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    Surface characteristic analysis
    1.
    发明授权
    Surface characteristic analysis 有权
    表面特性分析

    公开(公告)号：US07554654B2

    公开(公告)日：2009-06-30

    申请号：US11627677

    申请日：2007-01-26

    Applicant: Steven W. Meeks ,  Romain Sappey ,  Tom Carr

    Inventor： Steven W. Meeks ,  Romain Sappey ,  Tom Carr

    IPC: G01N21/00

    CPC classification number: G01B11/306 ,  G01N21/9501 ,  G01N21/9503

    Abstract: In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a scatterometer to identify at least one defect region on the surface and a surface profile height measuring tool to measure one or more characteristics of the surface in the defect region with a surface profile height measuring tool.

    Abstract translation: 在一个实施例中，使用单个工具测量晶片表面和晶片边缘上的缺陷的系统包括用于识别表面上的至少一个缺陷区域的散射仪和用于测量一个或多个 具有表面轮廓高度测量工具的缺陷区域中的表面特征。

    Measuring the shape and thickness variation of a wafer with high slopes
    2.
    发明授权
    Measuring the shape and thickness variation of a wafer with high slopes 有权
    测量具有高斜率的晶圆的形状和厚度变化

    公开(公告)号：US07847954B2

    公开(公告)日：2010-12-07

    申请号：US12121250

    申请日：2008-05-15

    Applicant: Shouhong Tang ,  Romain Sappey

    Inventor： Shouhong Tang ,  Romain Sappey

    IPC: G01B11/02

    CPC classification number: G01B11/2441 ,  G01B9/02021 ,  G01B9/02028 ,  G01B11/06 ,  G01B11/30 ,  G01B2290/45

    Abstract: A system with two unequal path interferometers, with a first flat, a second flat, and a cavity between the first and second flats, a holder to receive an object in the cavity such that an optical path remains open between the first and second flats, and a motor coupled to the holder such that the object may be tilted in the cavity to allow for measurements of, and a radiation assembly to direct collimated radiation to the interferometer assembly, a collecting assembly to collect radiation received from the interferometer assembly, and a controller comprising logic to; vary a wavelength of the radiation, record interferograms, extract phases of the interferograms to produce phase maps, determine from each map areas with high slopes, tilt the holder to allow measurement of the high slope areas, and process measurement that covers the entire surface of the object.

    Abstract translation: 一种具有两个不等径干涉仪的系统，具有第一平面，第二平面和在第一和第二平面之间的空腔，保持器，用于接收空腔中的物体，使得光路在第一和第二平面之间保持打开， 以及电动机，其联接到所述保持器，使得所述物体可以在所述空腔中倾斜以允许对所述干涉仪组件进行测量和辐射组件以将准直辐射引导到所述干涉仪组件，收集组件以收集从所述干涉仪组件接收的辐射，以及 控制器包括逻辑; 改变辐射的波长，记录干涉图，提取干涉图的相位以产生相位图，从每个具有高斜率的地图区域确定，倾斜支架以允许测量高斜率区域，并且覆盖整个表面的过程测量 物体。

    MEASURING THE SHAPE AND THICKNESS VARIATION OF A WAFER WITH HIGH SLOPES
    3.
    发明申请
    MEASURING THE SHAPE AND THICKNESS VARIATION OF A WAFER WITH HIGH SLOPES 有权
    测量具有高坡度的波形的形状和厚度变化

    公开(公告)号：US20090284734A1

    公开(公告)日：2009-11-19

    申请号：US12121250

    申请日：2008-05-15

    Applicant: Shouhong Tang ,  Romain Sappey

    Inventor： Shouhong Tang ,  Romain Sappey

    IPC: G01N21/00

    CPC classification number: G01B11/2441 ,  G01B9/02021 ,  G01B9/02028 ,  G01B11/06 ,  G01B11/30 ,  G01B2290/45

    Abstract: In one embodiment, an interferometer system comprises two unequal path interferometers assemble comprising; a first reference flat having a first length L1 in a first dimension, a second reference flat having a second length L2 in the first dimension, a cavity D1 defined by a distance between the first reference flat and the second reference flat, a wafer holder to receive an object in the cavity such that an optical path remains open at an outer annual area between the first reference flat and the second reference flat and at least one wafer holder motor coupled to the wafer holder such that an object may be tilted in the cavity as to allow for measurements of local areas of interest, and a radiation targeting assembly to direct a collimated radiation beam to the interferometer assembly, a radiation collecting assembly to collect radiation received from the interferometer assembly, and a controller comprising logic to; vary a wavelength of the collimated radiation beam, record interferograms formed by a plurality of surfaces, extract phases of each of the interferograms for each of the plurality of surfaces to produce multiple phase maps, determine each map from its corresponding interferogram, determine from each map local areas of interest with high slopes, tilt the wafer holder to allow measurement of the high slope areas of interest, and process measurement that covers the entire surface of an object including high slope areas.

