公开(公告)号：US20090301889A1

公开(公告)日：2009-12-10

申请号：US12295513

申请日：2007-03-30

申请人： Bert Reents ,  Bernd Roelfs ,  Tafadzwa Magaya ,  Markus Youkhanis ,  Rene Wenzel ,  Soungsoo Kim

发明人： Bert Reents ,  Bernd Roelfs ,  Tafadzwa Magaya ,  Markus Youkhanis ,  Rene Wenzel ,  Soungsoo Kim

IPC分类号： C25D5/00 ,  C25D5/10

CPC分类号： H05K3/423 ,  C25D3/38 ,  C25D5/18 ,  H05K2201/09563 ,  H05K2203/1476 ,  H05K2203/1492

摘要： Disclosed is an electroplating method for filling cavities, through holes, blind holes, or micro blind holes of a work piece with metals. According to said method, the work piece containing cavities, through holes, blind holes, or micro blind holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the work piece and at least one anode such that a current flow is fed to the work piece. The invention method is characterized in that the electrolyte encompasses a redox system.

摘要翻译： 公开了一种用金属填充工件的空腔，通孔，盲孔或微盲孔的电镀方法。 根据所述方法，将包含空腔，通孔，盲孔或微盲孔的工件与金属沉积电解质接触，并且在工件和至少一个阳极之间施加电压，使得电流 被送入工件。 本发明的方法的特征在于电解质包含氧化还原体系。

公开(公告)号：US09445510B2

公开(公告)日：2016-09-13

申请号：US11661704

申请日：2005-08-30

申请人： Bert Reents ,  Thomas Pliet ,  Bernd Roelfs ,  Toshiya Fujiwara ,  Rene Wenzel ,  Markus Youkhanis ,  Soungsoo Kim

发明人： Bert Reents ,  Thomas Pliet ,  Bernd Roelfs ,  Toshiya Fujiwara ,  Rene Wenzel ,  Markus Youkhanis ,  Soungsoo Kim

IPC分类号： C25D5/18 ,  C25D3/38 ,  C25D21/12 ,  H05K3/42 ,  C25D7/12

CPC分类号： H05K3/423 ,  C25D3/38 ,  C25D5/18 ,  C25D7/12 ,  C25D21/12 ,  H05K1/115 ,  H05K3/427 ,  H05K2201/09563 ,  H05K2203/1476 ,  H05K2203/1492

摘要： The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper. The process comprises the following steps: (i) formation of a narrow part in the center of a through-hole by electroplating; and (ii) filling the through-hole obtained in step (i) with metal by electroplating.

摘要翻译： 本发明涉及用金属填充通孔的电镀工艺。 该工艺特别适用于用铜填充印刷电路板的通孔。 该方法包括以下步骤：（i）通过电镀在通孔的中心形成窄部分; 和（ii）通过电镀用金属填充步骤（i）中获得的通孔。

公开(公告)号：US20090236230A1

公开(公告)日：2009-09-24

申请号：US11661704

申请日：2005-08-30

申请人： Bert Reents ,  Thomas Pliet ,  Bernd Roelfs ,  Toshiya Fujiwara ,  Rene Wenzel ,  Markus Youkhanis ,  Soungsoo Kim

发明人： Bert Reents ,  Thomas Pliet ,  Bernd Roelfs ,  Toshiya Fujiwara ,  Rene Wenzel ,  Markus Youkhanis ,  Soungsoo Kim

IPC分类号： C25D5/18

CPC分类号： H05K3/423 ,  C25D3/38 ,  C25D5/18 ,  C25D7/12 ,  C25D21/12 ,  H05K1/115 ,  H05K3/427 ,  H05K2201/09563 ,  H05K2203/1476 ,  H05K2203/1492

摘要： The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper. The process comprises the following steps: (i) formation of a narrow part in the center of a through-hole by electroplating; and (ii) filling the through-hole obtained in step (i) with metal by electroplating

摘要翻译： 本发明涉及用金属填充通孔的电镀工艺。 该工艺特别适用于用铜填充印刷电路板的通孔。 该方法包括以下步骤：（i）通过电镀在通孔的中心形成窄部分; 和（ii）通过电镀用金属填充步骤（i）中获得的通孔