公开(公告)号：US07548071B2

公开(公告)日：2009-06-16

申请号：US11700728

申请日：2007-01-30

申请人： Reid Harrison ,  Cynthia Furse ,  Chirag Sharma

发明人： Reid Harrison ,  Cynthia Furse ,  Chirag Sharma

IPC分类号： G01R31/11 ,  G01R27/28 ,  G01R23/16

CPC分类号： G01R31/088 ,  G01R31/008 ,  G01R31/11

摘要： A technique for reflectometry testing of a signal path is disclosed. The technique includes injecting a test signal based on a probe pseudo-noise sequence into the signal path and obtaining a response signal. A sliding reference pseudo-noise sequence is correlated against the response signal. Both the probe sequence and the reference sequence are generated at a chip rate. The correlation is obtained for integer chip time delays, and sub-chip resolution of a peak correlation delay is estimated from at least two samples of the correlation.

摘要翻译： 公开了一种用于信号路径的反射测试的技术。 该技术包括将基于探测伪噪声序列的测试信号注入信号路径并获得响应信号。 滑动参考伪噪声序列与响应信号相关。 探针序列和参考序列都以码片速率产生。 对于整数码片时间延迟获得相关性，并且从相关性的至少两个样本估计峰值相关延迟的子码片分辨率。

公开(公告)号：US07388288B2

公开(公告)日：2008-06-17

申请号：US11607273

申请日：2006-12-01

申请人： Florian Solzbacher ,  Reid Harrison ,  Richard A. Normann ,  Hans-Hermann Oppermann ,  Lothar Dietrich ,  Matthias Klein ,  Michael Töpper

发明人： Florian Solzbacher ,  Reid Harrison ,  Richard A. Normann ,  Hans-Hermann Oppermann ,  Lothar Dietrich ,  Matthias Klein ,  Michael Töpper

IPC分类号： H01L23/52

CPC分类号： H01L24/11 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05552 ,  H01L2224/05567 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/00012 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2924/013

摘要： Interconnect metallization schemes and devices for flip chip bonding are disclosed and described. Metallization schemes include an adhesion layer, a diffusion barrier layer, a wetable layer, and a wetting stop layer. Various thicknesses and materials for use in the different layers are disclosed and are particularly useful for metallization in implantable electronic devices such as neural electrode arrays.

摘要翻译： 互连金属化方案和用于倒装芯片接合的器件被公开和描述。 金属化方案包括粘合层，扩散阻挡层，可润湿层和润湿阻挡层。 公开了用于不同层的各种厚度和材料，并且对于诸如神经电极阵列的可植入电子器件中的金属化特别有用。

公开(公告)号：US20080096379A1

公开(公告)日：2008-04-24

申请号：US11607273

申请日：2006-12-01

申请人： Florian Solzbacher ,  Reid Harrison ,  Richard Normann

发明人： Florian Solzbacher ,  Reid Harrison ,  Richard Normann

IPC分类号： H01L21/4763

CPC分类号： H01L24/11 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05552 ,  H01L2224/05567 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/00012 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2924/013

摘要： Interconnect metallization schemes and devices for flip chip bonding are disclosed and described. Metallization schemes include an adhesion layer, a diffusion barrier layer, a wettable layer, and a wetting stop layer. Various thicknesses and materials for use in the different layers are disclosed and are particularly useful for metallization in implantable electronic devices such as neural electrode arrays.

摘要翻译： 互连金属化方案和用于倒装芯片接合的器件被公开和描述。 金属化方案包括粘合层，扩散阻挡层，可湿性层和润湿阻挡层。 公开了用于不同层的各种厚度和材料，并且对于诸如神经电极阵列的可植入电子器件中的金属化特别有用。

公开(公告)号：US20070194796A1

公开(公告)日：2007-08-23

申请号：US11700728

申请日：2007-01-30

申请人： Reid Harrison ,  Cynthia Furse ,  Chirag Sharma

发明人： Reid Harrison ,  Cynthia Furse ,  Chirag Sharma

IPC分类号： G01R31/11

CPC分类号： G01R31/088 ,  G01R31/008 ,  G01R31/11

摘要： A technique for reflectometry testing of a signal path is disclosed. The technique includes injecting a test signal based on a probe pseudo-noise sequence into the signal path and obtaining a response signal. A sliding reference pseudo-noise sequence is correlated against the response signal. Both the probe sequence and the reference sequence are generated at a chip rate. The correlation is obtained for integer chip time delays, and sub-chip resolution of a peak correlation delay is estimated from at least two samples of the correlation.

摘要翻译： 公开了一种用于信号路径的反射测试的技术。 该技术包括将基于探测伪噪声序列的测试信号注入信号路径并获得响应信号。 滑动参考伪噪声序列与响应信号相关。 探针序列和参考序列都以码片速率产生。 对于整数码片时间延迟获得相关性，并且从相关性的至少两个样本估计峰值相关延迟的子码片分辨率。

公开(公告)号：US20080021525A1

公开(公告)日：2008-01-24

申请号：US11880103

申请日：2007-07-17

申请人： Florian Solzbacher ,  Reid Harrison ,  Richard Normann ,  Sohee Kim

发明人： Florian Solzbacher ,  Reid Harrison ,  Richard Normann ,  Sohee Kim

IPC分类号： A61N1/02 ,  B05D5/00 ,  G03C5/00

CPC分类号： A61N2/02 ,  A61N1/40

摘要： An in-vivo implantable coil assembly includes a planar coil having at least one coil layer formed from conductive traces disposed in or on a polymer matrix. A ferrite platelet is bonded to a surface of the polymer matrix. Methods of making and using the in-vivo implantable coil assembly are also disclosed.

摘要翻译： 体内可植入线圈组件包括具有至少一个线圈层的平面线圈，该线圈层由设置在聚合物基体中或其上的导电迹线形成。 铁氧体血小板结合到聚合物基质的表面。 还公开了制造和使用体内可植入线圈组件的方法。