    Abstract translation: 在一个实施例中，干涉仪系统包括两个不等路径干涉仪组装，包括： 具有第一尺寸的第一长度L1的第一参考平面，具有第一尺寸的第二长度L2的第二参考平面，由第一参考平面和第二参考平面之间的距离限定的空腔D1，晶片保持器 在腔中接收物体，使得光路在第一参考平面和第二参考平面之间的外部年度区域保持打开，以及耦合到晶片保持器的至少一个晶片保持器电机，使得物体可以在空腔中倾斜 以便允许对感兴趣的局部区域进行测量，以及辐射瞄准组件将准直辐射束引导到干涉仪组件，用于收集从干涉仪组件接收的辐射的辐射收集组件，以及包括逻辑的控制器; 改变准直辐射束的波长，记录由多个表面形成的干涉图，提取多个表面中的每个表面的每个干涉图的相位以产生多个相位图，从其相应的干涉图确定每个地图，从每个地图确定 局部感兴趣的区域具有高斜坡，倾斜晶片架以允许测量感兴趣的高坡度区域，以及覆盖包括高坡度区域的物体的整个表面的过程测量。

    Dynamic reference plane compensation
    4.
    发明授权
    Dynamic reference plane compensation 有权
    动态参考平面补偿

    公开(公告)号：US07505143B2

    公开(公告)日：2009-03-17

    申请号：US11130830

    申请日：2005-05-17

    Applicant: Harald F. Hess ,  Thomas Daniel Carr ,  Romain Sappey

    Inventor： Harald F. Hess ,  Thomas Daniel Carr ,  Romain Sappey

    IPC: G01B11/02

    CPC classification number: G01B9/0207 ,  G11B5/6052

    Abstract: In one embodiment, a method of dynamic reference plane compensation, comprises impinging radiation from a first radiation source onto a surface of an object; generating an uncompensated measurement signal from radiation reflected from a first location on the surface and a second location; generating a compensation signal from radiation reflected from a third location and a fourth location on the surface; and generating a compensated measurement signal using the uncompensated measurement signal and the compensation signal.

    Abstract translation: 在一个实施例中，动态参考平面补偿的方法包括将来自第一辐射源的辐射照射到物体的表面上; 从表面上的第一位置反射的辐射和第二位置产生未补偿的测量信号; 从表面上的第三位置和第四位置反射的辐射产生补偿信号; 以及使用所述未补偿的测量信号和所述补偿信号产生补偿的测量信号。

    Dynamic reference plane compensation
    5.
    发明申请
    Dynamic reference plane compensation 有权

    公开(公告)号：US20060262291A1

    公开(公告)日：2006-11-23

    申请号：US11130830

    申请日：2005-05-17

    Applicant: Harald Hess ,  Thomas Carr ,  Romain Sappey

    Inventor： Harald Hess ,  Thomas Carr ,  Romain Sappey

    IPC: G01C3/20

    CPC classification number: G01B9/0207 ,  G11B5/6052

    Abstract: In one embodiment, a method of dynamic reference plane compensation, comprises impinging radiation from a first radiation source onto a surface of an object; generating an uncompensated measurement signal from radiation reflected from a first location on the surface and a second location; generating a compensation signal from radiation reflected from a third location and a fourth location on the surface; and generating a compensated measurement signal using the uncompensated measurement signal and the compensation signal.

    SURFACE CHARACTERISTIC ANALYSIS
    7.
    发明申请
    SURFACE CHARACTERISTIC ANALYSIS 有权
    表面特征分析

    公开(公告)号：US20080180656A1

    公开(公告)日：2008-07-31

    申请号：US11627677

    申请日：2007-01-26

    Applicant: Steven W. Meeks ,  ROMAIN SAPPEY ,  TOM CARR

    Inventor： Steven W. Meeks ,  ROMAIN SAPPEY ,  TOM CARR

    IPC: G01B11/30

    CPC classification number: G01B11/306 ,  G01N21/9501 ,  G01N21/9503

    Abstract: In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a scatterometer to identify at least one defect region on the surface and a surface profile height measuring tool to measure one or more characteristics of the surface in the defect region with a surface profile height measuring tool.

    Abstract translation: 在一个实施例中，使用单个工具测量晶片表面和晶片边缘上的缺陷的系统包括用于识别表面上的至少一个缺陷区域的散射仪和用于测量一个或多个 具有表面轮廓高度测量工具的缺陷区域中的表面特征。

    Interferometry measurement in disturbed environments
    8.
    发明申请
    Interferometry measurement in disturbed environments 审中-公开
    扰动环境中的干涉测量

    公开(公告)号：US20060256345A1

    公开(公告)日：2006-11-16

    申请号：US11127428

    申请日：2005-05-12

    Applicant: Romain Sappey

    Inventor： Romain Sappey

    IPC: G01B11/02

    CPC classification number: G01B9/02052 ,  G11B5/6052

    Abstract: In embodiments, techniques for interferometry measurements in disturbed environments are described. The disturbed environment may include one or more variations such as pressure variations and/or thermal variations. In one embodiment, a difference between an optical path of a first beam and an optical path of a second beam is detected. One or more of the first or second beams may be encased in a shroud proximate to the disturbed environment. The method may further couple a window to the shroud in proximity to the disturbed environment, e.g., to reduce the negative effects of the disturbed environment.

    Abstract translation: 在实施例中，描述了用于干扰环境中的干涉测量的技术。 扰动的环境可以包括一个或多个变化，例如压力变化和/或热变化。 在一个实施例中，检测第一光束的光路和第二光束的光路之间的差异。 第一或第二梁中的一个或多个可以被封装在靠近受扰环境的护罩中。 该方法还可以将窗口耦合到靠近受干扰环境的护罩，例如以减少受扰环境的负面影响。

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