公开(公告)号：US20150072473A1

公开(公告)日：2015-03-12

申请号：US14141767

申请日：2013-12-27

申请人： Kui Kam LAM ,  Pingliang TU ,  Zhao YANG ,  Jun QI ,  Chun Hung Samuel IP

发明人： Kui Kam LAM ,  Pingliang TU ,  Zhao YANG ,  Jun QI ,  Chun Hung Samuel IP

IPC分类号： H01L23/00 ,  B23K3/08 ,  B23K3/06

CPC分类号： B23K3/082 ,  B23K1/0016 ,  B23K1/206 ,  B23K3/063 ,  B23K3/08 ,  B23K2101/42 ,  H01L24/742 ,  H01L24/75 ,  H01L24/83 ,  H01L2021/60052 ,  H01L2224/2733 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/7501 ,  H01L2224/7565 ,  H01L2224/7801 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2924/00014 ,  H01L2924/014

摘要： A die attachment apparatus for attaching a semiconductor die onto a substrate having a metallic surface comprises a material dispensing station for dispensing a bonding material onto the substrate and a die attachment station for placing the semiconductor die onto the bonding material which has been dispensed onto the substrate. An activating gas generator positioned before the die attachment station introduces activated forming gas onto the substrate in order to reduce oxides on the substrate.

摘要翻译： 用于将半导体管芯附着在具有金属表面的基板上的管芯附接装置包括用于将粘合材料分配到基板上的材料分配站和用于将半导体管芯放置在已分配到基板上的接合材料上的管芯附着站 。 定位在管芯附着工位之前的激活气体发生器将激活的成形气体引入到衬底上，以便减少衬底上的氧化物。

公开(公告)号：US08012866B2

公开(公告)日：2011-09-06

申请号：US12130386

申请日：2008-05-30

申请人： Ping Liang Tu ,  Chun Hung Samuel Ip

发明人： Ping Liang Tu ,  Chun Hung Samuel Ip

IPC分类号： H01L21/44

CPC分类号： H05K3/3478 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/32 ,  H01L24/27 ,  H01L24/75 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/2919 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2924/00011 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/3025 ,  H01L2933/0066 ,  H05K3/3494 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/082 ,  H05K2203/086 ,  H05K2203/1581 ,  H01L2924/00 ,  H01L2224/83205

摘要： A method for bonding a semiconductor device onto a substrate is provided which comprises the steps of picking up a solder ball with a pick head, placing the solder ball onto the substrate and melting the solder ball on the substrate and placing the semiconductor device on the molten solder ball. The molten solder ball is then allowed to cool to form a solder joint which bonds the semiconductor device to the substrate.

摘要翻译： 提供了将半导体器件接合到衬底上的方法，其包括以下步骤：用拾取头拾取焊球，将焊球放置在衬底上并熔化衬底上的焊球并将半导体器件放置在熔融 焊球 然后使熔融的焊球冷却，形成将半导体器件与衬底结合的焊点。

公开(公告)号：US20110272452A1

公开(公告)日：2011-11-10

申请号：US12773099

申请日：2010-05-04

申请人： Kui Kam Lam ,  Pingliang Tu ,  Chun Hung Samuel Ip

发明人： Kui Kam Lam ,  Pingliang Tu ,  Chun Hung Samuel Ip

IPC分类号： B23K31/02

CPC分类号： B23K1/20 ,  B23K1/0016 ,  B23K3/063 ,  B23K2101/40 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00

摘要： An apparatus for dispensing solder onto a substrate for mounting a semiconductor chip on the substrate comprises a dispensing body and first and second dispensing channels extending through the dispensing body. Each dispensing channel is operative to receive a separate solder wire to feed the solder wire to an end of the dispensing body facing the substrate. The dispensing channels are further operative to introduce the solder wires in a solid state simultaneously from the end of the dispensing body to be melted upon contact with the substrate which is heated.

摘要翻译： 用于将衬底分配到衬底上用于将半导体芯片安装在衬底上的装置包括分配本体和延伸穿过分配本体的第一和第二分配通道。 每个分配通道可操作以接收单独的焊丝，以将焊丝馈送到面向衬底的分配主体的端部。 分配通道还可操作以从固化状态将焊丝从分配体的端部引入，以在与加热的基底接触时熔化。

公开(公告)号：US20090145950A1

公开(公告)日：2009-06-11

申请号：US11952296

申请日：2007-12-07

申请人： Kui Kam LAM ,  Chun Hung Samuel Ip

发明人： Kui Kam LAM ,  Chun Hung Samuel Ip

IPC分类号： B23K1/20 ,  B23K3/06

CPC分类号： B23K1/0016 ,  B23K3/063 ,  B23K2101/40 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00

摘要： A method for mounting a semiconductor chip onto a substrate comprises the steps of positioning a solder dispenser over the substrate and passing a length of solder wire through the solder dispenser to the substrate. The feeding of the wire to the substrate in a feeding direction is controlled with a wire feeder. The solder dispenser is moved relative to the substrate with a positioning device along at least one of two orthogonal axes that are substantially perpendicular to the feeding direction contemporaneously with feeding the solder wire to the surface of the substrate to dispense a line of molten solder onto the substrate. The semiconductor chip is then mounted onto the molten solder that has been dispensed onto the substrate.

