所述成像装置的定位装置，所述定位装置可操作以相对于所述载体对象上的连续的放置位置排定位所述成像装置; 以及iii）连接到所述成像装置并且被配置为接收由所述多个成像传感器捕获的图像以进行图像处理的处理器，以便识别包括在所选择的放置位置行中的所述放置位置的确切位置。 还公开了一种在载体物体上定位多个放置位置的方法。

公开(公告)号：US20130178002A1

公开(公告)日：2013-07-11

申请号：US13347388

申请日：2012-01-10

申请人： Kui Kam LAM ,  Ka Yee MAK ,  Yiu Yan WONG ,  Ming LI

发明人： Kui Kam LAM ,  Ka Yee MAK ,  Yiu Yan WONG ,  Ming LI

IPC分类号： H01L33/50 ,  B05C9/14

CPC分类号： H01L33/50 ,  H01L2224/48091 ,  H01L2924/15311 ,  H01L2933/0041 ,  H01L2924/00014

摘要： Method and apparatus for fabricating a light-emitting diode package Disclosed is a method of fabricating a light-emitting diode package, which comprises a light-emitting chip operative to emit light of a first wavelength range. The method comprises the steps of: dispensing a photoluminescent mixture on the light-emitting chip, the photoluminescent mixture being capable of absorbing a portion of light of the first wavelength range emitted from the light-emitting chip to re-emit light of a second wavelength range; partially curing the photoluminescent mixture by heating the photoluminescent mixture to a pre-curing temperature and then cooling the photoluminescent mixture to below the pre-curing temperature; and fully curing the photoluminescent mixture to harden the photoluminescent mixture. An apparatus for fabricating a light-emitting diode package is also disclosed.

摘要翻译： 用于制造发光二极管封装的方法和装置公开了一种制造发光二极管封装的方法，其包括可发射第一波长范围的光的发光芯片。 该方法包括以下步骤：在发光芯片上分配光致发光混合物，所述光致发光混合物能够吸收从发光芯片发射的第一波长范围的一部分光，以重新发射第二波长的光 范围; 通过将光致发光混合物加热至预固化温度，然后将光致发光混合物冷却至预固化温度以下来部分固化光致发光混合物; 并充分固化光致发光混合物以硬化光致发光混合物。 还公开了一种用于制造发光二极管封装的装置。

公开(公告)号：US20120301251A1

公开(公告)日：2012-11-29

申请号：US13115261

申请日：2011-05-25

申请人： Kui Kam LAM ,  Yen Hsi Tang ,  Wai Yuen Cheung ,  Wing Kin Lam

发明人： Kui Kam LAM ,  Yen Hsi Tang ,  Wai Yuen Cheung ,  Wing Kin Lam

IPC分类号： H01L21/67

CPC分类号： H01L21/67144 ,  H01L24/75 ,  Y10T29/515 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183

摘要： An apparatus 200 for delivering semiconductor components 212 to a substrate 206a; 206b; 500a; 500b; 500c during semiconductor package manufacturing is disclosed. The apparatus 200 comprises a platform 216 and a plurality of delivery modules 202a, 202b affixed to the platform 216. Each of the plurality of delivery modules 202a, 202b has a support device 204a; 204b for supporting the substrate 206a; 206b; 500a; 500b; 500c, as well as a delivery device 208a; 208b for delivering the semiconductor components 212 to the substrate 206a; 206b; 500a; 500b; 500c. In particular, heights of the support devices 204a, 204 are mutually levelled for conveying the substrate 206a; 206b; 500a; 500b; 500c between the plurality of delivery modules 202a, 202b.

摘要翻译： 用于将半导体部件212输送到基板206a的装置200; 206b; 500a; 500b; 公开了半导体封装制造期间的500c。 装置200包括平台216和固定到平台216的多个传送模块202a，202b。多个传送模块202a，202b中的每一个具有支撑装置204a; 204b，用于支撑基板206a; 206b; 500a; 500b; 500c，以及输送装置208a; 208b，用于将半导体部件212传送到基板206a; 206b; 500a; 500b; 500c。 特别地，支撑装置204a，204的高度相互平齐以输送基板206a; 206b; 500a; 500b; 500c在多个传送模块202a，202b之间。

公开(公告)号：US20120094440A1

公开(公告)日：2012-04-19

申请号：US12905413

申请日：2010-10-15

申请人： Kwok Kee CHUNG ,  Kui Kam LAM ,  Yen Hsi TANG ,  Kwok Kiu CHAN

发明人： Kwok Kee CHUNG ,  Kui Kam LAM ,  Yen Hsi TANG ,  Kwok Kiu CHAN

IPC分类号： H01L21/50

CPC分类号： H01L24/83 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/2731 ,  H01L2224/2919 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/00

摘要： A method of bonding semiconductor dice onto a substrate first uses an optical assembly to perform pattern recognition of a die bonding section of the substrate in which multiple die pads are located so as to identify positions of the multiple die pads simultaneously during such pattern recognition step. After pattern recognition of the said die bonding section, an adhesive is dispensed with an adhesive dispenser onto at least one of the die pads located in the die bonding section. While the adhesive dispenser is dispensing the adhesive to further die pads located in the die bonding section, a pick-and-place arm concurrently bonds a die onto each die pad where the adhesive has already been dispensed.

摘要翻译： 将半导体晶片接合到基板上的方法首先使用光学组件来执行其中存在多个管芯焊盘的衬底的管芯接合部分的图案识别，以便在这种图案识别步骤期间同时识别多个管芯焊盘的位置。 在所述芯片接合部分的图案识别之后，将粘合剂分配到位于芯片接合部分中的至少一个芯片焊盘上。 当粘合剂分配器将粘合剂分配到位于管芯接合部分中的另外的管芯焊盘时，拾取和放置臂同时将管芯粘合到已经分配粘合剂的每个管芯焊盘上。