摘要翻译： 将半导体芯片安装到衬底上的方法包括以下步骤：将焊料分配器定位在衬底上并将一定长度的焊丝通过焊料分配器传送到衬底。 在送丝方向上将丝线馈送到基片上用送丝机进行控制。 焊料分配器相对于基板移动，其中定位装置沿着两个正交轴线中的至少一个垂直于馈送方向，同时将焊丝馈送到基板的表面，以将熔融焊料线分配到 基质。 然后将半导体芯片安装到已经分配到基板上的熔融焊料上。

公开(公告)号：US10399170B2

公开(公告)日：2019-09-03

申请号：US14141767

申请日：2013-12-27

申请人： Kui Kam Lam ,  Pingliang Tu ,  Zhao Yang ,  Jun Qi ,  Chun Hung Samuel Ip

发明人： Kui Kam Lam ,  Pingliang Tu ,  Zhao Yang ,  Jun Qi ,  Chun Hung Samuel Ip

IPC分类号： B23K3/08 ,  B23K1/00 ,  B23K1/20 ,  B23K3/06 ,  H01L23/00 ,  H01L21/60 ,  B23K101/42

摘要： A die attachment apparatus for attaching a semiconductor die onto a substrate having a metallic surface comprises a material dispensing station for dispensing a bonding material onto the substrate and a die attachment station for placing the semiconductor die onto the bonding material which has been dispensed onto the substrate. An activating gas generator positioned before the die attachment station introduces activated forming gas onto the substrate in order to reduce oxides on the substrate.

公开(公告)号：US20130119113A1

公开(公告)日：2013-05-16

申请号：US13738716

申请日：2013-01-10

申请人： Kui Kam LAM ,  Pingliang TU ,  Chun Hung Samuel IP

发明人： Kui Kam LAM ,  Pingliang TU ,  Chun Hung Samuel IP

IPC分类号： B23K1/20

CPC分类号： B23K1/20 ,  B23K1/0016 ,  B23K3/063 ,  B23K2101/40 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00

摘要： An apparatus for dispensing solder onto a substrate for mounting a semiconductor chip on the substrate comprises a dispensing body and first and second dispensing channels extending through the dispensing body. Each dispensing channel is operative to receive a separate solder wire to feed the solder wire to an end of the dispensing body facing the substrate. The dispensing channels are further operative to introduce the solder wires in a solid state simultaneously from the end of the dispensing body to be melted upon contact with the substrate which is heated.

摘要翻译： 用于将衬底分配到衬底上用于将半导体芯片安装在衬底上的装置包括分配本体和延伸穿过分配本体的第一和第二分配通道。 每个分配通道可操作以接收单独的焊丝，以将焊丝馈送到面向衬底的分配主体的端部。 分配通道还可操作以从固化状态将焊丝从分配体的端部引入，以在与加热的基底接触时熔化。

公开(公告)号：US20090298278A1

公开(公告)日：2009-12-03

申请号：US12130386

申请日：2008-05-30

申请人： Ping Liang TU ,  Chun Hung Samuel IP

发明人： Ping Liang TU ,  Chun Hung Samuel IP

IPC分类号： H01L21/44

CPC分类号： H05K3/3478 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/32 ,  H01L24/27 ,  H01L24/75 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/2919 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2924/00011 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/3025 ,  H01L2933/0066 ,  H05K3/3494 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/082 ,  H05K2203/086 ,  H05K2203/1581 ,  H01L2924/00 ,  H01L2224/83205

摘要： A method for bonding a semiconductor device onto a substrate is provided which comprises the steps of picking up a solder ball with a pick head, placing the solder ball onto the substrate and melting the solder ball on the substrate and placing the semiconductor device on the molten solder ball. The molten solder ball is then allowed to cool to form a solder joint which bonds the semiconductor device to the substrate.

摘要翻译： 提供了将半导体器件接合到衬底上的方法，其包括以下步骤：用拾取头拾取焊球，将焊球放置在衬底上并熔化衬底上的焊球并将半导体器件放置在熔融 焊球 然后使熔融的焊球冷却，形成将半导体器件与衬底结合的焊点。

公开(公告)号：US07735715B2

公开(公告)日：2010-06-15

申请号：US11952296

申请日：2007-12-07

申请人： Kui Kam Lam ,  Chun Hung Samuel Ip

发明人： Kui Kam Lam ,  Chun Hung Samuel Ip

IPC分类号： B23K31/02

CPC分类号： B23K1/0016 ,  B23K3/063 ,  B23K2101/40 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00

摘要： A method for mounting a semiconductor chip onto a substrate comprises the steps of positioning a solder dispenser over the substrate and passing a length of solder wire through the solder dispenser to the substrate. The feeding of the wire to the substrate in a feeding direction is controlled with a wire feeder. The solder dispenser is moved relative to the substrate with a positioning device along at least one of two orthogonal axes that are substantially perpendicular to the feeding direction contemporaneously with feeding the solder wire to the surface of the substrate to dispense a line of molten solder onto the substrate. The semiconductor chip is then mounted onto the molten solder that has been dispensed onto the substrate.

摘要翻译： 将半导体芯片安装到衬底上的方法包括以下步骤：将焊料分配器定位在衬底上并将一定长度的焊丝通过焊料分配器传送到衬底。 在送丝方向上将丝线馈送到基片上用送丝机进行控制。 焊料分配器相对于基板移动，其中定位装置沿着两个正交轴线中的至少一个垂直于馈送方向，同时将焊丝馈送到基板的表面，以将熔融焊料线分配到 基质。 然后将半导体芯片安装到已经分配到基板上的熔融焊料上。